JPS5432075A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5432075A
JPS5432075A JP9800477A JP9800477A JPS5432075A JP S5432075 A JPS5432075 A JP S5432075A JP 9800477 A JP9800477 A JP 9800477A JP 9800477 A JP9800477 A JP 9800477A JP S5432075 A JPS5432075 A JP S5432075A
Authority
JP
Japan
Prior art keywords
semiconductor device
facilitate
mounting
bridge circuit
same polarity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9800477A
Other languages
Japanese (ja)
Inventor
Motofumi Miyazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9800477A priority Critical patent/JPS5432075A/en
Publication of JPS5432075A publication Critical patent/JPS5432075A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Microwave Amplifiers (AREA)

Abstract

PURPOSE: To facilitate an easy manufacture of a single-phase bridge circuit by mounting all plural units of diode pellets in the same polarity direction.
COPYRIGHT: (C)1979,JPO&Japio
JP9800477A 1977-08-15 1977-08-15 Semiconductor device Pending JPS5432075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9800477A JPS5432075A (en) 1977-08-15 1977-08-15 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9800477A JPS5432075A (en) 1977-08-15 1977-08-15 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5432075A true JPS5432075A (en) 1979-03-09

Family

ID=14207547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9800477A Pending JPS5432075A (en) 1977-08-15 1977-08-15 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5432075A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58500187A (en) * 1981-02-07 1983-02-03 モトロ−ラ・インコ−ポレ−テツド High current package with multi-level leads
JPS6161847U (en) * 1984-09-28 1986-04-25
JP2003518733A (en) * 1999-11-01 2003-06-10 ゼネラル セミコンダクター，インク． Planar hybrid diode rectifier bridge
JP2012138544A (en) * 2010-12-28 2012-07-19 Nippon Inter Electronics Corp Resin sealed semiconductor device and manufacturing method of the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58500187A (en) * 1981-02-07 1983-02-03 モトロ−ラ・インコ−ポレ−テツド High current package with multi-level leads
JPS6161847U (en) * 1984-09-28 1986-04-25
JPH0322925Y2 (en) * 1984-09-28 1991-05-20
JP2003518733A (en) * 1999-11-01 2003-06-10 ゼネラル セミコンダクター，インク． Planar hybrid diode rectifier bridge
JP4975925B2 (en) * 1999-11-01 2012-07-11 ゼネラル セミコンダクター，インク． Planar type hybrid diode rectifier bridge
JP2012138544A (en) * 2010-12-28 2012-07-19 Nippon Inter Electronics Corp Resin sealed semiconductor device and manufacturing method of the same

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