JPS5339873A - Etching method of silicon semiconductor substrate containing gold - Google Patents
Etching method of silicon semiconductor substrate containing goldInfo
- Publication number
- JPS5339873A JPS5339873A JP11370076A JP11370076A JPS5339873A JP S5339873 A JPS5339873 A JP S5339873A JP 11370076 A JP11370076 A JP 11370076A JP 11370076 A JP11370076 A JP 11370076A JP S5339873 A JPS5339873 A JP S5339873A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- etching method
- silicon semiconductor
- substrate containing
- containing gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Weting (AREA)
Abstract
PURPOSE: To make a flat surface by etching a wafer with a solution mainly composed of hydrofluoric acid, nitric acid and hydrochloric acid, and simultaneously etching the gold and gold-Si eutective alloy within the wafer.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11370076A JPS5339873A (en) | 1976-09-24 | 1976-09-24 | Etching method of silicon semiconductor substrate containing gold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11370076A JPS5339873A (en) | 1976-09-24 | 1976-09-24 | Etching method of silicon semiconductor substrate containing gold |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5339873A true JPS5339873A (en) | 1978-04-12 |
Family
ID=14618950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11370076A Pending JPS5339873A (en) | 1976-09-24 | 1976-09-24 | Etching method of silicon semiconductor substrate containing gold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5339873A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5986784A (en) * | 1982-11-10 | 1984-05-19 | 日立金属株式会社 | Method of connecting pipe |
JPS6228591A (en) * | 1985-07-30 | 1987-02-06 | 日本金属工業株式会社 | Method of molding steel pipe joint made of stainless steel having improved fixing sealing property |
CN115873600A (en) * | 2022-11-28 | 2023-03-31 | 武汉高芯科技有限公司 | Opening corrosive liquid and opening method for cadmium telluride/zinc sulfide double-layer passive film |
-
1976
- 1976-09-24 JP JP11370076A patent/JPS5339873A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5986784A (en) * | 1982-11-10 | 1984-05-19 | 日立金属株式会社 | Method of connecting pipe |
JPS6228591A (en) * | 1985-07-30 | 1987-02-06 | 日本金属工業株式会社 | Method of molding steel pipe joint made of stainless steel having improved fixing sealing property |
CN115873600A (en) * | 2022-11-28 | 2023-03-31 | 武汉高芯科技有限公司 | Opening corrosive liquid and opening method for cadmium telluride/zinc sulfide double-layer passive film |
CN115873600B (en) * | 2022-11-28 | 2024-05-07 | 武汉高芯科技有限公司 | Punching corrosive liquid and punching method for cadmium telluride/zinc sulfide double-layer passivation film |
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