JPS548462A - Manufacture for semiconductor - Google Patents
Manufacture for semiconductorInfo
- Publication number
- JPS548462A JPS548462A JP7406677A JP7406677A JPS548462A JP S548462 A JPS548462 A JP S548462A JP 7406677 A JP7406677 A JP 7406677A JP 7406677 A JP7406677 A JP 7406677A JP S548462 A JPS548462 A JP S548462A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- semiconductor
- manufacture
- oxide film
- mounting base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE: To avoid the presence of solder oxide film between the element and the mounting base, by flowing solder to the clearance between the element and the mounting base while partially breaking the surface oxide film of the solder circumference at the bottom corner of a semiconductor element.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7406677A JPS548462A (en) | 1977-06-21 | 1977-06-21 | Manufacture for semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7406677A JPS548462A (en) | 1977-06-21 | 1977-06-21 | Manufacture for semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS548462A true JPS548462A (en) | 1979-01-22 |
Family
ID=13536437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7406677A Pending JPS548462A (en) | 1977-06-21 | 1977-06-21 | Manufacture for semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS548462A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5753948A (en) * | 1980-09-17 | 1982-03-31 | Toshiba Corp | Mounting method of semiconductor element |
JPS58135049A (en) * | 1982-02-06 | 1983-08-11 | Mitsubishi Heavy Ind Ltd | Advancing direction changing device of band material |
JPS58195435U (en) * | 1982-06-21 | 1983-12-26 | 新電元工業株式会社 | semiconductor equipment |
JPS5939034A (en) * | 1982-08-27 | 1984-03-03 | Shindengen Electric Mfg Co Ltd | Manufacture of semiconductor device |
JPS5939035A (en) * | 1982-08-27 | 1984-03-03 | Shindengen Electric Mfg Co Ltd | Manufacture of semiconductor device |
US4687125A (en) * | 1984-06-19 | 1987-08-18 | Mitsubishi Jukogyo Kabushiki Kaisha | Apparatus for changing the traveling direction of a web-like material |
US5727727A (en) * | 1995-02-02 | 1998-03-17 | Vlt Corporation | Flowing solder in a gap |
US5808358A (en) * | 1994-11-10 | 1998-09-15 | Vlt Corporation | Packaging electrical circuits |
US6316737B1 (en) | 1999-09-09 | 2001-11-13 | Vlt Corporation | Making a connection between a component and a circuit board |
JP2002118294A (en) * | 2000-04-24 | 2002-04-19 | Nichia Chem Ind Ltd | Flip chip type light-emitting diode and manufacturing method thereof |
-
1977
- 1977-06-21 JP JP7406677A patent/JPS548462A/en active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5753948A (en) * | 1980-09-17 | 1982-03-31 | Toshiba Corp | Mounting method of semiconductor element |
JPS58135049A (en) * | 1982-02-06 | 1983-08-11 | Mitsubishi Heavy Ind Ltd | Advancing direction changing device of band material |
JPH0222989Y2 (en) * | 1982-06-21 | 1990-06-21 | ||
JPS58195435U (en) * | 1982-06-21 | 1983-12-26 | 新電元工業株式会社 | semiconductor equipment |
JPS5939034A (en) * | 1982-08-27 | 1984-03-03 | Shindengen Electric Mfg Co Ltd | Manufacture of semiconductor device |
JPS5939035A (en) * | 1982-08-27 | 1984-03-03 | Shindengen Electric Mfg Co Ltd | Manufacture of semiconductor device |
US4687125A (en) * | 1984-06-19 | 1987-08-18 | Mitsubishi Jukogyo Kabushiki Kaisha | Apparatus for changing the traveling direction of a web-like material |
US5808358A (en) * | 1994-11-10 | 1998-09-15 | Vlt Corporation | Packaging electrical circuits |
US5906310A (en) * | 1994-11-10 | 1999-05-25 | Vlt Corporation | Packaging electrical circuits |
US6096981A (en) * | 1994-11-10 | 2000-08-01 | Vlt Corporation | Packaging electrical circuits |
US6119923A (en) * | 1994-11-10 | 2000-09-19 | Vlt Corporation | Packaging electrical circuits |
US6159772A (en) * | 1994-11-10 | 2000-12-12 | Vlt Corporation | Packaging electrical circuits |
US5727727A (en) * | 1995-02-02 | 1998-03-17 | Vlt Corporation | Flowing solder in a gap |
US6316737B1 (en) | 1999-09-09 | 2001-11-13 | Vlt Corporation | Making a connection between a component and a circuit board |
JP2002118294A (en) * | 2000-04-24 | 2002-04-19 | Nichia Chem Ind Ltd | Flip chip type light-emitting diode and manufacturing method thereof |
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