JPS51142978A - Mounting method of circuit elements - Google Patents

Mounting method of circuit elements

Info

Publication number
JPS51142978A
JPS51142978A JP6717275A JP6717275A JPS51142978A JP S51142978 A JPS51142978 A JP S51142978A JP 6717275 A JP6717275 A JP 6717275A JP 6717275 A JP6717275 A JP 6717275A JP S51142978 A JPS51142978 A JP S51142978A
Authority
JP
Japan
Prior art keywords
mounting
circuit
facilitate
semiconductor
supporting board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6717275A
Other languages
Japanese (ja)
Inventor
Katsuhiko Hirasawa
Original Assignee
Seiko Instr & Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instr & Electronics Ltd filed Critical Seiko Instr & Electronics Ltd
Priority to JP6717275A priority Critical patent/JPS51142978A/en
Publication of JPS51142978A publication Critical patent/JPS51142978A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1515Shape
    • H01L2924/15151Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Abstract

PURPOSE: To facilitate the mounting of semiconductor elements on a supporting board.
COPYRIGHT: (C)1976,JPO&Japio
JP6717275A 1975-06-04 1975-06-04 Mounting method of circuit elements Pending JPS51142978A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6717275A JPS51142978A (en) 1975-06-04 1975-06-04 Mounting method of circuit elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6717275A JPS51142978A (en) 1975-06-04 1975-06-04 Mounting method of circuit elements

Publications (1)

Publication Number Publication Date
JPS51142978A true JPS51142978A (en) 1976-12-08

Family

ID=13337199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6717275A Pending JPS51142978A (en) 1975-06-04 1975-06-04 Mounting method of circuit elements

Country Status (1)

Country Link
JP (1) JPS51142978A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53132266A (en) * 1977-04-22 1978-11-17 Sharp Corp Production of semiconductor device
JPS5460562A (en) * 1977-10-21 1979-05-16 Mitsubishi Electric Corp Manufacture of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53132266A (en) * 1977-04-22 1978-11-17 Sharp Corp Production of semiconductor device
JPS5721853B2 (en) * 1977-04-22 1982-05-10
JPS5460562A (en) * 1977-10-21 1979-05-16 Mitsubishi Electric Corp Manufacture of semiconductor device

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