JPS5588346A - Packaging method for semiconductor element - Google Patents

Packaging method for semiconductor element

Info

Publication number
JPS5588346A
JPS5588346A JP15987778A JP15987778A JPS5588346A JP S5588346 A JPS5588346 A JP S5588346A JP 15987778 A JP15987778 A JP 15987778A JP 15987778 A JP15987778 A JP 15987778A JP S5588346 A JPS5588346 A JP S5588346A
Authority
JP
Japan
Prior art keywords
free end
substrate
chip
hollow
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15987778A
Other languages
Japanese (ja)
Inventor
Keiji Miyamoto
Toru Kawanobe
Tatsuo Itagaki
Kichiji Inaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15987778A priority Critical patent/JPS5588346A/en
Publication of JPS5588346A publication Critical patent/JPS5588346A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Abstract

PURPOSE: To package an element directly on a substrate and thus to save an operation process and production cost by a method wherein one end of conductor wiring is projected on a through hole or a hollow provided in the substrate, and an electrode of the semiconductor element is connected to the conductor wiring.
CONSTITUTION: On one surface of a printed substrate 1 provided with a given through hole 2 or hollow, one end of a conductor wiring 3 is allowed to project on the through hole or the hollow and bent at its free end, and where necessary, an insulator solder flow preventing material 4 which is not so big to cover the free end entirely is further formed. Next, a semiconductor chip 5 provided with a solder bump 6 is soldered and connected to the free end 7 at a portion where the solder flow preventing material 4 is not formed. According to this method, a stress according to a difference in the coefficient of thermal expansion arising after chip bonding between the substrate 1 and the chip 5 is absorbed at the free end, and thus the stress working on the connection is reduced. Not only solder but also conductive metal is preferable for electrode on the chip.
COPYRIGHT: (C)1980,JPO&Japio
JP15987778A 1978-12-27 1978-12-27 Packaging method for semiconductor element Pending JPS5588346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15987778A JPS5588346A (en) 1978-12-27 1978-12-27 Packaging method for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15987778A JPS5588346A (en) 1978-12-27 1978-12-27 Packaging method for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5588346A true JPS5588346A (en) 1980-07-04

Family

ID=15703147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15987778A Pending JPS5588346A (en) 1978-12-27 1978-12-27 Packaging method for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5588346A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008085228A (en) * 2006-09-28 2008-04-10 Fujitsu Ltd Printed circuit board, electronic device with printed circuit board, and method of producing printed circuit board
JP2009117607A (en) * 2007-11-06 2009-05-28 Shinko Electric Ind Co Ltd Wiring board, semiconductor device, and method of manufacturing the same
JP2009278026A (en) * 2008-05-19 2009-11-26 Mitsubishi Electric Corp Electronic component mounting structure and on-vehicle sensor
JP2010267976A (en) * 2010-06-10 2010-11-25 Mitsubishi Electric Corp Electronic component mounting structure and on-board sensor
JP2012124408A (en) * 2010-12-10 2012-06-28 Mitsubishi Electric Corp Printed wiring board, printed circuit board, and manufacturing method of the printed circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187967A (en) * 1975-01-31 1976-07-31 Hitachi Ltd KONSEISHUSEKIKAIROKIBAN
JPS51134663A (en) * 1975-05-16 1976-11-22 Citizen Watch Co Ltd Electronic clock circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187967A (en) * 1975-01-31 1976-07-31 Hitachi Ltd KONSEISHUSEKIKAIROKIBAN
JPS51134663A (en) * 1975-05-16 1976-11-22 Citizen Watch Co Ltd Electronic clock circuit

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008085228A (en) * 2006-09-28 2008-04-10 Fujitsu Ltd Printed circuit board, electronic device with printed circuit board, and method of producing printed circuit board
JP2009117607A (en) * 2007-11-06 2009-05-28 Shinko Electric Ind Co Ltd Wiring board, semiconductor device, and method of manufacturing the same
JP2009278026A (en) * 2008-05-19 2009-11-26 Mitsubishi Electric Corp Electronic component mounting structure and on-vehicle sensor
JP4549406B2 (en) * 2008-05-19 2010-09-22 三菱電機株式会社 Electronic component mounting structure and in-vehicle sensor
JP2010267976A (en) * 2010-06-10 2010-11-25 Mitsubishi Electric Corp Electronic component mounting structure and on-board sensor
JP2012124408A (en) * 2010-12-10 2012-06-28 Mitsubishi Electric Corp Printed wiring board, printed circuit board, and manufacturing method of the printed circuit board

Similar Documents

Publication Publication Date Title
JPS5513933A (en) Circuit element substrate and its manufacturing method
JPS5568661A (en) Structure for mounting power transistor
JPS5588346A (en) Packaging method for semiconductor element
JPS6481330A (en) Film carrier semiconductor device
WO1996036071A2 (en) Method of manufacturing a semiconductor device suitable for surface mounting
JPS5389368A (en) Production of semiconductor integrated circuit
JPS5240973A (en) Method of connecting semiconductor devices
KR200153438Y1 (en) Chip scale package using a tab tape
JPS54133877A (en) Semiconductor device
JPS5559746A (en) Semiconductor device and its mounting circuit device
JPS5412263A (en) Semiconductor element and production of the same
JPS53110371A (en) Ceramic package type semiconductor device
JPS556852A (en) Semiconductor device
TW354411B (en) Semiconductor device and its manufacturing process
JPS5326585A (en) Production of mis semiconductor device
JPS55125637A (en) Production of semiconductor device
JPS5552242A (en) Semiconductor device
JPS5524478A (en) Integrated circuit
JPS5591835A (en) Electronic device
JPS6436055A (en) Method of sealing electronic component
JPS5561045A (en) Packaging device for semiconductor integrated circuit
JPS5513948A (en) Structure of electrode
JPS5379462A (en) Manufacture of semiconductor integrated circuit
JPS53141575A (en) Semiconductor device
JPS56111234A (en) Semiconductor integrated circuit device and manufacture thereof