JPS5373970A - Manufacture for semiconductor device - Google Patents
Manufacture for semiconductor deviceInfo
- Publication number
- JPS5373970A JPS5373970A JP15011776A JP15011776A JPS5373970A JP S5373970 A JPS5373970 A JP S5373970A JP 15011776 A JP15011776 A JP 15011776A JP 15011776 A JP15011776 A JP 15011776A JP S5373970 A JPS5373970 A JP S5373970A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- semiconductor device
- printing
- substrate
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thyristors (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE: To manufacture the device having a good reliability with high yield rate, by printing the glass film of 20 to 40μ at the center of the groove for separation formed on the substrate.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15011776A JPS5373970A (en) | 1976-12-13 | 1976-12-13 | Manufacture for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15011776A JPS5373970A (en) | 1976-12-13 | 1976-12-13 | Manufacture for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5373970A true JPS5373970A (en) | 1978-06-30 |
Family
ID=15489849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15011776A Pending JPS5373970A (en) | 1976-12-13 | 1976-12-13 | Manufacture for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5373970A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180114532A (en) | 2016-07-12 | 2018-10-18 | 후루카와 덴키 고교 가부시키가이샤 | Electrolytic copper foil |
CN109309001A (en) * | 2017-07-26 | 2019-02-05 | 天津环鑫科技发展有限公司 | Method for manufacturing GPP chip by adopting printing process |
CN109755117A (en) * | 2017-11-01 | 2019-05-14 | 天津环鑫科技发展有限公司 | Method for manufacturing FRGPP chip by adopting printing process |
CN109755116A (en) * | 2017-11-01 | 2019-05-14 | 天津环鑫科技发展有限公司 | Method for manufacturing unidirectional TVS chip by adopting printing process |
-
1976
- 1976-12-13 JP JP15011776A patent/JPS5373970A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180114532A (en) | 2016-07-12 | 2018-10-18 | 후루카와 덴키 고교 가부시키가이샤 | Electrolytic copper foil |
CN109309001A (en) * | 2017-07-26 | 2019-02-05 | 天津环鑫科技发展有限公司 | Method for manufacturing GPP chip by adopting printing process |
CN109309001B (en) * | 2017-07-26 | 2022-05-03 | 天津环鑫科技发展有限公司 | Method for manufacturing GPP chip by adopting printing process |
CN109755117A (en) * | 2017-11-01 | 2019-05-14 | 天津环鑫科技发展有限公司 | Method for manufacturing FRGPP chip by adopting printing process |
CN109755116A (en) * | 2017-11-01 | 2019-05-14 | 天津环鑫科技发展有限公司 | Method for manufacturing unidirectional TVS chip by adopting printing process |
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