JPS5211770A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5211770A JPS5211770A JP50088156A JP8815675A JPS5211770A JP S5211770 A JPS5211770 A JP S5211770A JP 50088156 A JP50088156 A JP 50088156A JP 8815675 A JP8815675 A JP 8815675A JP S5211770 A JPS5211770 A JP S5211770A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- cavities
- cavity
- substrate
- connect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE: To connect the semiconductor element and an external electrode by processing a cavity in the substrate and by placing metal balls in the cavities.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50088156A JPS5211770A (en) | 1975-07-17 | 1975-07-17 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50088156A JPS5211770A (en) | 1975-07-17 | 1975-07-17 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5211770A true JPS5211770A (en) | 1977-01-28 |
Family
ID=13935050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50088156A Pending JPS5211770A (en) | 1975-07-17 | 1975-07-17 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5211770A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54145487A (en) * | 1978-01-28 | 1979-11-13 | Int Computers Ltd | Method of fabricating circuit structure and circuit structure |
JPS57143473U (en) * | 1981-03-03 | 1982-09-08 | ||
JP2005311358A (en) * | 2004-04-19 | 2005-11-04 | General Electric Co <Ge> | Electronic apparatus assembly and device and method of assembling the same |
-
1975
- 1975-07-17 JP JP50088156A patent/JPS5211770A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54145487A (en) * | 1978-01-28 | 1979-11-13 | Int Computers Ltd | Method of fabricating circuit structure and circuit structure |
JPS57143473U (en) * | 1981-03-03 | 1982-09-08 | ||
JP2005311358A (en) * | 2004-04-19 | 2005-11-04 | General Electric Co <Ge> | Electronic apparatus assembly and device and method of assembling the same |
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