JPS548462A - Manufacture for semiconductor - Google Patents

Manufacture for semiconductor

Info

Publication number
JPS548462A
JPS548462A JP7406677A JP7406677A JPS548462A JP S548462 A JPS548462 A JP S548462A JP 7406677 A JP7406677 A JP 7406677A JP 7406677 A JP7406677 A JP 7406677A JP S548462 A JPS548462 A JP S548462A
Authority
JP
Japan
Prior art keywords
solder
semiconductor
manufacture
oxide film
mounting base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7406677A
Other languages
Japanese (ja)
Inventor
Shigeo Mizogami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP7406677A priority Critical patent/JPS548462A/en
Publication of JPS548462A publication Critical patent/JPS548462A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To avoid the presence of solder oxide film between the element and the mounting base, by flowing solder to the clearance between the element and the mounting base while partially breaking the surface oxide film of the solder circumference at the bottom corner of a semiconductor element.
COPYRIGHT: (C)1979,JPO&Japio
JP7406677A 1977-06-21 1977-06-21 Manufacture for semiconductor Pending JPS548462A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7406677A JPS548462A (en) 1977-06-21 1977-06-21 Manufacture for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7406677A JPS548462A (en) 1977-06-21 1977-06-21 Manufacture for semiconductor

Publications (1)

Publication Number Publication Date
JPS548462A true JPS548462A (en) 1979-01-22

Family

ID=13536437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7406677A Pending JPS548462A (en) 1977-06-21 1977-06-21 Manufacture for semiconductor

Country Status (1)

Country Link
JP (1) JPS548462A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753948A (en) * 1980-09-17 1982-03-31 Toshiba Corp Mounting method of semiconductor element
JPS58135049A (en) * 1982-02-06 1983-08-11 Mitsubishi Heavy Ind Ltd Advancing direction changing device of band material
JPS58195435U (en) * 1982-06-21 1983-12-26 新電元工業株式会社 semiconductor equipment
JPS5939034A (en) * 1982-08-27 1984-03-03 Shindengen Electric Mfg Co Ltd Manufacture of semiconductor device
JPS5939035A (en) * 1982-08-27 1984-03-03 Shindengen Electric Mfg Co Ltd Manufacture of semiconductor device
US4687125A (en) * 1984-06-19 1987-08-18 Mitsubishi Jukogyo Kabushiki Kaisha Apparatus for changing the traveling direction of a web-like material
US5727727A (en) * 1995-02-02 1998-03-17 Vlt Corporation Flowing solder in a gap
US5808358A (en) * 1994-11-10 1998-09-15 Vlt Corporation Packaging electrical circuits
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
JP2002118294A (en) * 2000-04-24 2002-04-19 Nichia Chem Ind Ltd Flip chip type light-emitting diode and manufacturing method thereof

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753948A (en) * 1980-09-17 1982-03-31 Toshiba Corp Mounting method of semiconductor element
JPS58135049A (en) * 1982-02-06 1983-08-11 Mitsubishi Heavy Ind Ltd Advancing direction changing device of band material
JPH0222989Y2 (en) * 1982-06-21 1990-06-21
JPS58195435U (en) * 1982-06-21 1983-12-26 新電元工業株式会社 semiconductor equipment
JPS5939034A (en) * 1982-08-27 1984-03-03 Shindengen Electric Mfg Co Ltd Manufacture of semiconductor device
JPS5939035A (en) * 1982-08-27 1984-03-03 Shindengen Electric Mfg Co Ltd Manufacture of semiconductor device
US4687125A (en) * 1984-06-19 1987-08-18 Mitsubishi Jukogyo Kabushiki Kaisha Apparatus for changing the traveling direction of a web-like material
US5808358A (en) * 1994-11-10 1998-09-15 Vlt Corporation Packaging electrical circuits
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US6096981A (en) * 1994-11-10 2000-08-01 Vlt Corporation Packaging electrical circuits
US6119923A (en) * 1994-11-10 2000-09-19 Vlt Corporation Packaging electrical circuits
US6159772A (en) * 1994-11-10 2000-12-12 Vlt Corporation Packaging electrical circuits
US5727727A (en) * 1995-02-02 1998-03-17 Vlt Corporation Flowing solder in a gap
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
JP2002118294A (en) * 2000-04-24 2002-04-19 Nichia Chem Ind Ltd Flip chip type light-emitting diode and manufacturing method thereof

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