JPS52155972A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS52155972A
JPS52155972A JP7360876A JP7360876A JPS52155972A JP S52155972 A JPS52155972 A JP S52155972A JP 7360876 A JP7360876 A JP 7360876A JP 7360876 A JP7360876 A JP 7360876A JP S52155972 A JPS52155972 A JP S52155972A
Authority
JP
Japan
Prior art keywords
semiconductor device
production
film
plating
damaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7360876A
Other languages
Japanese (ja)
Other versions
JPS5424819B2 (en
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7360876A priority Critical patent/JPS52155972A/en
Publication of JPS52155972A publication Critical patent/JPS52155972A/en
Publication of JPS5424819B2 publication Critical patent/JPS5424819B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To prevent the contamination and damaging of a semiconductor device by forming an acid- and alkali-resistant oxide film on the surface of a metal film serving also as a plating electrode and further to effectively utilize said film as a plating mask.
COPYRIGHT: (C)1977,JPO&Japio
JP7360876A 1976-06-21 1976-06-21 Production of semiconductor device Granted JPS52155972A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7360876A JPS52155972A (en) 1976-06-21 1976-06-21 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7360876A JPS52155972A (en) 1976-06-21 1976-06-21 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS52155972A true JPS52155972A (en) 1977-12-24
JPS5424819B2 JPS5424819B2 (en) 1979-08-23

Family

ID=13523207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7360876A Granted JPS52155972A (en) 1976-06-21 1976-06-21 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS52155972A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141942A (en) * 1981-02-27 1982-09-02 Fuji Electric Corp Res & Dev Ltd Formation of bump electrode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57141942A (en) * 1981-02-27 1982-09-02 Fuji Electric Corp Res & Dev Ltd Formation of bump electrode

Also Published As

Publication number Publication date
JPS5424819B2 (en) 1979-08-23

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