JPS5373075A - Treatment method for wafer surface - Google Patents
Treatment method for wafer surfaceInfo
- Publication number
- JPS5373075A JPS5373075A JP14963476A JP14963476A JPS5373075A JP S5373075 A JPS5373075 A JP S5373075A JP 14963476 A JP14963476 A JP 14963476A JP 14963476 A JP14963476 A JP 14963476A JP S5373075 A JPS5373075 A JP S5373075A
- Authority
- JP
- Japan
- Prior art keywords
- wafer surface
- treatment method
- metal
- forming
- grain size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE: To form a rough surface on a wafer surface by forming the metal-evaporated layer of a prescribed grain size on the wafer surface and then by removing it through ion etching.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14963476A JPS5373075A (en) | 1976-12-13 | 1976-12-13 | Treatment method for wafer surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14963476A JPS5373075A (en) | 1976-12-13 | 1976-12-13 | Treatment method for wafer surface |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5373075A true JPS5373075A (en) | 1978-06-29 |
JPS563662B2 JPS563662B2 (en) | 1981-01-26 |
Family
ID=15479503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14963476A Granted JPS5373075A (en) | 1976-12-13 | 1976-12-13 | Treatment method for wafer surface |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5373075A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57141925A (en) * | 1980-12-19 | 1982-09-02 | Western Electric Co | Method of producing semiconductor device |
JP2005510884A (en) * | 2001-11-29 | 2005-04-21 | オリジン エナジー ソーラー ピーティーワイ リミテッド | Semiconductor texturing process |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6142199Y2 (en) * | 1980-05-27 | 1986-12-01 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51111090A (en) * | 1975-03-26 | 1976-10-01 | Hitachi Ltd | Semiconductor device manufacturing process |
-
1976
- 1976-12-13 JP JP14963476A patent/JPS5373075A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51111090A (en) * | 1975-03-26 | 1976-10-01 | Hitachi Ltd | Semiconductor device manufacturing process |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57141925A (en) * | 1980-12-19 | 1982-09-02 | Western Electric Co | Method of producing semiconductor device |
JP2005510884A (en) * | 2001-11-29 | 2005-04-21 | オリジン エナジー ソーラー ピーティーワイ リミテッド | Semiconductor texturing process |
Also Published As
Publication number | Publication date |
---|---|
JPS563662B2 (en) | 1981-01-26 |
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