JPS5230163A - Method for junction of semiconductor parts - Google Patents
Method for junction of semiconductor partsInfo
- Publication number
- JPS5230163A JPS5230163A JP10592975A JP10592975A JPS5230163A JP S5230163 A JPS5230163 A JP S5230163A JP 10592975 A JP10592975 A JP 10592975A JP 10592975 A JP10592975 A JP 10592975A JP S5230163 A JPS5230163 A JP S5230163A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor parts
- junction
- substrate
- semiconductor
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83051—Forming additional members, e.g. dam structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE: A method for junction of semiconductor parts, by which semiconductor parts can be attached to the desired part of the substrate and no bubbles are formed in the solder between the substrate and the semiconductor parts without the necessity for use of large heating furnace.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10592975A JPS5230163A (en) | 1975-09-03 | 1975-09-03 | Method for junction of semiconductor parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10592975A JPS5230163A (en) | 1975-09-03 | 1975-09-03 | Method for junction of semiconductor parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5230163A true JPS5230163A (en) | 1977-03-07 |
Family
ID=14420535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10592975A Pending JPS5230163A (en) | 1975-09-03 | 1975-09-03 | Method for junction of semiconductor parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5230163A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5461469A (en) * | 1977-10-25 | 1979-05-17 | Mitsubishi Electric Corp | Manufacture for semiconductor device |
JPH01305862A (en) * | 1988-06-03 | 1989-12-11 | Nippon Steel Corp | Bn-aln type sintered body having anisotropy and its production |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4840807A (en) * | 1971-09-25 | 1973-06-15 |
-
1975
- 1975-09-03 JP JP10592975A patent/JPS5230163A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4840807A (en) * | 1971-09-25 | 1973-06-15 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5461469A (en) * | 1977-10-25 | 1979-05-17 | Mitsubishi Electric Corp | Manufacture for semiconductor device |
JPH01305862A (en) * | 1988-06-03 | 1989-12-11 | Nippon Steel Corp | Bn-aln type sintered body having anisotropy and its production |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS51123561A (en) | Production method of semicondvctor device | |
JPS5337383A (en) | Semiconductor integrated circuit | |
JPS5230163A (en) | Method for junction of semiconductor parts | |
JPS51151390A (en) | Process for preparing long chain alpha-oxycarboxylic acids | |
JPS51147255A (en) | Semiconductor device | |
JPS5233143A (en) | Compressive molten bath method by industive heat way | |
JPS5236980A (en) | Heat sink for semiconductor devices | |
JPS53142877A (en) | Manufacture for compound semiconductor device | |
JPS5219975A (en) | Semiconductor device | |
JPS5218173A (en) | Soldering method of semiconductor element | |
JPS5228879A (en) | Semiconductor device and method for its production | |
JPS5427772A (en) | Production of semiconductor devices | |
JPS525700A (en) | The process for production of silicon nitride | |
JPS52106681A (en) | Etching method | |
JPS5228262A (en) | Process for assembling semiconductor device | |
JPS51111478A (en) | A method of producing semiconductor crystal | |
JPS5273673A (en) | Production of semiconductor device | |
JPS52179A (en) | Method of fabricating semiconductor | |
JPS52143186A (en) | Taping device | |
JPS51150286A (en) | Production method of semiconductor device | |
JPS5261956A (en) | Production of semiconductor device | |
JPS5242367A (en) | Method of preventing occurence of crystal defects of silicon wafers | |
JPS51138164A (en) | Production method of package for semiconductor circuit element | |
JPS532075A (en) | Appraisal method for semiconductor crystal | |
JPS51151071A (en) | Manufacturing method of a semiconductor apparatus |