JPS53120372A - Electrode structure of semiconductor integrated circuit - Google Patents

Electrode structure of semiconductor integrated circuit

Info

Publication number
JPS53120372A
JPS53120372A JP3456377A JP3456377A JPS53120372A JP S53120372 A JPS53120372 A JP S53120372A JP 3456377 A JP3456377 A JP 3456377A JP 3456377 A JP3456377 A JP 3456377A JP S53120372 A JPS53120372 A JP S53120372A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
electrode structure
electrodes
freedom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3456377A
Other languages
Japanese (ja)
Inventor
Junjiro Kitano
Shinji Okuhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3456377A priority Critical patent/JPS53120372A/en
Publication of JPS53120372A publication Critical patent/JPS53120372A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To make such electrodes at which the degree of freedom of design in packaging is increased without lowering the scale of integration by dividing solder ball electrodes for potential measurement for current supplying.
COPYRIGHT: (C)1978,JPO&Japio
JP3456377A 1977-03-30 1977-03-30 Electrode structure of semiconductor integrated circuit Pending JPS53120372A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3456377A JPS53120372A (en) 1977-03-30 1977-03-30 Electrode structure of semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3456377A JPS53120372A (en) 1977-03-30 1977-03-30 Electrode structure of semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS53120372A true JPS53120372A (en) 1978-10-20

Family

ID=12417773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3456377A Pending JPS53120372A (en) 1977-03-30 1977-03-30 Electrode structure of semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS53120372A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161336A (en) * 1982-03-19 1983-09-24 Hitachi Ltd Semiconductor integrated circuit device
JPS63175459A (en) * 1987-01-16 1988-07-19 Hitachi Ltd High density multilayer interconnection substrate mounting structure
JPH08184646A (en) * 1994-12-28 1996-07-16 Nec Ic Microcomput Syst Ltd Semiconductor integrated circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161336A (en) * 1982-03-19 1983-09-24 Hitachi Ltd Semiconductor integrated circuit device
JPS63175459A (en) * 1987-01-16 1988-07-19 Hitachi Ltd High density multilayer interconnection substrate mounting structure
JPH08184646A (en) * 1994-12-28 1996-07-16 Nec Ic Microcomput Syst Ltd Semiconductor integrated circuit

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