JPS5311577A - Soldering method for wafers of semiconductor devices - Google Patents

Soldering method for wafers of semiconductor devices

Info

Publication number
JPS5311577A
JPS5311577A JP8618776A JP8618776A JPS5311577A JP S5311577 A JPS5311577 A JP S5311577A JP 8618776 A JP8618776 A JP 8618776A JP 8618776 A JP8618776 A JP 8618776A JP S5311577 A JPS5311577 A JP S5311577A
Authority
JP
Japan
Prior art keywords
wafers
semiconductor devices
soldering method
soldering
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8618776A
Other languages
Japanese (ja)
Inventor
Toshihiro Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8618776A priority Critical patent/JPS5311577A/en
Publication of JPS5311577A publication Critical patent/JPS5311577A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To perform even soldering to wafers by providing a protrusion for making solder thickness constant around a soldering jig.
COPYRIGHT: (C)1978,JPO&Japio
JP8618776A 1976-07-19 1976-07-19 Soldering method for wafers of semiconductor devices Pending JPS5311577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8618776A JPS5311577A (en) 1976-07-19 1976-07-19 Soldering method for wafers of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8618776A JPS5311577A (en) 1976-07-19 1976-07-19 Soldering method for wafers of semiconductor devices

Publications (1)

Publication Number Publication Date
JPS5311577A true JPS5311577A (en) 1978-02-02

Family

ID=13879754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8618776A Pending JPS5311577A (en) 1976-07-19 1976-07-19 Soldering method for wafers of semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5311577A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911635A (en) * 1982-07-12 1984-01-21 Nec Corp Manufacture of metal coated film
JPS6019560U (en) * 1983-07-19 1985-02-09 富士紡績株式会社 Automatic winding device for elastic yarn

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911635A (en) * 1982-07-12 1984-01-21 Nec Corp Manufacture of metal coated film
JPS6019560U (en) * 1983-07-19 1985-02-09 富士紡績株式会社 Automatic winding device for elastic yarn

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