JPS5335372A - Beveling method of wafers - Google Patents

Beveling method of wafers

Info

Publication number
JPS5335372A
JPS5335372A JP10955176A JP10955176A JPS5335372A JP S5335372 A JPS5335372 A JP S5335372A JP 10955176 A JP10955176 A JP 10955176A JP 10955176 A JP10955176 A JP 10955176A JP S5335372 A JPS5335372 A JP S5335372A
Authority
JP
Japan
Prior art keywords
wafers
beveling method
beveling
laminate
grindstones
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10955176A
Other languages
Japanese (ja)
Other versions
JPS5339740B2 (en
Inventor
Junji Watanabe
Hiroshi Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP10955176A priority Critical patent/JPS5335372A/en
Publication of JPS5335372A publication Critical patent/JPS5335372A/en
Publication of JPS5339740B2 publication Critical patent/JPS5339740B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To perform beveling of wafers by making wafer laminate using spacers of a diameter smaller than that of wafers and contacting linear grindstones to the rotating laminate.
COPYRIGHT: (C)1978,JPO&Japio
JP10955176A 1976-09-13 1976-09-13 Beveling method of wafers Granted JPS5335372A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10955176A JPS5335372A (en) 1976-09-13 1976-09-13 Beveling method of wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10955176A JPS5335372A (en) 1976-09-13 1976-09-13 Beveling method of wafers

Publications (2)

Publication Number Publication Date
JPS5335372A true JPS5335372A (en) 1978-04-01
JPS5339740B2 JPS5339740B2 (en) 1978-10-23

Family

ID=14513100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10955176A Granted JPS5335372A (en) 1976-09-13 1976-09-13 Beveling method of wafers

Country Status (1)

Country Link
JP (1) JPS5335372A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286242A (en) * 1985-10-09 1987-04-20 株式会社フジタ Reverse casting consttructin method
JPS62125119A (en) * 1985-11-25 1987-06-06 Fudo Kenken Kk Construction of basement
JP2013043246A (en) * 2011-08-24 2013-03-04 Kyocera Crystal Device Corp Method for forming crystal piece

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286242A (en) * 1985-10-09 1987-04-20 株式会社フジタ Reverse casting consttructin method
JPS62125119A (en) * 1985-11-25 1987-06-06 Fudo Kenken Kk Construction of basement
JP2013043246A (en) * 2011-08-24 2013-03-04 Kyocera Crystal Device Corp Method for forming crystal piece

Also Published As

Publication number Publication date
JPS5339740B2 (en) 1978-10-23

Similar Documents

Publication Publication Date Title
JPS5335372A (en) Beveling method of wafers
JPS51121651A (en) Screw and its manufacturing method
JPS5228092A (en) Dressing method of grinding wheel
JPS5341982A (en) Wafer holder for ion implantation processing
JPS52106681A (en) Etching method
JPS525082A (en) Polishing method
JPS5226688A (en) Automatic continuous grinding method of commutater for micromotor and its device
JPS5420663A (en) Grinding method of semiconductor wafers
JPS51111604A (en) Manufacturing method of small type rectifier
JPS5244162A (en) Method of processing semiconductor wafer
JPS5230171A (en) Method for fabrication of semiconductor device
JPS5373075A (en) Treatment method for wafer surface
JPS51140638A (en) Positioning method
JPS5276872A (en) Cutting method of semiconductor wafer
JPS5314551A (en) Working method of wafers
JPS51142795A (en) Grinding device
JPS5214996A (en) Method for halting polishing work
JPS5237789A (en) Process for production of photovoltaic elements
JPS5211867A (en) Manufacturing method of a semiconductor device
JPS51151081A (en) Mos type semiconductor apparatus and that manufacturing method
JPS51132762A (en) Heat-treatment method of semiconductor device
JPS51145544A (en) A method for applying liquid on a metal band
JPS51140288A (en) Grinding material
JPS5315765A (en) Vacuum caontact prevention method of hard mask
JPS5363885A (en) Production apparatus of solid device