JPS5254373A - Packaging construction for semiconductor element - Google Patents

Packaging construction for semiconductor element

Info

Publication number
JPS5254373A
JPS5254373A JP50130004A JP13000475A JPS5254373A JP S5254373 A JPS5254373 A JP S5254373A JP 50130004 A JP50130004 A JP 50130004A JP 13000475 A JP13000475 A JP 13000475A JP S5254373 A JPS5254373 A JP S5254373A
Authority
JP
Japan
Prior art keywords
semiconductor element
packaging construction
construction
packaging
substrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50130004A
Other languages
Japanese (ja)
Inventor
Hideshi Ono
Kazunari Kume
Minoru Watanabe
Munetaka Tamaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP50130004A priority Critical patent/JPS5254373A/en
Publication of JPS5254373A publication Critical patent/JPS5254373A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE: To simplify construction, reduce the number of steps and lower costs by directly bonding a semiconductor element to a printed substrated.
COPYRIGHT: (C)1977,JPO&Japio
JP50130004A 1975-10-29 1975-10-29 Packaging construction for semiconductor element Pending JPS5254373A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50130004A JPS5254373A (en) 1975-10-29 1975-10-29 Packaging construction for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50130004A JPS5254373A (en) 1975-10-29 1975-10-29 Packaging construction for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5254373A true JPS5254373A (en) 1977-05-02

Family

ID=15023760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50130004A Pending JPS5254373A (en) 1975-10-29 1975-10-29 Packaging construction for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5254373A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635452A (en) * 1979-08-30 1981-04-08 Nec Corp Connecting lead wire for semiconductor device
JPS60174271U (en) * 1984-12-19 1985-11-19
JPH0260134A (en) * 1988-08-26 1990-02-28 Mitsui Toatsu Chem Inc Board for semiconductor element mounting use

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635452A (en) * 1979-08-30 1981-04-08 Nec Corp Connecting lead wire for semiconductor device
JPS60174271U (en) * 1984-12-19 1985-11-19
JPH0260134A (en) * 1988-08-26 1990-02-28 Mitsui Toatsu Chem Inc Board for semiconductor element mounting use

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