JPS51147255A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS51147255A
JPS51147255A JP50070866A JP7086675A JPS51147255A JP S51147255 A JPS51147255 A JP S51147255A JP 50070866 A JP50070866 A JP 50070866A JP 7086675 A JP7086675 A JP 7086675A JP S51147255 A JPS51147255 A JP S51147255A
Authority
JP
Japan
Prior art keywords
semiconductor device
ccb
manufacturing process
corrosion resistance
solder connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50070866A
Other languages
Japanese (ja)
Inventor
Ryosaku Kanzawa
Hideyuki Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50070866A priority Critical patent/JPS51147255A/en
Publication of JPS51147255A publication Critical patent/JPS51147255A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: In a semiconductor device employing the CCB (Controlled Collapse Bonding) method, to obtain with a minimum change in the manufacturing process, a device with improved corrosion resistance at the solder connection and higher stability in the surface of the semiconductor chip.
COPYRIGHT: (C)1976,JPO&Japio
JP50070866A 1975-06-13 1975-06-13 Semiconductor device Pending JPS51147255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50070866A JPS51147255A (en) 1975-06-13 1975-06-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50070866A JPS51147255A (en) 1975-06-13 1975-06-13 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS51147255A true JPS51147255A (en) 1976-12-17

Family

ID=13443900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50070866A Pending JPS51147255A (en) 1975-06-13 1975-06-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS51147255A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5891646A (en) * 1981-11-26 1983-05-31 Toshiba Corp Semiconductor device
JPS5920633U (en) * 1982-07-30 1984-02-08 富士通株式会社 Bump junction type semiconductor device
JPS5972780A (en) * 1982-10-19 1984-04-24 Nippon Denso Co Ltd Photoelectric conversion device
JPS5988864A (en) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS5994441A (en) * 1982-11-19 1984-05-31 Nippon Denso Co Ltd Semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5891646A (en) * 1981-11-26 1983-05-31 Toshiba Corp Semiconductor device
JPS5920633U (en) * 1982-07-30 1984-02-08 富士通株式会社 Bump junction type semiconductor device
JPH0215321Y2 (en) * 1982-07-30 1990-04-25
JPS5972780A (en) * 1982-10-19 1984-04-24 Nippon Denso Co Ltd Photoelectric conversion device
JPS5988864A (en) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS5994441A (en) * 1982-11-19 1984-05-31 Nippon Denso Co Ltd Semiconductor device
JPH0454973B2 (en) * 1982-11-19 1992-09-01 Nippon Denso Co

Similar Documents

Publication Publication Date Title
JPS51147255A (en) Semiconductor device
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5391577A (en) Manufacture of semiconductor device of resinsealing type
JPS51147286A (en) Manufacturing process of semiconductor
JPS5348461A (en) Wire bonder
JPS5263672A (en) Production of semiconductor device
JPS5378768A (en) Wire bonding method of semiconductor element
JPS52115176A (en) Ball soldering method
JPS5230163A (en) Method for junction of semiconductor parts
JPS5211770A (en) Semiconductor device
JPS51112279A (en) Semiconductor device
JPS51112268A (en) Semiconductor device and its production method
JPS5210084A (en) Dual directional negative resistance semiconductor device
JPS52156583A (en) Electrode formation method in semiconductor device
JPS5210676A (en) Semiconductor device
JPS52143767A (en) Production of semiconductor device
JPS5396670A (en) Pellet bonding method
JPS5360738A (en) Perforated semiconductor ceramic heating element
JPS51151070A (en) Connection method of a semiconductor apparatus
JPS51114871A (en) Semiconductor device formation method
JPS52143186A (en) Taping device
JPS5361980A (en) Production of semiconductor device
JPS51145269A (en) Semiconductor device
JPS5341176A (en) Semiconductor device
JPS5352365A (en) Semiconductor device