JPS5240973A - Method of connecting semiconductor devices - Google Patents
Method of connecting semiconductor devicesInfo
- Publication number
- JPS5240973A JPS5240973A JP11661375A JP11661375A JPS5240973A JP S5240973 A JPS5240973 A JP S5240973A JP 11661375 A JP11661375 A JP 11661375A JP 11661375 A JP11661375 A JP 11661375A JP S5240973 A JPS5240973 A JP S5240973A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor devices
- connecting semiconductor
- wirings
- extruded
- proximity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To control the quantity of bump metal being extruded from the direction where a bonding pressure is applied, on the side of a semiconductor substrate, thereby preventing electrical shorting with other wirings in proximity.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11661375A JPS5240973A (en) | 1975-09-26 | 1975-09-26 | Method of connecting semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11661375A JPS5240973A (en) | 1975-09-26 | 1975-09-26 | Method of connecting semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5240973A true JPS5240973A (en) | 1977-03-30 |
Family
ID=14691499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11661375A Pending JPS5240973A (en) | 1975-09-26 | 1975-09-26 | Method of connecting semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5240973A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5439117A (en) * | 1978-07-10 | 1979-03-26 | Matsushita Electric Ind Co Ltd | Musical signal converting device |
JPS5439118A (en) * | 1978-07-10 | 1979-03-26 | Matsushita Electric Ind Co Ltd | Musical sound signal converting device |
JPH0196699A (en) * | 1987-10-08 | 1989-04-14 | Casio Comput Co Ltd | Electronic musical instrument |
US5018002A (en) * | 1989-07-03 | 1991-05-21 | General Electric Company | High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip |
US5053851A (en) * | 1991-01-14 | 1991-10-01 | International Business Machines Corp. | Metal bump for a thermal compression bond and method for making same |
US5059553A (en) * | 1991-01-14 | 1991-10-22 | Ibm Corporation | Metal bump for a thermal compression bond and method for making same |
US5518957A (en) * | 1991-10-10 | 1996-05-21 | Samsung Electronics Co., Ltd. | Method for making a thin profile semiconductor package |
-
1975
- 1975-09-26 JP JP11661375A patent/JPS5240973A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5439117A (en) * | 1978-07-10 | 1979-03-26 | Matsushita Electric Ind Co Ltd | Musical signal converting device |
JPS5439118A (en) * | 1978-07-10 | 1979-03-26 | Matsushita Electric Ind Co Ltd | Musical sound signal converting device |
JPS5735472B2 (en) * | 1978-07-10 | 1982-07-29 | ||
JPS5735473B2 (en) * | 1978-07-10 | 1982-07-29 | ||
JPH0196699A (en) * | 1987-10-08 | 1989-04-14 | Casio Comput Co Ltd | Electronic musical instrument |
US5018002A (en) * | 1989-07-03 | 1991-05-21 | General Electric Company | High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip |
US5053851A (en) * | 1991-01-14 | 1991-10-01 | International Business Machines Corp. | Metal bump for a thermal compression bond and method for making same |
US5059553A (en) * | 1991-01-14 | 1991-10-22 | Ibm Corporation | Metal bump for a thermal compression bond and method for making same |
US5518957A (en) * | 1991-10-10 | 1996-05-21 | Samsung Electronics Co., Ltd. | Method for making a thin profile semiconductor package |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5240973A (en) | Method of connecting semiconductor devices | |
JPS52143785A (en) | Semiconductor device | |
JPS51151069A (en) | Electrode forming method of a semiconductor element | |
JPS51147255A (en) | Semiconductor device | |
JPS52154358A (en) | Production of semiconductor device | |
JPS5263672A (en) | Production of semiconductor device | |
JPS5265666A (en) | Semiconductor device | |
JPS5377172A (en) | Production of semiconductor device | |
JPS5356969A (en) | Production of tape for tape carrier | |
JPS5710951A (en) | Semiconductor device | |
JPS51123086A (en) | Semicanductor device and its production process | |
JPS5362471A (en) | Semiconductor device | |
JPS52116073A (en) | Hermetic structure in which integrated circuit element is sealed up ai rtightly | |
JPS5223281A (en) | Method of manufacturing semiconductor device | |
JPS53140967A (en) | Production of electrodes of semiconductor device | |
JPS5368163A (en) | Production of flip chip | |
JPS5259576A (en) | Semiconductor device | |
JPS5212572A (en) | Semi-conductor device | |
JPS5326585A (en) | Production of mis semiconductor device | |
JPS5268388A (en) | Semiconductor integrated circuit | |
JPS5275279A (en) | Packaging structure for semiconductor devices | |
JPS5211772A (en) | Semiconductor device | |
JPS5283166A (en) | Semiconductor device and its production | |
JPS533085A (en) | Production of semiconductor integrated circuit | |
JPS5313875A (en) | Semiconductor device |