JPS5260567A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5260567A
JPS5260567A JP13698175A JP13698175A JPS5260567A JP S5260567 A JPS5260567 A JP S5260567A JP 13698175 A JP13698175 A JP 13698175A JP 13698175 A JP13698175 A JP 13698175A JP S5260567 A JPS5260567 A JP S5260567A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
semiconductor
pellets
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13698175A
Other languages
Japanese (ja)
Other versions
JPS5846858B2 (en
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP50136981A priority Critical patent/JPS5846858B2/en
Publication of JPS5260567A publication Critical patent/JPS5260567A/en
Publication of JPS5846858B2 publication Critical patent/JPS5846858B2/en
Expired legal-status Critical Current

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  • Dicing (AREA)

Abstract

PURPOSE: To make possible the high-yield and efficient subdividing of a semiconductor wafer in particular to semiconductor pellets, in a process for production of semiconductor devices producing a multiplicity of semiconductor pellets from one sheet of a semiconductor wafer.
COPYRIGHT: (C)1977,JPO&Japio
JP50136981A 1975-11-13 1975-11-13 hand tai souchi no seizou houhou Expired JPS5846858B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50136981A JPS5846858B2 (en) 1975-11-13 1975-11-13 hand tai souchi no seizou houhou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50136981A JPS5846858B2 (en) 1975-11-13 1975-11-13 hand tai souchi no seizou houhou

Publications (2)

Publication Number Publication Date
JPS5260567A true JPS5260567A (en) 1977-05-19
JPS5846858B2 JPS5846858B2 (en) 1983-10-19

Family

ID=15187970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50136981A Expired JPS5846858B2 (en) 1975-11-13 1975-11-13 hand tai souchi no seizou houhou

Country Status (1)

Country Link
JP (1) JPS5846858B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783225A (en) * 1982-07-30 1988-11-08 Hitachi, Ltd. Wafer and method of working the same
JPH04352452A (en) * 1991-05-30 1992-12-07 Sharp Corp Dividing method for wafer
US5230747A (en) * 1982-07-30 1993-07-27 Hitachi, Ltd. Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer
US5279992A (en) * 1982-07-30 1994-01-18 Hitachi, Ltd. Method of producing a wafer having a curved notch
US5413659A (en) * 1993-09-30 1995-05-09 Minnesota Mining And Manufacturing Company Array of conductive pathways

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783225A (en) * 1982-07-30 1988-11-08 Hitachi, Ltd. Wafer and method of working the same
US5230747A (en) * 1982-07-30 1993-07-27 Hitachi, Ltd. Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer
US5279992A (en) * 1982-07-30 1994-01-18 Hitachi, Ltd. Method of producing a wafer having a curved notch
USRE40139E1 (en) * 1982-07-30 2008-03-04 Renesas Technology Corp. Wafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the wafer
JPH04352452A (en) * 1991-05-30 1992-12-07 Sharp Corp Dividing method for wafer
US5413659A (en) * 1993-09-30 1995-05-09 Minnesota Mining And Manufacturing Company Array of conductive pathways
US5529829A (en) * 1993-09-30 1996-06-25 Minnesota Mining And Manufacturing Company Array of conductive pathways

Also Published As

Publication number Publication date
JPS5846858B2 (en) 1983-10-19

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