JPS5524478A - Integrated circuit - Google Patents

Integrated circuit

Info

Publication number
JPS5524478A
JPS5524478A JP9764878A JP9764878A JPS5524478A JP S5524478 A JPS5524478 A JP S5524478A JP 9764878 A JP9764878 A JP 9764878A JP 9764878 A JP9764878 A JP 9764878A JP S5524478 A JPS5524478 A JP S5524478A
Authority
JP
Japan
Prior art keywords
hollow portion
film
substrates
layer
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9764878A
Other languages
Japanese (ja)
Inventor
Yoshihiko Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9764878A priority Critical patent/JPS5524478A/en
Publication of JPS5524478A publication Critical patent/JPS5524478A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE: For decreasing film consumption and increasing fitting density, to make an integrated circuit through the process consisting of providing a single open hollow portion at the center of insulating film, extending the terminal of the metallic layer deposited on said film up to the inside of said hollow portion, and connecting said terminal with a plurality of electric circuit parts provided in said hollow portion.
CONSTITUTION: An open hollow portion 33 is provided at the center of the film 31 made of polyimide for example, and Au-plated Au layer 32 is deposited with an end present at said hollow portion 33. Next, a plurality of semiconductor substrates 34 and 34' on which an IC is formed are placed in said hollow portion 33, and the electrodes of said substrates 34 and 34' are sticked to the end portions of Cu layer by heat pressing. Thereafter, the upper surfaces of said substrates 34 and 34' are sealed with sealing agent 35 such as epoxy resin. Thus, a plurality of substrates are encased in a single hollow portion 33 formed in said film 31 so that expensive film can be saved and the operational efficiency of each substrate can be raised.
COPYRIGHT: (C)1980,JPO&Japio
JP9764878A 1978-08-09 1978-08-09 Integrated circuit Pending JPS5524478A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9764878A JPS5524478A (en) 1978-08-09 1978-08-09 Integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9764878A JPS5524478A (en) 1978-08-09 1978-08-09 Integrated circuit

Publications (1)

Publication Number Publication Date
JPS5524478A true JPS5524478A (en) 1980-02-21

Family

ID=14197912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9764878A Pending JPS5524478A (en) 1978-08-09 1978-08-09 Integrated circuit

Country Status (1)

Country Link
JP (1) JPS5524478A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857483A (en) * 1981-09-30 1983-04-05 Sekisui Chem Co Ltd Bonding method
JPS63132432U (en) * 1987-02-20 1988-08-30
JP2002141377A (en) * 2000-11-01 2002-05-17 Canon Inc Tab tape and radiographic device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332382A (en) * 1976-09-03 1978-03-27 Suwa Seikosha Kk Flexible printed substrate structure for electronic wrist watch
JPS5343475A (en) * 1976-10-01 1978-04-19 Seiko Epson Corp Flexible tape structure for gang bonding

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332382A (en) * 1976-09-03 1978-03-27 Suwa Seikosha Kk Flexible printed substrate structure for electronic wrist watch
JPS5343475A (en) * 1976-10-01 1978-04-19 Seiko Epson Corp Flexible tape structure for gang bonding

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857483A (en) * 1981-09-30 1983-04-05 Sekisui Chem Co Ltd Bonding method
JPS6258638B2 (en) * 1981-09-30 1987-12-07 Sekisui Chemical Co Ltd
JPS63132432U (en) * 1987-02-20 1988-08-30
JP2002141377A (en) * 2000-11-01 2002-05-17 Canon Inc Tab tape and radiographic device
JP4693224B2 (en) * 2000-11-01 2011-06-01 キヤノン株式会社 TAB tape and radiation imaging apparatus

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