JPS53121460A - Electrode lead for semiconductor - Google Patents

Electrode lead for semiconductor

Info

Publication number
JPS53121460A
JPS53121460A JP3527977A JP3527977A JPS53121460A JP S53121460 A JPS53121460 A JP S53121460A JP 3527977 A JP3527977 A JP 3527977A JP 3527977 A JP3527977 A JP 3527977A JP S53121460 A JPS53121460 A JP S53121460A
Authority
JP
Japan
Prior art keywords
electrode lead
semiconductor
electrode
blazing
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3527977A
Other languages
Japanese (ja)
Inventor
Toshiyuki Hidaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3527977A priority Critical patent/JPS53121460A/en
Publication of JPS53121460A publication Critical patent/JPS53121460A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE: To manufacture the electrode lead especially suitable for the two terminal type unit of shaft rotating type, by using Cu-Fe alloy wires as the electrode blazing the pellet for Mo or W leads.
COPYRIGHT: (C)1978,JPO&Japio
JP3527977A 1977-03-31 1977-03-31 Electrode lead for semiconductor Pending JPS53121460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3527977A JPS53121460A (en) 1977-03-31 1977-03-31 Electrode lead for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3527977A JPS53121460A (en) 1977-03-31 1977-03-31 Electrode lead for semiconductor

Publications (1)

Publication Number Publication Date
JPS53121460A true JPS53121460A (en) 1978-10-23

Family

ID=12437334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3527977A Pending JPS53121460A (en) 1977-03-31 1977-03-31 Electrode lead for semiconductor

Country Status (1)

Country Link
JP (1) JPS53121460A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5596665A (en) * 1979-01-19 1980-07-23 Totoku Electric Co Ltd Lead component for semiconductor element
JPS5775759U (en) * 1980-10-29 1982-05-11
JPS5775758U (en) * 1980-10-29 1982-05-11
US20140345939A1 (en) * 2012-03-05 2014-11-27 Murata Manufacturing Co., Ltd. Joining method, method for producing electronic device and electronic part

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5596665A (en) * 1979-01-19 1980-07-23 Totoku Electric Co Ltd Lead component for semiconductor element
JPS5775759U (en) * 1980-10-29 1982-05-11
JPS5775758U (en) * 1980-10-29 1982-05-11
JPS6223093Y2 (en) * 1980-10-29 1987-06-12
JPS6223092Y2 (en) * 1980-10-29 1987-06-12
US20140345939A1 (en) * 2012-03-05 2014-11-27 Murata Manufacturing Co., Ltd. Joining method, method for producing electronic device and electronic part
US9409247B2 (en) * 2012-03-05 2016-08-09 Murata Manufacturing Co., Ltd. Joining method, method for producing electronic device and electronic part

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