JPS52132778A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS52132778A
JPS52132778A JP5017176A JP5017176A JPS52132778A JP S52132778 A JPS52132778 A JP S52132778A JP 5017176 A JP5017176 A JP 5017176A JP 5017176 A JP5017176 A JP 5017176A JP S52132778 A JPS52132778 A JP S52132778A
Authority
JP
Japan
Prior art keywords
semiconductor device
manufacture
weldered
solder
dispersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5017176A
Other languages
Japanese (ja)
Other versions
JPS609344B2 (en
Inventor
Masami Yokozawa
Hiroyuki Fujii
Kenichi Tateno
Hideaki Nagura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP51050171A priority Critical patent/JPS609344B2/en
Publication of JPS52132778A publication Critical patent/JPS52132778A/en
Publication of JPS609344B2 publication Critical patent/JPS609344B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Abstract

PURPOSE: To remarkably reduce the dispersion of heat resistance of the semiconductor device weldered, by limiting the quantity of Au or Au alloy acting as solder to the minimum quantity required.
COPYRIGHT: (C)1977,JPO&Japio
JP51050171A 1976-04-30 1976-04-30 Manufacturing method of semiconductor device Expired JPS609344B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51050171A JPS609344B2 (en) 1976-04-30 1976-04-30 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51050171A JPS609344B2 (en) 1976-04-30 1976-04-30 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS52132778A true JPS52132778A (en) 1977-11-07
JPS609344B2 JPS609344B2 (en) 1985-03-09

Family

ID=12851745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51050171A Expired JPS609344B2 (en) 1976-04-30 1976-04-30 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS609344B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62155523A (en) * 1985-12-27 1987-07-10 Nec Corp Manufacture of semiconductor device
JPS63160346A (en) * 1986-12-24 1988-07-04 Nec Corp Manufacture of semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509149A (en) * 1973-05-30 1975-01-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS509149A (en) * 1973-05-30 1975-01-30

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62155523A (en) * 1985-12-27 1987-07-10 Nec Corp Manufacture of semiconductor device
JPS63160346A (en) * 1986-12-24 1988-07-04 Nec Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS609344B2 (en) 1985-03-09

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