JPS51113478A - The manufacturing method of semiconductor device - Google Patents
The manufacturing method of semiconductor deviceInfo
- Publication number
- JPS51113478A JPS51113478A JP3825175A JP3825175A JPS51113478A JP S51113478 A JPS51113478 A JP S51113478A JP 3825175 A JP3825175 A JP 3825175A JP 3825175 A JP3825175 A JP 3825175A JP S51113478 A JPS51113478 A JP S51113478A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor devices
- disconnection accidents
- reduce disconnection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
Abstract
PURPOSE: This can reduce disconnection accidents of semiconductor devices wiring.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3825175A JPS51113478A (en) | 1975-03-28 | 1975-03-28 | The manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3825175A JPS51113478A (en) | 1975-03-28 | 1975-03-28 | The manufacturing method of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51113478A true JPS51113478A (en) | 1976-10-06 |
Family
ID=12520083
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3825175A Pending JPS51113478A (en) | 1975-03-28 | 1975-03-28 | The manufacturing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51113478A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5723224A (en) * | 1980-07-18 | 1982-02-06 | Nec Corp | Manufacture of semiconductor integrated circuit |
JPS5752130A (en) * | 1980-09-12 | 1982-03-27 | Sanyo Electric Co Ltd | Forming method for electrode |
JPS58139425A (en) * | 1982-02-13 | 1983-08-18 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
JPS595626A (en) * | 1982-07-01 | 1984-01-12 | Matsushita Electronics Corp | Forming method of electrode wiring |
-
1975
- 1975-03-28 JP JP3825175A patent/JPS51113478A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5723224A (en) * | 1980-07-18 | 1982-02-06 | Nec Corp | Manufacture of semiconductor integrated circuit |
JPS5752130A (en) * | 1980-09-12 | 1982-03-27 | Sanyo Electric Co Ltd | Forming method for electrode |
JPS58139425A (en) * | 1982-02-13 | 1983-08-18 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
JPS595626A (en) * | 1982-07-01 | 1984-01-12 | Matsushita Electronics Corp | Forming method of electrode wiring |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS528785A (en) | Semiconductor device electrode structure | |
JPS5230162A (en) | Semiconductor device | |
JPS51113478A (en) | The manufacturing method of semiconductor device | |
JPS5255871A (en) | Production of semiconductor | |
JPS5230167A (en) | Method for production of semiconductor device | |
JPS53120383A (en) | Production of semiconductor device | |
JPS51112193A (en) | Processing method of semiconductor equipment | |
JPS51121272A (en) | Manufacturing method for semiconductor devices | |
JPS5223273A (en) | Method of manufacturing semiconductor element | |
JPS51123086A (en) | Semicanductor device and its production process | |
JPS51134587A (en) | Production method of semiconductor integrated-circuit device | |
JPS51123582A (en) | Semiconductor device production system | |
JPS5223274A (en) | Self-matching type semiconductor device | |
JPS51151089A (en) | Manufacturing method of a semiconductor | |
JPS52179A (en) | Method of fabricating semiconductor | |
JPS51112279A (en) | Semiconductor device | |
JPS51138166A (en) | Production method of semiconductor device | |
JPS5219071A (en) | Production method of semiconductor device | |
JPS51135473A (en) | Surface treatment agent of semi- conductor elements | |
JPS5349972A (en) | Manufacture of semiconductor device | |
JPS51112292A (en) | Semiconductor device | |
JPS51126062A (en) | Tap short bonding method on wire bonding | |
JPS5338991A (en) | Semiconductor device | |
JPS5432988A (en) | Manufacture of semiconductor device | |
JPS51111092A (en) | Semiconductor manufacturing process |