JPS556867A - Vessel for semiconductor device - Google Patents

Vessel for semiconductor device

Info

Publication number
JPS556867A
JPS556867A JP7953478A JP7953478A JPS556867A JP S556867 A JPS556867 A JP S556867A JP 7953478 A JP7953478 A JP 7953478A JP 7953478 A JP7953478 A JP 7953478A JP S556867 A JPS556867 A JP S556867A
Authority
JP
Japan
Prior art keywords
metallic
outside
leads
concave portions
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7953478A
Other languages
Japanese (ja)
Inventor
Kazufumi Terachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7953478A priority Critical patent/JPS556867A/en
Publication of JPS556867A publication Critical patent/JPS556867A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To obtain a sufficient electric insulating property and the strength of brazing, by forming ceramic portions among metallic leads for drawing-out to the outside in shapes that are not made up on the same plane as surfaces that the metallic leads for drawing-out to the outside are brazed.
CONSTITUTION: There is an element adhesion portion 22 for loading a semiconductor element at a central portion on an upper surface of a ceramic substrate 21 provided with concave portions 26, wiring metallic films 23 for connecting metallic thin wires are metallized around the portion 22 and a ceramic sealing frame 24 is sticked on the films 23. Metallic leads 25 for drawing-out to the outside are brazed to the convex portions of a flank portion of the ceramic substrate 21 provided with the concave portions 26 by means of Ag-Cu solder materials 27. Insulating distances sufficiently become long by mounting the concave portions 26 among external leads.
COPYRIGHT: (C)1980,JPO&Japio
JP7953478A 1978-06-29 1978-06-29 Vessel for semiconductor device Pending JPS556867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7953478A JPS556867A (en) 1978-06-29 1978-06-29 Vessel for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7953478A JPS556867A (en) 1978-06-29 1978-06-29 Vessel for semiconductor device

Publications (1)

Publication Number Publication Date
JPS556867A true JPS556867A (en) 1980-01-18

Family

ID=13692650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7953478A Pending JPS556867A (en) 1978-06-29 1978-06-29 Vessel for semiconductor device

Country Status (1)

Country Link
JP (1) JPS556867A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184746A (en) * 1982-04-22 1983-10-28 Toshiba Corp Package
JPS60173057U (en) * 1984-04-24 1985-11-16 出光興産株式会社 Spectrometer sample cell supply mechanism
JPS62257048A (en) * 1986-04-30 1987-11-09 Corona Denki Kk Measuring method using microplate
JPS6361957A (en) * 1986-09-03 1988-03-18 Fuji Photo Film Co Ltd Chemical analysis instrument
JPH02105062A (en) * 1988-08-25 1990-04-17 Eastman Kodak Co Analyzer
JPH04296050A (en) * 1991-03-25 1992-10-20 Ngk Insulators Ltd Flat package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111167A (en) * 1974-07-19 1976-01-29 Hitachi Ltd DENSHIBUHINSOSHOPATSUKEEJI
JPS5160449A (en) * 1974-11-25 1976-05-26 Hitachi Ltd DENSHIBUHIN

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111167A (en) * 1974-07-19 1976-01-29 Hitachi Ltd DENSHIBUHINSOSHOPATSUKEEJI
JPS5160449A (en) * 1974-11-25 1976-05-26 Hitachi Ltd DENSHIBUHIN

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184746A (en) * 1982-04-22 1983-10-28 Toshiba Corp Package
JPS60173057U (en) * 1984-04-24 1985-11-16 出光興産株式会社 Spectrometer sample cell supply mechanism
JPH0316056Y2 (en) * 1984-04-24 1991-04-08
JPS62257048A (en) * 1986-04-30 1987-11-09 Corona Denki Kk Measuring method using microplate
JPS6361957A (en) * 1986-09-03 1988-03-18 Fuji Photo Film Co Ltd Chemical analysis instrument
JPH02105062A (en) * 1988-08-25 1990-04-17 Eastman Kodak Co Analyzer
JPH04296050A (en) * 1991-03-25 1992-10-20 Ngk Insulators Ltd Flat package

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