JPS5373970A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS5373970A
JPS5373970A JP15011776A JP15011776A JPS5373970A JP S5373970 A JPS5373970 A JP S5373970A JP 15011776 A JP15011776 A JP 15011776A JP 15011776 A JP15011776 A JP 15011776A JP S5373970 A JPS5373970 A JP S5373970A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
printing
substrate
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15011776A
Other languages
Japanese (ja)
Inventor
Takeshi Yamamoto
Takahiko Ichimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15011776A priority Critical patent/JPS5373970A/en
Publication of JPS5373970A publication Critical patent/JPS5373970A/en
Pending legal-status Critical Current

Links

Landscapes

  • Thyristors (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE: To manufacture the device having a good reliability with high yield rate, by printing the glass film of 20 to 40μ at the center of the groove for separation formed on the substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP15011776A 1976-12-13 1976-12-13 Manufacture for semiconductor device Pending JPS5373970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15011776A JPS5373970A (en) 1976-12-13 1976-12-13 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15011776A JPS5373970A (en) 1976-12-13 1976-12-13 Manufacture for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5373970A true JPS5373970A (en) 1978-06-30

Family

ID=15489849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15011776A Pending JPS5373970A (en) 1976-12-13 1976-12-13 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5373970A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180114532A (en) 2016-07-12 2018-10-18 후루카와 덴키 고교 가부시키가이샤 Electrolytic copper foil
CN109309001A (en) * 2017-07-26 2019-02-05 天津环鑫科技发展有限公司 Method for manufacturing GPP chip by adopting printing process
CN109755117A (en) * 2017-11-01 2019-05-14 天津环鑫科技发展有限公司 Method for manufacturing FRGPP chip by adopting printing process
CN109755116A (en) * 2017-11-01 2019-05-14 天津环鑫科技发展有限公司 Method for manufacturing unidirectional TVS chip by adopting printing process

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180114532A (en) 2016-07-12 2018-10-18 후루카와 덴키 고교 가부시키가이샤 Electrolytic copper foil
CN109309001A (en) * 2017-07-26 2019-02-05 天津环鑫科技发展有限公司 Method for manufacturing GPP chip by adopting printing process
CN109309001B (en) * 2017-07-26 2022-05-03 天津环鑫科技发展有限公司 Method for manufacturing GPP chip by adopting printing process
CN109755117A (en) * 2017-11-01 2019-05-14 天津环鑫科技发展有限公司 Method for manufacturing FRGPP chip by adopting printing process
CN109755116A (en) * 2017-11-01 2019-05-14 天津环鑫科技发展有限公司 Method for manufacturing unidirectional TVS chip by adopting printing process

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