JPH0512946A - Reed switch - Google Patents

Reed switch

Info

Publication number
JPH0512946A
JPH0512946A JP7443791A JP7443791A JPH0512946A JP H0512946 A JPH0512946 A JP H0512946A JP 7443791 A JP7443791 A JP 7443791A JP 7443791 A JP7443791 A JP 7443791A JP H0512946 A JPH0512946 A JP H0512946A
Authority
JP
Japan
Prior art keywords
plating
wire
lead
contact
reed switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7443791A
Other languages
Japanese (ja)
Inventor
Kentaro Horiuchi
憲太郎 堀内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Priority to JP7443791A priority Critical patent/JPH0512946A/en
Publication of JPH0512946A publication Critical patent/JPH0512946A/en
Pending legal-status Critical Current

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  • Manufacture Of Switches (AREA)

Abstract

PURPOSE:To reduce the price of a plating material, simplify the plating process, and suppress the manufacturing costs by Ag plating a wire material to provide an Ag plated wire work, subjecting it to the drawing process into a thin wire element, and shaping it and cutting to accomplish a lead element, which is followed by a heat treatment. CONSTITUTION:A wire material of Ni-Fe alloy of 6mm in dia. is subjected to Ag plating process for a specified thickness, and the Ag plated wire work is subjected to a drawing process into a dia. of 0.6mm so as to yield a thin wire element. This is shaped with a press and cut to form a contact flat portion 13 and a spring flat portion 12 each having an eliptical section, and the resultant is cut into a specified length to provide a reed element, which is followed by a heat treatment for diffusion, and thus reeds 1, 1' are accomplished. Even though the plating material is Ag and the area for plating is large, the costs become cheaper than the conventional technique with Au plating or Rh plating. That is, the cost for the plating material is suppressed, which associate with reduction of the processing cost, should provide a cheap reed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はニッケル鉄合金よりなる
強磁性線材のリード線の外周に銀鍍金を施したリードス
イッチに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reed switch in which a lead wire of a ferromagnetic wire made of nickel-iron alloy is plated with silver on the outer circumference.

【0002】[0002]

【従来の技術】強磁性体よりなる少くとも一方がばね偏
平部である2本のリード線の先端を対向させて接点とし
て不活性ガスを封入したガラス管体に封入し、前記リー
ド線の他端をガラス管体外に導き出したリードスイッチ
は従来から広く使用されている。従来一般にリードスイ
ッチに使用されているリード線は、直径0.6mm程度の
ニッケルを52%含有するニッケル鉄合金の細線を所要
の長さに切断するとともに先端の接点偏平部を肉厚の偏
平に、それより中央寄りのばね偏平部を薄い偏平に成形
している。さらにこの両偏平部分に金鍍金を施し、接点
偏平部にはロジウムあるいはルテニウムを鍍金して強磁
性体のリード線が形成されている。
2. Description of the Related Art Two lead wires, at least one of which is a spring flat portion, made of a ferromagnetic material are made to face each other and are sealed as a contact in a glass tube containing an inert gas. Reed switches whose ends are led outside the glass tube have been widely used. Conventionally, the lead wire generally used for reed switches is made by cutting a thin wire of nickel-iron alloy containing nickel of 52% with a diameter of about 0.6 mm to the required length and flattening the contact flat part at the tip. The spring flattened portion closer to the center than that is formed into a thin flattened shape. Further, both flat portions are plated with gold, and the contact flat portions are plated with rhodium or ruthenium to form ferromagnetic lead wires.

【0003】[0003]

【発明が解決しようとする問題点】従来のリード線に
金、ロジウムあるいはルテニウムなどの高価な鍍金材料
が使用され、鍍金に際して成形加工されたリード線の素
細線部を保持し、接点偏平部、ばね偏平部を下にして吊
り下げ鍍金槽の中に浸すように細心の注意を払って鍍金
する必要があり、加工代も高価となる。したがってリー
ド線の単価が高くリードスイッチに占める原価が高価で
あり、安価なリードスイッチを得ることが困難である。
[Problems to be Solved by the Invention] An expensive plating material such as gold, rhodium or ruthenium is used for a conventional lead wire, which holds a fine wire portion of a lead wire formed by plating, and a flat contact portion, It is necessary to perform the plating with great care so that the spring flat portion is placed in the hanging plating tank with the flat portion facing downward, and the machining cost becomes expensive. Therefore, the unit price of the lead wire is high, the cost of the reed switch is high, and it is difficult to obtain an inexpensive reed switch.

【0004】[0004]

【課題を解決するための手段】本発明は従来のかかる欠
点を除き、強磁性体よりなるリード線の先端を対向させ
て接点としてガラス管内に封入し、他端をガラス管外に
導き出して形成されたリードスイッチにおいて、所要の
厚さに銀鍍金を施し、所要の線径に伸線加工し、成形切
断熱処理加工したニッケル鉄合金線材よりなるリードを
具備したリードスイッチである。
According to the present invention, except for such drawbacks of the prior art, the ends of lead wires made of a ferromagnetic material are made to face each other and enclosed in a glass tube as a contact, and the other end is led out of the glass tube. The reed switch comprises a reed switch made of a nickel-iron alloy wire rod, which is obtained by performing silver plating to a required thickness, drawing wire to a required wire diameter, and forming, cutting and heat treating.

