JPS5343475A - Flexible tape structure for gang bonding - Google Patents

Flexible tape structure for gang bonding

Info

Publication number
JPS5343475A
JPS5343475A JP11825876A JP11825876A JPS5343475A JP S5343475 A JPS5343475 A JP S5343475A JP 11825876 A JP11825876 A JP 11825876A JP 11825876 A JP11825876 A JP 11825876A JP S5343475 A JPS5343475 A JP S5343475A
Authority
JP
Japan
Prior art keywords
flexible tape
tape structure
gang bonding
gang
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11825876A
Other languages
Japanese (ja)
Inventor
Tetsuo Yabushita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP11825876A priority Critical patent/JPS5343475A/en
Publication of JPS5343475A publication Critical patent/JPS5343475A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To integrate circuit parts compact by gang-bonding more than two ICs within 1 unit.
COPYRIGHT: (C)1978,JPO&Japio
JP11825876A 1976-10-01 1976-10-01 Flexible tape structure for gang bonding Pending JPS5343475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11825876A JPS5343475A (en) 1976-10-01 1976-10-01 Flexible tape structure for gang bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11825876A JPS5343475A (en) 1976-10-01 1976-10-01 Flexible tape structure for gang bonding

Publications (1)

Publication Number Publication Date
JPS5343475A true JPS5343475A (en) 1978-04-19

Family

ID=14732159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11825876A Pending JPS5343475A (en) 1976-10-01 1976-10-01 Flexible tape structure for gang bonding

Country Status (1)

Country Link
JP (1) JPS5343475A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524478A (en) * 1978-08-09 1980-02-21 Nec Corp Integrated circuit
JPS5524477A (en) * 1978-08-09 1980-02-21 Nec Corp Integrated circuit
US4245580A (en) * 1978-09-26 1981-01-20 Ohkawara Mfg. Co., Ltd. Device for coating granular solids
JPS58178544A (en) * 1982-04-12 1983-10-19 Matsushita Electronics Corp Lead frame
JPS6021530A (en) * 1983-07-16 1985-02-02 New Japan Radio Co Ltd Oxide film in compound semiconductor
JPH0450852B2 (en) * 1982-01-29 1992-08-17 Guratsuto Mashiinen Unto Aparatebau Ag
JPH0450851B2 (en) * 1982-05-21 1992-08-17 Guratsuto Mashiinen Unto Aparatebau Ag
JP2002141377A (en) * 2000-11-01 2002-05-17 Canon Inc Tab tape and radiographic device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524478A (en) * 1978-08-09 1980-02-21 Nec Corp Integrated circuit
JPS5524477A (en) * 1978-08-09 1980-02-21 Nec Corp Integrated circuit
US4245580A (en) * 1978-09-26 1981-01-20 Ohkawara Mfg. Co., Ltd. Device for coating granular solids
JPH0450852B2 (en) * 1982-01-29 1992-08-17 Guratsuto Mashiinen Unto Aparatebau Ag
JPS58178544A (en) * 1982-04-12 1983-10-19 Matsushita Electronics Corp Lead frame
JPH0517709B2 (en) * 1982-04-12 1993-03-09 Matsushita Electronics Corp
JPH0450851B2 (en) * 1982-05-21 1992-08-17 Guratsuto Mashiinen Unto Aparatebau Ag
JPS6021530A (en) * 1983-07-16 1985-02-02 New Japan Radio Co Ltd Oxide film in compound semiconductor
JP2002141377A (en) * 2000-11-01 2002-05-17 Canon Inc Tab tape and radiographic device
JP4693224B2 (en) * 2000-11-01 2011-06-01 キヤノン株式会社 TAB tape and radiation imaging apparatus

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