JPS52155054A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS52155054A
JPS52155054A JP7236976A JP7236976A JPS52155054A JP S52155054 A JPS52155054 A JP S52155054A JP 7236976 A JP7236976 A JP 7236976A JP 7236976 A JP7236976 A JP 7236976A JP S52155054 A JPS52155054 A JP S52155054A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
damaging
contamination
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7236976A
Other languages
Japanese (ja)
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7236976A priority Critical patent/JPS52155054A/en
Publication of JPS52155054A publication Critical patent/JPS52155054A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE: To prevent the contamination and damaging of the circuit elements and Al wiring on a semiconductor substrate by removing the metal films for formation of metal bumps without using strong acid or strong alkali solutions.
COPYRIGHT: (C)1977,JPO&Japio
JP7236976A 1976-06-18 1976-06-18 Production of semiconductor device Pending JPS52155054A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7236976A JPS52155054A (en) 1976-06-18 1976-06-18 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7236976A JPS52155054A (en) 1976-06-18 1976-06-18 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS52155054A true JPS52155054A (en) 1977-12-23

Family

ID=13487319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7236976A Pending JPS52155054A (en) 1976-06-18 1976-06-18 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS52155054A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54162463A (en) * 1978-06-13 1979-12-24 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54162463A (en) * 1978-06-13 1979-12-24 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacture

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