【0005】[0005]

【作用】リードスイッチのリードを線形に加工してから
鍍金を施す方法に比べ、先ず鍍金加工、線形加工してか
ら切断加工するので鍍金加工の費用が安価となる。
In comparison with the method of linearly processing the leads of the reed switch and then plating, the cost of the plating is low because the plating, the linear processing and the cutting are performed first.

【0006】[0006]

【実施例】図1および図2は本発明によるリードスイッ
チの正面図およびリードの切断面図を示す。図面に示す
ように、リードスイッチのリード線1,1′はその先端
で相対し接点となる接点偏平部13,13′と接点の移
動動作を可能とするばね偏平部12と静止した偏平部1
2′とよりなりガラス管5の封着部51で封着されて外
部に導き出される素細線部11,11′を端子線とす
る。また、これらの縦断面は第2図のように素細線部1
1は(a)のような円形、ばね偏平部12,12′は
(b)のような長楕円形、接点偏平部13,13′は
(c)のような短楕円形である。この合金素地2はNi
52%を含んだニッケル鉄合金であり、その外周が銀鍍
金層4で覆われている。リードの接点偏平部13,1
3′の銀鍍金層4の厚さを所定の値とすることによって
リードスイッチの接点の接触抵抗値が動作によって増大
することを防止する。本発明によるリード線の素鋼線は
図3の工程図に示すように作られる。線径6mm程度のニ
ッケル鉄合金の線材3に厚さ数10mm程度の銀鍍金加工
6を施す。銀鍍金された線材を伸線加工7によって線径
0.6mm程度の素細線まで伸ばす。この素細線は接点偏
平部13,13′、ばね偏平部12,12′をプレス成
形加工を行ない、それぞれ断面楕円形とするとともに所
定の長さに切断する成形裁断加工8を行い、さらに銀鍍
金層4と素地3間の拡散のための熱処理9を行ってリー
ド線1,1′が形成される。本発明のリード線は鍍金材
料が貴金属の銀であり、鍍金が施される面積が大きいに
もかかわらず、従来の金またはロジウムよりも安価で、
鍍金材料の価は低減され、線材の際鍍金加工6を施すの
で鍍金加工費用も低減され、安価なリードスイッチが得
られる。
1 and 2 show a front view and a cutaway view of a reed switch according to the present invention. As shown in the drawings, the lead wires 1, 1 ′ of the reed switch are opposed to each other at their tips, and the contact flat portions 13 and 13 ′ serving as contacts, the spring flat portion 12 enabling the movement of the contacts, and the flat portion 1 stationary.
The thin wire portions 11 and 11 'which are composed of 2'and are sealed by the sealing portion 51 of the glass tube 5 and are led to the outside are used as terminal wires. The vertical cross section of these is as shown in FIG.
Reference numeral 1 is a circular shape as shown in (a), spring flat portions 12, 12 'are oblong shapes as shown in (b), and contact flat portions 13, 13' are short elliptical shapes as shown in (c). This alloy base 2 is Ni
It is a nickel-iron alloy containing 52%, and its outer periphery is covered with a silver plating layer 4. Contact flat parts of lead 13,1
By setting the thickness of the 3 ′ silver-plated layer 4 to a predetermined value, the contact resistance value of the contact of the reed switch is prevented from increasing due to the operation. The raw steel wire of the lead wire according to the present invention is manufactured as shown in the process diagram of FIG. A nickel-iron alloy wire rod 3 having a wire diameter of about 6 mm is subjected to silver plating 6 having a thickness of about 10 mm. The silver-plated wire rod is drawn by wire drawing 7 to a fine wire having a wire diameter of about 0.6 mm. This thin wire is formed by press-molding the contact flattened portions 13 and 13 'and the spring flattened portions 12 and 12' so that each has an elliptical cross-section and is cut and cut to a predetermined length, and further silver-plated. A heat treatment 9 for diffusion between the layer 4 and the green body 3 is performed to form the leads 1, 1 '. The lead wire of the present invention has a plating material of silver, which is a noble metal, and is cheaper than conventional gold or rhodium in spite of a large area to be plated,
The value of the plating material is reduced, and the plating process 6 is performed when the wire material is used, so that the plating process cost is also reduced and an inexpensive reed switch can be obtained.

