JPS51142978A - Mounting method of circuit elements - Google Patents

Mounting method of circuit elements

Info

Publication number
JPS51142978A
JPS51142978A JP6717275A JP6717275A JPS51142978A JP S51142978 A JPS51142978 A JP S51142978A JP 6717275 A JP6717275 A JP 6717275A JP 6717275 A JP6717275 A JP 6717275A JP S51142978 A JPS51142978 A JP S51142978A
Authority
JP
Japan
Prior art keywords
circuit elements
mounting method
mounting
facilitate
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6717275A
Other languages
Japanese (ja)
Inventor
Katsuhiko Hirasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP6717275A priority Critical patent/JPS51142978A/en
Publication of JPS51142978A publication Critical patent/JPS51142978A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To facilitate the mounting of semiconductor elements on a supporting board.
COPYRIGHT: (C)1976,JPO&Japio
JP6717275A 1975-06-04 1975-06-04 Mounting method of circuit elements Pending JPS51142978A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6717275A JPS51142978A (en) 1975-06-04 1975-06-04 Mounting method of circuit elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6717275A JPS51142978A (en) 1975-06-04 1975-06-04 Mounting method of circuit elements

Publications (1)

Publication Number Publication Date
JPS51142978A true JPS51142978A (en) 1976-12-08

Family

ID=13337199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6717275A Pending JPS51142978A (en) 1975-06-04 1975-06-04 Mounting method of circuit elements

Country Status (1)

Country Link
JP (1) JPS51142978A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53132266A (en) * 1977-04-22 1978-11-17 Sharp Corp Production of semiconductor device
JPS5460562A (en) * 1977-10-21 1979-05-16 Mitsubishi Electric Corp Manufacture of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53132266A (en) * 1977-04-22 1978-11-17 Sharp Corp Production of semiconductor device
JPS5721853B2 (en) * 1977-04-22 1982-05-10
JPS5460562A (en) * 1977-10-21 1979-05-16 Mitsubishi Electric Corp Manufacture of semiconductor device

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