JPS5411673A - Semiconductor chip - Google Patents

Semiconductor chip

Info

Publication number
JPS5411673A
JPS5411673A JP7669977A JP7669977A JPS5411673A JP S5411673 A JPS5411673 A JP S5411673A JP 7669977 A JP7669977 A JP 7669977A JP 7669977 A JP7669977 A JP 7669977A JP S5411673 A JPS5411673 A JP S5411673A
Authority
JP
Japan
Prior art keywords
semiconductor chip
edge
chip
providing
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7669977A
Other languages
Japanese (ja)
Inventor
Mitsuyoshi Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP7669977A priority Critical patent/JPS5411673A/en
Publication of JPS5411673A publication Critical patent/JPS5411673A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Abstract

PURPOSE: To prevent short circuit with the lead terminals at the edge, by providing the surface protective film also at the edge parts of an IC chip.
COPYRIGHT: (C)1979,JPO&Japio
JP7669977A 1977-06-27 1977-06-27 Semiconductor chip Pending JPS5411673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7669977A JPS5411673A (en) 1977-06-27 1977-06-27 Semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7669977A JPS5411673A (en) 1977-06-27 1977-06-27 Semiconductor chip

Publications (1)

Publication Number Publication Date
JPS5411673A true JPS5411673A (en) 1979-01-27

Family

ID=13612737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7669977A Pending JPS5411673A (en) 1977-06-27 1977-06-27 Semiconductor chip

Country Status (1)

Country Link
JP (1) JPS5411673A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629641A (en) * 1985-07-05 1987-01-17 Nec Yamagata Ltd Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5197374A (en) * 1975-02-24 1976-08-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5197374A (en) * 1975-02-24 1976-08-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629641A (en) * 1985-07-05 1987-01-17 Nec Yamagata Ltd Semiconductor device

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