JPS51113459A - A method for manufacturing semiconductor devices - Google Patents

A method for manufacturing semiconductor devices

Info

Publication number
JPS51113459A
JPS51113459A JP3843175A JP3843175A JPS51113459A JP S51113459 A JPS51113459 A JP S51113459A JP 3843175 A JP3843175 A JP 3843175A JP 3843175 A JP3843175 A JP 3843175A JP S51113459 A JPS51113459 A JP S51113459A
Authority
JP
Japan
Prior art keywords
semiconductor devices
manufacturing semiconductor
processes
operation efficiency
improve operation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3843175A
Other languages
Japanese (ja)
Other versions
JPS5536184B2 (en
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP3843175A priority Critical patent/JPS51113459A/en
Publication of JPS51113459A publication Critical patent/JPS51113459A/en
Publication of JPS5536184B2 publication Critical patent/JPS5536184B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To improve operation efficiency by decreasing number of processes for finely dividing a semiconductor water.
COPYRIGHT: (C)1976,JPO&Japio
JP3843175A 1975-03-29 1975-03-29 A method for manufacturing semiconductor devices Granted JPS51113459A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3843175A JPS51113459A (en) 1975-03-29 1975-03-29 A method for manufacturing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3843175A JPS51113459A (en) 1975-03-29 1975-03-29 A method for manufacturing semiconductor devices

Publications (2)

Publication Number Publication Date
JPS51113459A true JPS51113459A (en) 1976-10-06
JPS5536184B2 JPS5536184B2 (en) 1980-09-19

Family

ID=12525106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3843175A Granted JPS51113459A (en) 1975-03-29 1975-03-29 A method for manufacturing semiconductor devices

Country Status (1)

Country Link
JP (1) JPS51113459A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS524780A (en) * 1975-07-01 1977-01-14 Fujitsu Ltd Manufacturing method of semiconductor equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS524780A (en) * 1975-07-01 1977-01-14 Fujitsu Ltd Manufacturing method of semiconductor equipment

Also Published As

Publication number Publication date
JPS5536184B2 (en) 1980-09-19

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