JPS5421261A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS5421261A
JPS5421261A JP8699077A JP8699077A JPS5421261A JP S5421261 A JPS5421261 A JP S5421261A JP 8699077 A JP8699077 A JP 8699077A JP 8699077 A JP8699077 A JP 8699077A JP S5421261 A JPS5421261 A JP S5421261A
Authority
JP
Japan
Prior art keywords
semiconductor device
manufacture
oxide film
scrabing
solderability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8699077A
Other languages
Japanese (ja)
Inventor
Makoto Tomita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP8699077A priority Critical patent/JPS5421261A/en
Publication of JPS5421261A publication Critical patent/JPS5421261A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To increase the reliability of semiconductor device, by fixing a semiconductor element on an oxide film, after scrabing off the oxide film produced on the solder surface molten on a metallic substrate with a thin plate having wrong solderability.
COPYRIGHT: (C)1979,JPO&Japio
JP8699077A 1977-07-19 1977-07-19 Manufacture for semiconductor device Pending JPS5421261A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8699077A JPS5421261A (en) 1977-07-19 1977-07-19 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8699077A JPS5421261A (en) 1977-07-19 1977-07-19 Manufacture for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5421261A true JPS5421261A (en) 1979-02-17

Family

ID=13902296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8699077A Pending JPS5421261A (en) 1977-07-19 1977-07-19 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5421261A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118294A (en) * 2000-04-24 2002-04-19 Nichia Chem Ind Ltd Flip chip type light-emitting diode and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037365A (en) * 1973-08-06 1975-04-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037365A (en) * 1973-08-06 1975-04-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118294A (en) * 2000-04-24 2002-04-19 Nichia Chem Ind Ltd Flip chip type light-emitting diode and manufacturing method thereof

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