JPS52149971A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS52149971A
JPS52149971A JP6643576A JP6643576A JPS52149971A JP S52149971 A JPS52149971 A JP S52149971A JP 6643576 A JP6643576 A JP 6643576A JP 6643576 A JP6643576 A JP 6643576A JP S52149971 A JPS52149971 A JP S52149971A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
circuit device
stage
relaying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6643576A
Other languages
Japanese (ja)
Other versions
JPS5732905B2 (en
Inventor
Masayuki Ezoe
Toshishige Kondo
Hiroshi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP6643576A priority Critical patent/JPS52149971A/en
Publication of JPS52149971A publication Critical patent/JPS52149971A/en
Publication of JPS5732905B2 publication Critical patent/JPS5732905B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
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    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
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    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
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    • H01L2224/49171—Fan-out arrangements
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    • H01L2224/732—Location after the connecting process
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To eliminate false operation owing to noise by relaying a stage to connect the electrodes of the same potential as the stage to external leads.
COPYRIGHT: (C)1977,JPO&Japio
JP6643576A 1976-06-09 1976-06-09 Semiconductor integrated circuit device Granted JPS52149971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6643576A JPS52149971A (en) 1976-06-09 1976-06-09 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6643576A JPS52149971A (en) 1976-06-09 1976-06-09 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
JPS52149971A true JPS52149971A (en) 1977-12-13
JPS5732905B2 JPS5732905B2 (en) 1982-07-14

Family

ID=13315686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6643576A Granted JPS52149971A (en) 1976-06-09 1976-06-09 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS52149971A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5670654A (en) * 1979-11-13 1981-06-12 Nec Corp Semiconductor device
JPS6144837U (en) * 1984-08-28 1986-03-25 沖電気工業株式会社 Package for semiconductors

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025469U (en) * 1973-06-29 1975-03-24

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025469B2 (en) * 1972-08-18 1975-08-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025469U (en) * 1973-06-29 1975-03-24

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5670654A (en) * 1979-11-13 1981-06-12 Nec Corp Semiconductor device
JPS6144837U (en) * 1984-08-28 1986-03-25 沖電気工業株式会社 Package for semiconductors
JPH0342681Y2 (en) * 1984-08-28 1991-09-06

Also Published As

Publication number Publication date
JPS5732905B2 (en) 1982-07-14

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