JPS52155055A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS52155055A
JPS52155055A JP7237076A JP7237076A JPS52155055A JP S52155055 A JPS52155055 A JP S52155055A JP 7237076 A JP7237076 A JP 7237076A JP 7237076 A JP7237076 A JP 7237076A JP S52155055 A JPS52155055 A JP S52155055A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
metal layer
damaging
contamination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7237076A
Other languages
Japanese (ja)
Other versions
JPS5915181B2 (en
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP51072370A priority Critical patent/JPS5915181B2/en
Publication of JPS52155055A publication Critical patent/JPS52155055A/en
Publication of JPS5915181B2 publication Critical patent/JPS5915181B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To prevent the contamination and damaging of a semiconductor substrate owing to etching solutions and the deformation of bump shape by utilizing part of a metal layer as plating electrodes and using the remained metal layer as a mask in removing the unnecessary metal film.
COPYRIGHT: (C)1977,JPO&Japio
JP51072370A 1976-06-18 1976-06-18 Manufacturing method of semiconductor device Expired JPS5915181B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51072370A JPS5915181B2 (en) 1976-06-18 1976-06-18 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51072370A JPS5915181B2 (en) 1976-06-18 1976-06-18 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS52155055A true JPS52155055A (en) 1977-12-23
JPS5915181B2 JPS5915181B2 (en) 1984-04-07

Family

ID=13487346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51072370A Expired JPS5915181B2 (en) 1976-06-18 1976-06-18 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5915181B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251528B1 (en) 1998-01-09 2001-06-26 International Business Machines Corporation Method to plate C4 to copper stud

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251528B1 (en) 1998-01-09 2001-06-26 International Business Machines Corporation Method to plate C4 to copper stud
US6297140B1 (en) 1998-01-09 2001-10-02 International Business Machines Corporation Method to plate C4 to copper stud
USRE40983E1 (en) * 1998-01-09 2009-11-17 International Business Machines Corporation Method to plate C4 to copper stud

Also Published As

Publication number Publication date
JPS5915181B2 (en) 1984-04-07

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