JPS5439576A - Inspection method for semiconductor device - Google Patents

Inspection method for semiconductor device

Info

Publication number
JPS5439576A
JPS5439576A JP10610577A JP10610577A JPS5439576A JP S5439576 A JPS5439576 A JP S5439576A JP 10610577 A JP10610577 A JP 10610577A JP 10610577 A JP10610577 A JP 10610577A JP S5439576 A JPS5439576 A JP S5439576A
Authority
JP
Japan
Prior art keywords
semiconductor device
inspection method
chips
thin plate
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10610577A
Other languages
Japanese (ja)
Inventor
Michio Honma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10610577A priority Critical patent/JPS5439576A/en
Publication of JPS5439576A publication Critical patent/JPS5439576A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE: To seaprate chips from the thin plate automatically and to perform selection based on the result of inspection of chips, by performing chipping through fixing the wafer on a thin plate while unchanging the relative position.
COPYRIGHT: (C)1979,JPO&Japio
JP10610577A 1977-09-02 1977-09-02 Inspection method for semiconductor device Pending JPS5439576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10610577A JPS5439576A (en) 1977-09-02 1977-09-02 Inspection method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10610577A JPS5439576A (en) 1977-09-02 1977-09-02 Inspection method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5439576A true JPS5439576A (en) 1979-03-27

Family

ID=14425207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10610577A Pending JPS5439576A (en) 1977-09-02 1977-09-02 Inspection method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5439576A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611036A (en) * 1984-06-13 1986-01-07 Internatl Rectifier Corp Japan Ltd Aligning method of semiconductor chip
JPS61206232U (en) * 1985-06-15 1986-12-26
JPS61206231U (en) * 1985-06-15 1986-12-26
JPH0512947A (en) * 1991-03-15 1993-01-22 Tokin Corp Reed switch
JPH0512946A (en) * 1991-03-15 1993-01-22 Tokin Corp Reed switch

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611036A (en) * 1984-06-13 1986-01-07 Internatl Rectifier Corp Japan Ltd Aligning method of semiconductor chip
JPH02854B2 (en) * 1984-06-13 1990-01-09 Nippon Inter Electronics Corp
JPS61206232U (en) * 1985-06-15 1986-12-26
JPS61206231U (en) * 1985-06-15 1986-12-26
JPH0512947A (en) * 1991-03-15 1993-01-22 Tokin Corp Reed switch
JPH0512946A (en) * 1991-03-15 1993-01-22 Tokin Corp Reed switch

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