JPS51140198A - Crystal working process - Google Patents
Crystal working processInfo
- Publication number
- JPS51140198A JPS51140198A JP6421875A JP6421875A JPS51140198A JP S51140198 A JPS51140198 A JP S51140198A JP 6421875 A JP6421875 A JP 6421875A JP 6421875 A JP6421875 A JP 6421875A JP S51140198 A JPS51140198 A JP S51140198A
- Authority
- JP
- Japan
- Prior art keywords
- working process
- crystal working
- crystal
- cutting process
- providing favorable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Thin Magnetic Films (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE: Cutting process to be able to obtain the wafer providing favorable superficial condition.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6421875A JPS51140198A (en) | 1975-05-30 | 1975-05-30 | Crystal working process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6421875A JPS51140198A (en) | 1975-05-30 | 1975-05-30 | Crystal working process |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51140198A true JPS51140198A (en) | 1976-12-02 |
Family
ID=13251725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6421875A Pending JPS51140198A (en) | 1975-05-30 | 1975-05-30 | Crystal working process |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51140198A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58160107A (en) * | 1982-03-18 | 1983-09-22 | 信越化学工業株式会社 | Method of cutting single crystal |
-
1975
- 1975-05-30 JP JP6421875A patent/JPS51140198A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58160107A (en) * | 1982-03-18 | 1983-09-22 | 信越化学工業株式会社 | Method of cutting single crystal |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS51140199A (en) | Crystal working process | |
JPS51140198A (en) | Crystal working process | |
JPS5441067A (en) | Production of semiconductor devices | |
JPS51151390A (en) | Process for preparing long chain alpha-oxycarboxylic acids | |
JPS51116477A (en) | Clamping tool | |
JPS5276872A (en) | Cutting method of semiconductor wafer | |
JPS51142795A (en) | Grinding device | |
JPS5237375A (en) | Device for aranging moving intervals of articles to be carried | |
JPS51137988A (en) | Cutting tool changing apparatus for use in cutting machines | |
JPS525485A (en) | Conjunction process of superconductive cable | |
JPS544568A (en) | Semiconductor device and production of the same | |
JPS51123887A (en) | Method for preparing l-cysteine | |
JPS51131277A (en) | Semi-conductor unit manufacturing process | |
JPS5230171A (en) | Method for fabrication of semiconductor device | |
JPS5351892A (en) | Surface working bench | |
JPS51138166A (en) | Production method of semiconductor device | |
JPS5217609A (en) | Motor | |
JPS5270772A (en) | Semiconductor rectifier | |
JPS51137980A (en) | High feed multiblade cutting tool | |
JPS5363885A (en) | Production apparatus of solid device | |
JPS5351962A (en) | Dicing unit providing automatic handling mechanism | |
JPS5261956A (en) | Production of semiconductor device | |
JPS5211761A (en) | Method of cutting semiconductor wafers | |
JPS51148008A (en) | Process for preparing therapeutic agents for leukemia | |
JPS5218283A (en) | Cutting device |