JPS52140275A - Processing method for semiconductor wafer - Google Patents
Processing method for semiconductor waferInfo
- Publication number
- JPS52140275A JPS52140275A JP5655076A JP5655076A JPS52140275A JP S52140275 A JPS52140275 A JP S52140275A JP 5655076 A JP5655076 A JP 5655076A JP 5655076 A JP5655076 A JP 5655076A JP S52140275 A JPS52140275 A JP S52140275A
- Authority
- JP
- Japan
- Prior art keywords
- processing method
- semiconductor wafer
- wafer
- applying
- prevent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To prevent the anti-voltage deterioration by applying the laser scribe on both surfaces of the wafer.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5655076A JPS52140275A (en) | 1976-05-19 | 1976-05-19 | Processing method for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5655076A JPS52140275A (en) | 1976-05-19 | 1976-05-19 | Processing method for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52140275A true JPS52140275A (en) | 1977-11-22 |
Family
ID=13030197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5655076A Pending JPS52140275A (en) | 1976-05-19 | 1976-05-19 | Processing method for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52140275A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6136668A (en) * | 1996-09-24 | 2000-10-24 | Mitsubishi Denki Kabushiki Kaisha | Method of dicing semiconductor wafer |
US6420776B1 (en) * | 2001-03-01 | 2002-07-16 | Amkor Technology, Inc. | Structure including electronic components singulated using laser cutting |
-
1976
- 1976-05-19 JP JP5655076A patent/JPS52140275A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6136668A (en) * | 1996-09-24 | 2000-10-24 | Mitsubishi Denki Kabushiki Kaisha | Method of dicing semiconductor wafer |
US6329671B1 (en) | 1996-09-24 | 2001-12-11 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
US6420776B1 (en) * | 2001-03-01 | 2002-07-16 | Amkor Technology, Inc. | Structure including electronic components singulated using laser cutting |
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