JPS52140275A - Processing method for semiconductor wafer - Google Patents

Processing method for semiconductor wafer

Info

Publication number
JPS52140275A
JPS52140275A JP5655076A JP5655076A JPS52140275A JP S52140275 A JPS52140275 A JP S52140275A JP 5655076 A JP5655076 A JP 5655076A JP 5655076 A JP5655076 A JP 5655076A JP S52140275 A JPS52140275 A JP S52140275A
Authority
JP
Japan
Prior art keywords
processing method
semiconductor wafer
wafer
applying
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5655076A
Other languages
Japanese (ja)
Inventor
Koichi Moriyama
Toshitaka Yamamoto
Minoru Otsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5655076A priority Critical patent/JPS52140275A/en
Publication of JPS52140275A publication Critical patent/JPS52140275A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the anti-voltage deterioration by applying the laser scribe on both surfaces of the wafer.
COPYRIGHT: (C)1977,JPO&Japio
JP5655076A 1976-05-19 1976-05-19 Processing method for semiconductor wafer Pending JPS52140275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5655076A JPS52140275A (en) 1976-05-19 1976-05-19 Processing method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5655076A JPS52140275A (en) 1976-05-19 1976-05-19 Processing method for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS52140275A true JPS52140275A (en) 1977-11-22

Family

ID=13030197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5655076A Pending JPS52140275A (en) 1976-05-19 1976-05-19 Processing method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS52140275A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6136668A (en) * 1996-09-24 2000-10-24 Mitsubishi Denki Kabushiki Kaisha Method of dicing semiconductor wafer
US6420776B1 (en) * 2001-03-01 2002-07-16 Amkor Technology, Inc. Structure including electronic components singulated using laser cutting

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6136668A (en) * 1996-09-24 2000-10-24 Mitsubishi Denki Kabushiki Kaisha Method of dicing semiconductor wafer
US6329671B1 (en) 1996-09-24 2001-12-11 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
US6420776B1 (en) * 2001-03-01 2002-07-16 Amkor Technology, Inc. Structure including electronic components singulated using laser cutting

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