JPS5264274A - Wafer soldering device for semiconductor devices - Google Patents

Wafer soldering device for semiconductor devices

Info

Publication number
JPS5264274A
JPS5264274A JP14041875A JP14041875A JPS5264274A JP S5264274 A JPS5264274 A JP S5264274A JP 14041875 A JP14041875 A JP 14041875A JP 14041875 A JP14041875 A JP 14041875A JP S5264274 A JPS5264274 A JP S5264274A
Authority
JP
Japan
Prior art keywords
semiconductor devices
soldering device
wafer soldering
wafer
variation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14041875A
Other languages
Japanese (ja)
Other versions
JPS5811098B2 (en
Inventor
Toshihiro Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14041875A priority Critical patent/JPS5811098B2/en
Publication of JPS5264274A publication Critical patent/JPS5264274A/en
Publication of JPS5811098B2 publication Critical patent/JPS5811098B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a device which forms a solder layer having a thickness free from variation on semiconductor wafers.
COPYRIGHT: (C)1977,JPO&Japio
JP14041875A 1975-11-21 1975-11-21 Hand soldering wafer soldering Expired JPS5811098B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14041875A JPS5811098B2 (en) 1975-11-21 1975-11-21 Hand soldering wafer soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14041875A JPS5811098B2 (en) 1975-11-21 1975-11-21 Hand soldering wafer soldering

Publications (2)

Publication Number Publication Date
JPS5264274A true JPS5264274A (en) 1977-05-27
JPS5811098B2 JPS5811098B2 (en) 1983-03-01

Family

ID=15268244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14041875A Expired JPS5811098B2 (en) 1975-11-21 1975-11-21 Hand soldering wafer soldering

Country Status (1)

Country Link
JP (1) JPS5811098B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61194097U (en) * 1985-05-25 1986-12-03
JPS6242698U (en) * 1985-09-02 1987-03-14

Also Published As

Publication number Publication date
JPS5811098B2 (en) 1983-03-01

Similar Documents

Publication Publication Date Title
JPS5224478A (en) Semiconductor device manufacturing process
JPS528785A (en) Semiconductor device electrode structure
JPS5228280A (en) Semiconductor device
JPS5247686A (en) Semiconductor device and process for production of same
JPS5230162A (en) Semiconductor device
JPS5264274A (en) Wafer soldering device for semiconductor devices
JPS5255871A (en) Production of semiconductor
JPS5230167A (en) Method for production of semiconductor device
JPS5235980A (en) Manufacturing method of semiconductor device
JPS5441665A (en) Manufacture for semiconductor device
JPS5242365A (en) Tool for semiconductors
JPS5279654A (en) Production of semiconductor device
JPS5311577A (en) Soldering method for wafers of semiconductor devices
JPS53123083A (en) Production of semiconductor device
JPS5316586A (en) Semiconductor device
JPS51123086A (en) Semicanductor device and its production process
JPS5275279A (en) Packaging structure for semiconductor devices
JPS5258370A (en) Semiconductor device
JPS5372567A (en) Semiconductor device
JPS5234666A (en) Semi-conductor wafer processing
JPS51117887A (en) Semiconductor ic device
JPS51122375A (en) Semiconductor device
JPS51142978A (en) Mounting method of circuit elements
JPS5242370A (en) Process for production of semiconductor device
JPS5248976A (en) Process for production of semiconductor device