JPS53112061A - Wiring substrate of semiconductor chip - Google Patents

Wiring substrate of semiconductor chip

Info

Publication number
JPS53112061A
JPS53112061A JP2728677A JP2728677A JPS53112061A JP S53112061 A JPS53112061 A JP S53112061A JP 2728677 A JP2728677 A JP 2728677A JP 2728677 A JP2728677 A JP 2728677A JP S53112061 A JPS53112061 A JP S53112061A
Authority
JP
Japan
Prior art keywords
semiconductor chip
wiring substrate
opposing
transparent substrate
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2728677A
Other languages
Japanese (ja)
Inventor
Yoshio Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2728677A priority Critical patent/JPS53112061A/en
Publication of JPS53112061A publication Critical patent/JPS53112061A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

PURPOSE: To perfectly cut off treansmitted light without losing the characteristics of transparent substrate by providing an opaque film to the portion of the transparent substrate opposing to a chip at the time of opposing a semiconductor chip surface and a transparent wiring substrate surface and directly bonding the connection terminals provided to both.
COPYRIGHT: (C)1978,JPO&Japio
JP2728677A 1977-03-11 1977-03-11 Wiring substrate of semiconductor chip Pending JPS53112061A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2728677A JPS53112061A (en) 1977-03-11 1977-03-11 Wiring substrate of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2728677A JPS53112061A (en) 1977-03-11 1977-03-11 Wiring substrate of semiconductor chip

Publications (1)

Publication Number Publication Date
JPS53112061A true JPS53112061A (en) 1978-09-30

Family

ID=12216823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2728677A Pending JPS53112061A (en) 1977-03-11 1977-03-11 Wiring substrate of semiconductor chip

Country Status (1)

Country Link
JP (1) JPS53112061A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127338A (en) * 1982-01-25 1983-07-29 Sharp Corp Structure of electronic part
JPS58134449A (en) * 1982-02-04 1983-08-10 Sharp Corp Lsi package
JPS58154242A (en) * 1982-03-10 1983-09-13 Mitsubishi Metal Corp Fine wire of gold alloy for bonding semiconductor element
JPS6429839U (en) * 1987-08-14 1989-02-22
JPH0281529U (en) * 1988-12-12 1990-06-22
WO2001008220A1 (en) * 1999-07-28 2001-02-01 Hitachi, Ltd. Semiconductor device
WO2018159344A1 (en) * 2017-03-03 2018-09-07 ソニーセミコンダクタソリューションズ株式会社 Solid-state imaging element, electronic device, and semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51127112A (en) * 1975-04-30 1976-11-05 Fujitsu Ltd Method of producing multiilayered glass substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51127112A (en) * 1975-04-30 1976-11-05 Fujitsu Ltd Method of producing multiilayered glass substrate

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127338A (en) * 1982-01-25 1983-07-29 Sharp Corp Structure of electronic part
JPS6364899B2 (en) * 1982-01-25 1988-12-14
JPS58134449A (en) * 1982-02-04 1983-08-10 Sharp Corp Lsi package
JPS58154242A (en) * 1982-03-10 1983-09-13 Mitsubishi Metal Corp Fine wire of gold alloy for bonding semiconductor element
JPH0212022B2 (en) * 1982-03-10 1990-03-16 Mitsubishi Metal Corp
JPS6429839U (en) * 1987-08-14 1989-02-22
JPH0281529U (en) * 1988-12-12 1990-06-22
WO2001008220A1 (en) * 1999-07-28 2001-02-01 Hitachi, Ltd. Semiconductor device
WO2018159344A1 (en) * 2017-03-03 2018-09-07 ソニーセミコンダクタソリューションズ株式会社 Solid-state imaging element, electronic device, and semiconductor device
US11121112B2 (en) 2017-03-03 2021-09-14 Sony Semiconductor Solutions Corporation Solid-state image pickup element with dam to control resin outflow
US11647890B2 (en) 2017-03-03 2023-05-16 Sony Semiconductor Solutions Corporation Solid-state image pickup element, electronic equipment, and semiconductor apparatus

Similar Documents

Publication Publication Date Title
JPS5710992A (en) Semiconductor device and manufacture therefor
JPS53112061A (en) Wiring substrate of semiconductor chip
JPS5211784A (en) Photo semiconductor device
JPS548462A (en) Manufacture for semiconductor
JPS5214387A (en) Semiconductor device
JPS5437595A (en) Photo integrated-circuit device
JPS52153669A (en) Photo mask of semiconductor integrated circuit
JPS52126183A (en) Preparation of semiconductor device
JPS5268388A (en) Semiconductor integrated circuit
JPS53124070A (en) Semiconductor device
JPS5441666A (en) Semiconductor integrated circuit element
JPS5411673A (en) Semiconductor chip
JPS5259576A (en) Semiconductor device
JPS5417677A (en) Manufacture of semiconductor
JPS53145472A (en) Semiconductor integrated circuit
JPS5598875A (en) Semiconductor device with photocell
JPS54577A (en) Resin seal semiconductor device
JPS5315759A (en) Electronic parts
JPS52153668A (en) Photo mask of semiconductor integrated circuit
JPH0430541A (en) Semiconductor device
JPS5210676A (en) Semiconductor device
JPS53139476A (en) Manufacture of semiconductor device
JPS5422766A (en) Semiconductor element
JPS5379462A (en) Manufacture of semiconductor integrated circuit
JPS535574A (en) Manufacture of semiconductor device