JPS5314551A - Working method of wafers - Google Patents

Working method of wafers

Info

Publication number
JPS5314551A
JPS5314551A JP8815676A JP8815676A JPS5314551A JP S5314551 A JPS5314551 A JP S5314551A JP 8815676 A JP8815676 A JP 8815676A JP 8815676 A JP8815676 A JP 8815676A JP S5314551 A JPS5314551 A JP S5314551A
Authority
JP
Japan
Prior art keywords
wafers
working method
beveling
physically
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8815676A
Other languages
Japanese (ja)
Inventor
Etsuro Egashira
Shinichiro Miyoshi
Masato Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8815676A priority Critical patent/JPS5314551A/en
Publication of JPS5314551A publication Critical patent/JPS5314551A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE: To perform highly accurate beveling by etching after physically and mechanically damaging the circumferential edges of wafers.
COPYRIGHT: (C)1978,JPO&Japio
JP8815676A 1976-07-26 1976-07-26 Working method of wafers Pending JPS5314551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8815676A JPS5314551A (en) 1976-07-26 1976-07-26 Working method of wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8815676A JPS5314551A (en) 1976-07-26 1976-07-26 Working method of wafers

Publications (1)

Publication Number Publication Date
JPS5314551A true JPS5314551A (en) 1978-02-09

Family

ID=13935051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8815676A Pending JPS5314551A (en) 1976-07-26 1976-07-26 Working method of wafers

Country Status (1)

Country Link
JP (1) JPS5314551A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345435A (en) * 2000-03-29 2001-12-14 Shin Etsu Handotai Co Ltd Silicon wafer, manufacturing method of laminated wafer and laminated wafer thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345435A (en) * 2000-03-29 2001-12-14 Shin Etsu Handotai Co Ltd Silicon wafer, manufacturing method of laminated wafer and laminated wafer thereof

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