JPS5311577A - Soldering method for wafers of semiconductor devices - Google Patents
Soldering method for wafers of semiconductor devicesInfo
- Publication number
- JPS5311577A JPS5311577A JP8618776A JP8618776A JPS5311577A JP S5311577 A JPS5311577 A JP S5311577A JP 8618776 A JP8618776 A JP 8618776A JP 8618776 A JP8618776 A JP 8618776A JP S5311577 A JPS5311577 A JP S5311577A
- Authority
- JP
- Japan
- Prior art keywords
- wafers
- semiconductor devices
- soldering method
- soldering
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To perform even soldering to wafers by providing a protrusion for making solder thickness constant around a soldering jig.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8618776A JPS5311577A (en) | 1976-07-19 | 1976-07-19 | Soldering method for wafers of semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8618776A JPS5311577A (en) | 1976-07-19 | 1976-07-19 | Soldering method for wafers of semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5311577A true JPS5311577A (en) | 1978-02-02 |
Family
ID=13879754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8618776A Pending JPS5311577A (en) | 1976-07-19 | 1976-07-19 | Soldering method for wafers of semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5311577A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5911635A (en) * | 1982-07-12 | 1984-01-21 | Nec Corp | Manufacture of metal coated film |
JPS6019560U (en) * | 1983-07-19 | 1985-02-09 | 富士紡績株式会社 | Automatic winding device for elastic yarn |
-
1976
- 1976-07-19 JP JP8618776A patent/JPS5311577A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5911635A (en) * | 1982-07-12 | 1984-01-21 | Nec Corp | Manufacture of metal coated film |
JPS6019560U (en) * | 1983-07-19 | 1985-02-09 | 富士紡績株式会社 | Automatic winding device for elastic yarn |
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