JPS5380163A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5380163A
JPS5380163A JP15683076A JP15683076A JPS5380163A JP S5380163 A JPS5380163 A JP S5380163A JP 15683076 A JP15683076 A JP 15683076A JP 15683076 A JP15683076 A JP 15683076A JP S5380163 A JPS5380163 A JP S5380163A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
solder
substrate
cushiony
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15683076A
Other languages
Japanese (ja)
Inventor
Yasuo Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP15683076A priority Critical patent/JPS5380163A/en
Publication of JPS5380163A publication Critical patent/JPS5380163A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To increase the cushiony features against an element without deteriorating the fitness of solder to a substrate by pushing the fused solder on the metallic substrate by means of a push rod which has a concave on its tip before fitting the element.
COPYRIGHT: (C)1978,JPO&Japio
JP15683076A 1976-12-25 1976-12-25 Manufacture of semiconductor device Pending JPS5380163A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15683076A JPS5380163A (en) 1976-12-25 1976-12-25 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15683076A JPS5380163A (en) 1976-12-25 1976-12-25 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5380163A true JPS5380163A (en) 1978-07-15

Family

ID=15636271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15683076A Pending JPS5380163A (en) 1976-12-25 1976-12-25 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5380163A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287828A (en) * 2009-06-15 2010-12-24 Canon Machinery Inc Transfer device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4863676A (en) * 1971-12-06 1973-09-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4863676A (en) * 1971-12-06 1973-09-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287828A (en) * 2009-06-15 2010-12-24 Canon Machinery Inc Transfer device

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