JPS51112268A - Semiconductor device and its production method - Google Patents

Semiconductor device and its production method

Info

Publication number
JPS51112268A
JPS51112268A JP3678775A JP3678775A JPS51112268A JP S51112268 A JPS51112268 A JP S51112268A JP 3678775 A JP3678775 A JP 3678775A JP 3678775 A JP3678775 A JP 3678775A JP S51112268 A JPS51112268 A JP S51112268A
Authority
JP
Japan
Prior art keywords
semiconductor device
production method
thickness
preset value
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3678775A
Other languages
Japanese (ja)
Inventor
Kunio Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3678775A priority Critical patent/JPS51112268A/en
Publication of JPS51112268A publication Critical patent/JPS51112268A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Abstract

PURPOSE: A semiconductor device which can control the thickness of soldering material in a soldered electrode to a desired preset value and its production method.
COPYRIGHT: (C)1976,JPO&Japio
JP3678775A 1975-03-28 1975-03-28 Semiconductor device and its production method Pending JPS51112268A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3678775A JPS51112268A (en) 1975-03-28 1975-03-28 Semiconductor device and its production method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3678775A JPS51112268A (en) 1975-03-28 1975-03-28 Semiconductor device and its production method

Publications (1)

Publication Number Publication Date
JPS51112268A true JPS51112268A (en) 1976-10-04

Family

ID=12479480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3678775A Pending JPS51112268A (en) 1975-03-28 1975-03-28 Semiconductor device and its production method

Country Status (1)

Country Link
JP (1) JPS51112268A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378964U (en) * 1976-12-02 1978-06-30
JPS54146169U (en) * 1978-03-31 1979-10-11

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378964U (en) * 1976-12-02 1978-06-30
JPS54146169U (en) * 1978-03-31 1979-10-11

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