JPS5211761A - Method of cutting semiconductor wafers - Google Patents

Method of cutting semiconductor wafers

Info

Publication number
JPS5211761A
JPS5211761A JP8667775A JP8667775A JPS5211761A JP S5211761 A JPS5211761 A JP S5211761A JP 8667775 A JP8667775 A JP 8667775A JP 8667775 A JP8667775 A JP 8667775A JP S5211761 A JPS5211761 A JP S5211761A
Authority
JP
Japan
Prior art keywords
semiconductor wafers
cutting semiconductor
cutting
wafers
diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8667775A
Other languages
Japanese (ja)
Inventor
Shotaro Uchida
Kazuhiko Okubo
Sohei Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8667775A priority Critical patent/JPS5211761A/en
Publication of JPS5211761A publication Critical patent/JPS5211761A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To improve the cutting of wafers by providing cut lines by diffusion on both surfaces of wafers.
COPYRIGHT: (C)1977,JPO&Japio
JP8667775A 1975-07-17 1975-07-17 Method of cutting semiconductor wafers Pending JPS5211761A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8667775A JPS5211761A (en) 1975-07-17 1975-07-17 Method of cutting semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8667775A JPS5211761A (en) 1975-07-17 1975-07-17 Method of cutting semiconductor wafers

Publications (1)

Publication Number Publication Date
JPS5211761A true JPS5211761A (en) 1977-01-28

Family

ID=13893643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8667775A Pending JPS5211761A (en) 1975-07-17 1975-07-17 Method of cutting semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS5211761A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192500A (en) * 2013-03-28 2014-10-06 Shindengen Electric Mfg Co Ltd Method of manufacturing mesa type semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192500A (en) * 2013-03-28 2014-10-06 Shindengen Electric Mfg Co Ltd Method of manufacturing mesa type semiconductor device

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