JPS5386569A - Semiconductor pellet forming method - Google Patents

Semiconductor pellet forming method

Info

Publication number
JPS5386569A
JPS5386569A JP118377A JP118377A JPS5386569A JP S5386569 A JPS5386569 A JP S5386569A JP 118377 A JP118377 A JP 118377A JP 118377 A JP118377 A JP 118377A JP S5386569 A JPS5386569 A JP S5386569A
Authority
JP
Japan
Prior art keywords
forming method
semiconductor pellet
pellet forming
cracking
abolishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP118377A
Other languages
Japanese (ja)
Inventor
Masanobu Ogino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP118377A priority Critical patent/JPS5386569A/en
Publication of JPS5386569A publication Critical patent/JPS5386569A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To reduce cracking defects and remove broken layers formed on the back along scribe scores without giving any effect on element forming regions by abolishing cracking the wafer from its element formed surface and cracking it from its back.
COPYRIGHT: (C)1978,JPO&Japio
JP118377A 1977-01-11 1977-01-11 Semiconductor pellet forming method Pending JPS5386569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP118377A JPS5386569A (en) 1977-01-11 1977-01-11 Semiconductor pellet forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP118377A JPS5386569A (en) 1977-01-11 1977-01-11 Semiconductor pellet forming method

Publications (1)

Publication Number Publication Date
JPS5386569A true JPS5386569A (en) 1978-07-31

Family

ID=11494326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP118377A Pending JPS5386569A (en) 1977-01-11 1977-01-11 Semiconductor pellet forming method

Country Status (1)

Country Link
JP (1) JPS5386569A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS567448A (en) * 1979-06-29 1981-01-26 Oki Electric Ind Co Ltd Manufacture of photoelectric converting semiconductor device
JPS5840840A (en) * 1981-09-03 1983-03-09 Nec Corp Semiconductor device and manufacture thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS567448A (en) * 1979-06-29 1981-01-26 Oki Electric Ind Co Ltd Manufacture of photoelectric converting semiconductor device
JPS5840840A (en) * 1981-09-03 1983-03-09 Nec Corp Semiconductor device and manufacture thereof

Similar Documents

Publication Publication Date Title
JPS5351970A (en) Manufacture for semiconductor substrate
JPS5226182A (en) Manufacturing method of semi-conductor unit
JPS5224478A (en) Semiconductor device manufacturing process
JPS5333050A (en) Production of semiconductor element
JPS5386569A (en) Semiconductor pellet forming method
JPS5441665A (en) Manufacture for semiconductor device
JPS531471A (en) Manufacture for semiconductor device
JPS51113478A (en) The manufacturing method of semiconductor device
JPS53137685A (en) Manufacture for semiconductor device
JPS5436182A (en) Manufacture for semiconductor device
JPS5373075A (en) Treatment method for wafer surface
JPS52113162A (en) Preparation of semiconductor device
JPS5382174A (en) Surface processing method for semiconductor device
JPS5329086A (en) Production of semiconductor device
JPS51118384A (en) Manufacturing prouss for mos type semiconductor unit
JPS5227274A (en) Semiconductor unit and its manufacturing process
JPS5276872A (en) Cutting method of semiconductor wafer
JPS5230171A (en) Method for fabrication of semiconductor device
JPS51131277A (en) Semi-conductor unit manufacturing process
JPS51138166A (en) Production method of semiconductor device
JPS53142168A (en) Reproductive use of semiconductor substrate
JPS51150286A (en) Production method of semiconductor device
JPS544064A (en) Manufacture for semiconductor device
JPS51132762A (en) Heat-treatment method of semiconductor device
JPS532072A (en) Manufacture of semiconductor