JPS5240062A - Process for production of semiconductor devices - Google Patents

Process for production of semiconductor devices

Info

Publication number
JPS5240062A
JPS5240062A JP11562775A JP11562775A JPS5240062A JP S5240062 A JPS5240062 A JP S5240062A JP 11562775 A JP11562775 A JP 11562775A JP 11562775 A JP11562775 A JP 11562775A JP S5240062 A JPS5240062 A JP S5240062A
Authority
JP
Japan
Prior art keywords
production
semiconductor devices
electrode
standardize
simplification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11562775A
Other languages
Japanese (ja)
Inventor
Nobuhiro Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11562775A priority Critical patent/JPS5240062A/en
Publication of JPS5240062A publication Critical patent/JPS5240062A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To standardize electrode position of semiconductor pellets and lead frame for said electrode thereby achieving the reduction in costs and the simplification of control.
COPYRIGHT: (C)1977,JPO&Japio
JP11562775A 1975-09-26 1975-09-26 Process for production of semiconductor devices Pending JPS5240062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11562775A JPS5240062A (en) 1975-09-26 1975-09-26 Process for production of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11562775A JPS5240062A (en) 1975-09-26 1975-09-26 Process for production of semiconductor devices

Publications (1)

Publication Number Publication Date
JPS5240062A true JPS5240062A (en) 1977-03-28

Family

ID=14667319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11562775A Pending JPS5240062A (en) 1975-09-26 1975-09-26 Process for production of semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5240062A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57114261A (en) * 1981-01-07 1982-07-16 Hitachi Ltd Lead frame structure
JPS5992556A (en) * 1982-11-19 1984-05-28 Hitachi Ltd Semiconductor device
JPS61218139A (en) * 1985-03-25 1986-09-27 Hitachi Chiyou Lsi Eng Kk Semiconductor device
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
JPH02158159A (en) * 1988-12-12 1990-06-18 Mitsubishi Electric Corp Semiconductor integrated circuit device and manufacture thereof
US4984059A (en) * 1982-10-08 1991-01-08 Fujitsu Limited Semiconductor device and a method for fabricating the same
JPH03250654A (en) * 1990-02-28 1991-11-08 Hitachi Ltd Resin-sealing semiconductor device and lead frame
US5278101A (en) * 1989-06-28 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
JPH08227968A (en) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp Semiconductor device
JPH08227903A (en) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp Semiconductor device
JPH08227967A (en) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp Manufacture of semiconductor device
US5917242A (en) * 1996-05-20 1999-06-29 Micron Technology, Inc. Combination of semiconductor interconnect

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57114261A (en) * 1981-01-07 1982-07-16 Hitachi Ltd Lead frame structure
USRE35109E (en) * 1982-10-08 1995-12-05 Fujitsu Limited Semiconductor device and method for fabricating the same
US4984059A (en) * 1982-10-08 1991-01-08 Fujitsu Limited Semiconductor device and a method for fabricating the same
JPS5992556A (en) * 1982-11-19 1984-05-28 Hitachi Ltd Semiconductor device
JPS61218139A (en) * 1985-03-25 1986-09-27 Hitachi Chiyou Lsi Eng Kk Semiconductor device
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
JPH02158159A (en) * 1988-12-12 1990-06-18 Mitsubishi Electric Corp Semiconductor integrated circuit device and manufacture thereof
US5278101A (en) * 1989-06-28 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
JPH03250654A (en) * 1990-02-28 1991-11-08 Hitachi Ltd Resin-sealing semiconductor device and lead frame
JP2528991B2 (en) * 1990-02-28 1996-08-28 株式会社日立製作所 Resin-sealed semiconductor device and lead frame
JPH08227968A (en) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp Semiconductor device
JPH08227903A (en) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp Semiconductor device
JPH08227967A (en) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp Manufacture of semiconductor device
JP2756436B2 (en) * 1995-12-28 1998-05-25 日立超エル・エス・アイ・エンジニアリング 株式会社 Semiconductor device and manufacturing method thereof
US5917242A (en) * 1996-05-20 1999-06-29 Micron Technology, Inc. Combination of semiconductor interconnect
US6080264A (en) * 1996-05-20 2000-06-27 Micron Technology, Inc. Combination of semiconductor interconnect

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