JPS5432075A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5432075A
JPS5432075A JP9800477A JP9800477A JPS5432075A JP S5432075 A JPS5432075 A JP S5432075A JP 9800477 A JP9800477 A JP 9800477A JP 9800477 A JP9800477 A JP 9800477A JP S5432075 A JPS5432075 A JP S5432075A
Authority
JP
Japan
Prior art keywords
semiconductor
facilitate
mounting
bridge circuit
same polarity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9800477A
Other languages
Japanese (ja)
Inventor
Motofumi Miyazaki
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP9800477A priority Critical patent/JPS5432075A/en
Publication of JPS5432075A publication Critical patent/JPS5432075A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To facilitate an easy manufacture of a single-phase bridge circuit by mounting all plural units of diode pellets in the same polarity direction.
COPYRIGHT: (C)1979,JPO&Japio
JP9800477A 1977-08-15 1977-08-15 Semiconductor device Pending JPS5432075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9800477A JPS5432075A (en) 1977-08-15 1977-08-15 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9800477A JPS5432075A (en) 1977-08-15 1977-08-15 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5432075A true JPS5432075A (en) 1979-03-09

Family

ID=14207547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9800477A Pending JPS5432075A (en) 1977-08-15 1977-08-15 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5432075A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58500187A (en) * 1981-02-27 1983-02-03
JPS6161847U (en) * 1984-09-28 1986-04-25
JP2003518733A (en) * 1999-11-01 2003-06-10 ゼネラル セミコンダクター,インク. Planar hybrid diode rectifier bridge
JP2012138544A (en) * 2010-12-28 2012-07-19 Nippon Inter Electronics Corp Resin sealed semiconductor device and manufacturing method of the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58500187A (en) * 1981-02-27 1983-02-03
JPS6161847U (en) * 1984-09-28 1986-04-25
JPH0322925Y2 (en) * 1984-09-28 1991-05-20
JP2003518733A (en) * 1999-11-01 2003-06-10 ゼネラル セミコンダクター,インク. Planar hybrid diode rectifier bridge
JP4975925B2 (en) * 1999-11-01 2012-07-11 ゼネラル セミコンダクター,インク. Planar type hybrid diode rectifier bridge
JP2012138544A (en) * 2010-12-28 2012-07-19 Nippon Inter Electronics Corp Resin sealed semiconductor device and manufacturing method of the same

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