JPS5276872A - Cutting method of semiconductor wafer - Google Patents
Cutting method of semiconductor waferInfo
- Publication number
- JPS5276872A JPS5276872A JP15276375A JP15276375A JPS5276872A JP S5276872 A JPS5276872 A JP S5276872A JP 15276375 A JP15276375 A JP 15276375A JP 15276375 A JP15276375 A JP 15276375A JP S5276872 A JPS5276872 A JP S5276872A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- cutting method
- wafer
- blocks
- adsorbing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To cut out wafer by aligning scribed line on the upper hem of the adjacent blocks and adsorbing the wafer and by bending the blocks.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15276375A JPS5276872A (en) | 1975-12-23 | 1975-12-23 | Cutting method of semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15276375A JPS5276872A (en) | 1975-12-23 | 1975-12-23 | Cutting method of semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5276872A true JPS5276872A (en) | 1977-06-28 |
Family
ID=15547606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15276375A Pending JPS5276872A (en) | 1975-12-23 | 1975-12-23 | Cutting method of semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5276872A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012109358A (en) * | 2010-11-16 | 2012-06-07 | Tokyo Seimitsu Co Ltd | Cutting method and cutting device of semiconductor substrate |
JP2012146897A (en) * | 2011-01-14 | 2012-08-02 | Tokyo Seimitsu Co Ltd | Cutting method for semiconductor wafer and cutting apparatus |
-
1975
- 1975-12-23 JP JP15276375A patent/JPS5276872A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012109358A (en) * | 2010-11-16 | 2012-06-07 | Tokyo Seimitsu Co Ltd | Cutting method and cutting device of semiconductor substrate |
JP2012146897A (en) * | 2011-01-14 | 2012-08-02 | Tokyo Seimitsu Co Ltd | Cutting method for semiconductor wafer and cutting apparatus |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5276872A (en) | Cutting method of semiconductor wafer | |
JPS525273A (en) | Transistor | |
JPS5441665A (en) | Manufacture for semiconductor device | |
JPS5383467A (en) | Production of semiconductor device | |
JPS5211837A (en) | Input-output interface starting method | |
JPS51121272A (en) | Manufacturing method for semiconductor devices | |
JPS51118187A (en) | Method of cutting brittle materials | |
JPS51150185A (en) | Shearing processing | |
JPS52127007A (en) | Voice recognition method | |
JPS524780A (en) | Manufacturing method of semiconductor equipment | |
JPS51118384A (en) | Manufacturing prouss for mos type semiconductor unit | |
JPS5211761A (en) | Method of cutting semiconductor wafers | |
JPS525700A (en) | The process for production of silicon nitride | |
JPS51138166A (en) | Production method of semiconductor device | |
JPS5230171A (en) | Method for fabrication of semiconductor device | |
JPS51131277A (en) | Semi-conductor unit manufacturing process | |
JPS51116477A (en) | Clamping tool | |
JPS51126062A (en) | Tap short bonding method on wire bonding | |
JPS51142795A (en) | Grinding device | |
JPS51140198A (en) | Crystal working process | |
JPS5366157A (en) | Method for semiconductor processing | |
JPS52179A (en) | Method of fabricating semiconductor | |
JPS51123887A (en) | Method for preparing l-cysteine | |
JPS51137980A (en) | High feed multiblade cutting tool | |
JPS5294070A (en) | Process for preparing semi-conductor |