JPS51115775A - Semiconductor apparatus - Google Patents

Semiconductor apparatus

Info

Publication number
JPS51115775A
JPS51115775A JP4023675A JP4023675A JPS51115775A JP S51115775 A JPS51115775 A JP S51115775A JP 4023675 A JP4023675 A JP 4023675A JP 4023675 A JP4023675 A JP 4023675A JP S51115775 A JPS51115775 A JP S51115775A
Authority
JP
Japan
Prior art keywords
semiconductor
reliability
stability
low cost
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4023675A
Other languages
Japanese (ja)
Other versions
JPS5816339B2 (en
Inventor
Manabu Bonshihara
Tsuneo Shishido
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP4023675A priority Critical patent/JPS5816339B2/ja
Publication of JPS51115775A publication Critical patent/JPS51115775A/en
Publication of JPS5816339B2 publication Critical patent/JPS5816339B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: A semiconductor apparatus , which used a lead frame, which can be made with a low cost, also with high reliability and stability.
COPYRIGHT: (C)1976,JPO&Japio
JP4023675A 1975-04-04 1975-04-04 Expired JPS5816339B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4023675A JPS5816339B2 (en) 1975-04-04 1975-04-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4023675A JPS5816339B2 (en) 1975-04-04 1975-04-04

Publications (2)

Publication Number Publication Date
JPS51115775A true JPS51115775A (en) 1976-10-12
JPS5816339B2 JPS5816339B2 (en) 1983-03-30

Family

ID=12575076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4023675A Expired JPS5816339B2 (en) 1975-04-04 1975-04-04

Country Status (1)

Country Link
JP (1) JPS5816339B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522171A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Electronic parts
JPS57129229U (en) * 1981-02-06 1982-08-12
JPS5817649A (en) * 1981-07-24 1983-02-01 Fujitsu Ltd Package for electronic part
JPS58111958U (en) * 1982-01-21 1983-07-30
JPS61258461A (en) * 1986-05-23 1986-11-15 Hitachi Ltd Electronic part
JPS63296346A (en) * 1987-05-28 1988-12-02 Hitachi Cable Ltd Film carrier for semiconductor device
JPH041504B2 (en) * 1986-05-23 1992-01-13 Hitachi Ltd
JPH10163519A (en) * 1996-10-01 1998-06-19 Toshiba Corp Semiconductor device and manufacture thereof
US6087712A (en) * 1997-12-26 2000-07-11 Samsung Aerospace Industries, Ltd. Lead frame containing leads plated with tin alloy for increased wettability and method for plating the leads

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522171A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Electronic parts
JPS5510140B2 (en) * 1975-06-24 1980-03-14
JPS57129229U (en) * 1981-02-06 1982-08-12
JPS5817649A (en) * 1981-07-24 1983-02-01 Fujitsu Ltd Package for electronic part
JPS6259892B2 (en) * 1981-07-24 1987-12-14 Fujitsu Ltd
JPS58111958U (en) * 1982-01-21 1983-07-30
JPH0410699Y2 (en) * 1982-01-21 1992-03-17
JPS61258461A (en) * 1986-05-23 1986-11-15 Hitachi Ltd Electronic part
JPH041504B2 (en) * 1986-05-23 1992-01-13 Hitachi Ltd
JPS63296346A (en) * 1987-05-28 1988-12-02 Hitachi Cable Ltd Film carrier for semiconductor device
JPH10163519A (en) * 1996-10-01 1998-06-19 Toshiba Corp Semiconductor device and manufacture thereof
US6087712A (en) * 1997-12-26 2000-07-11 Samsung Aerospace Industries, Ltd. Lead frame containing leads plated with tin alloy for increased wettability and method for plating the leads

Also Published As

Publication number Publication date
JPS5816339B2 (en) 1983-03-30

Similar Documents

Publication Publication Date Title
JPS5222578A (en) Stabilizing agent for organic materials
JPS52135612A (en) Clock pulse reproduction circuit
JPS5341968A (en) Semiconductor circuit
JPS5251327A (en) 3-trihydroxygermylpropionic acid and its salts and process for prepari ng the same
JPS51130154A (en) Flip-flop circuit
JPS5283113A (en) Communication system for picture and writings
JPS51111072A (en) Photo etching method
JPS5225850A (en) Ethylene-tetrafluoroethylene copolymer composition with improved heat stability
JPS522277A (en) Soldering device
JPS51136208A (en) Voice recognition device for limited words
JPS5420568A (en) Device for loading and unloading at turntable
JPS51118395A (en) Semiconductor emitting unit and manufacturing process
JPS5227540A (en) Constant-voltage supply circuit
JPS51130743A (en) Wave-energy application device
JPS5213642A (en) Panel board for temporary works
JPS5237413A (en) Magnetic recorder
JPS5230381A (en) Semiconductor integrating circuit
JPS52115641A (en) Error correct circuit using three power raising circuit
JPS5816339B2 (en)
JPS5216068A (en) Parts insertion device
JPS51130156A (en) Frequency multiplier
JPS5230167A (en) Method for production of semiconductor device
JPS526073A (en) Magnetic field type electronic lens
JPS51130174A (en) Semiconductor device process
JPS525300A (en) Display