【0007】[0007]

【発明の効果】以上に述べたように本発明によれば、従
来のように素地3をリード線に成形後、金、ロジウム鍍
金を施すのと異り、線材に銀鍍金を施して後、伸線成
形、熱処理加工を行なって作られたリード線を使用する
ので安価なリードスイッチが得られる。
As described above, according to the present invention, unlike the conventional method in which the base material 3 is formed into a lead wire and then gold or rhodium plating is performed, the wire material is subjected to silver plating, An inexpensive reed switch can be obtained because the lead wire produced by wire drawing and heat treatment is used.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明によるリードスイッチの実施例の外観正
面図である。
FIG. 1 is an external front view of an embodiment of a reed switch according to the present invention.

【図2】図1におけるリードの縦断面図で、(a)は素
細線部におけるA−Aの断面図、(b)はばね偏平部に
おけるB−Bの断面図、(c)は接点偏平部におけるC
−Cの断面図である。
2 is a vertical cross-sectional view of the lead in FIG. 1, (a) is a cross-sectional view of AA in a fine wire portion, (b) is a cross-sectional view of BB in a flat spring portion, and (c) is a flat contact portion. C in the department
It is sectional drawing of -C.

【図3】本発明によるリード線の製作工程図である。FIG. 3 is a manufacturing process diagram of a lead wire according to the present invention.

【符号の説明】[Explanation of symbols]

1,1′ リード 2 ニッケル鉄合金素地 4 銀鍍金層 5 ガラス管 6 銀鍍金加工 7 伸線加工 8 成形裁断加工 9 熱処理 11,11′ 素細線部(端子線) 12,12′ ばね偏平部 13,13′ 接点偏平部 1,1 'Lead 2 Nickel iron alloy base 4 Silver plating layer 5 Glass tube 6 Silver plating 7 Wire drawing 8 Form cutting 9 Heat treatment 11, 11' Fine wire part (terminal wire) 12, 12 'Spring flat part 13 , 13 'Flat contact part

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成3年4月15日[Submission date] April 15, 1991

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【書類名】 明細書[Document name] Statement

【発明の名称】 リードの製造方法Patent application title: Lead manufacturing method

【特許請求の範囲】[Claims]

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はリードスイッチの主要部
品であるリードの製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a lead which is a main component of a reed switch.

【0002】[0002]

【従来の技術】リードスイッチは、強磁性体よりなる二
本のリードの一部を、夫々、ガラス管内に封入して接点
部を構成するとともに、上記各リードの残りの部分を上
記ガラス管外へ軸方向に沿って導き出して成る。このリ
ードスイッチにおけるリードは、従来次のようにして作
られている。先ず、所要の線径(一般に直径0.6m
m)のニッケル52%−鉄合金の細線を所要の長さに切
断すると同時に、一端から所要の長さの部分に肉厚の接
点扁平部を形成し、それよりも他端寄りの部分に接点扁
平部よりも肉薄のばね扁平部を成形し、次ぎに接点扁平
部及びばね扁平部に金鍍金を施し、更に、接点扁平部に
は、金鍍金の上にロジウム或るいはルテニウムを鍍金し
て強磁性体のリードを得ている。
2. Description of the Related Art In a reed switch, a part of two reeds made of a ferromagnetic material is enclosed in a glass tube to form a contact portion, and the remaining part of each reed is outside the glass tube. It is formed by extending along the axial direction. Reeds in this reed switch are conventionally manufactured as follows. First, the required wire diameter (generally 0.6m diameter
m) Nickel 52% -iron alloy thin wire is cut into a required length, and at the same time, a thick contact flat portion is formed from one end to a required length portion, and a contact point is provided to a portion closer to the other end. Form a spring flattened part that is thinner than the flattened part, and then apply gold plating to the contact flattened part and spring flattened part. Got a ferromagnetic lead.

【0003】[0003]

【発明が解決しようとする課題】従来のリードの製造方
法では、鍍金材料に高価なものが用いられているので、
鍍金が高くつき、しかも成形裁断加工したリード素線を
一々接点扁平部を下にして吊り下げて鍍金するので、鍍
金加工代も高くつく。この為、従来のリードの製造方法
では、リードが大変高価なものとなってしまう不都合が
ある。それ故に、本発明の課題は、安価にリードを得る
ことが可能なリードの製造方法を提供することにある。
In the conventional lead manufacturing method, since an expensive plating material is used,
Since the plating is expensive and the lead wires that have been cut and formed are hung and plated with the contact flat part facing down, the plating cost is high. Therefore, the conventional lead manufacturing method has a disadvantage that the lead becomes very expensive. Therefore, an object of the present invention is to provide a lead manufacturing method capable of obtaining leads at low cost.

【0004】[0004]

【課題を解決するための手段】本発明によれば、鍍金工
程と、成形裁断工程とを含むリードの製造方法におい
て、線材に銀鍍金して銀鍍金線材を得る鍍金工程と、上
記銀鍍金線材を伸線加工して素細線を得る伸線工程と、
上記素細線を成形裁断してリード素線を得る成形裁断工
程と、上記リード素線を熱処理してリードを得る熱処理
工程とを有することを特徴とするリードの製造方法が得
られる。
According to the present invention, in a lead manufacturing method including a plating process and a molding cutting process, a plating process of silver-plating a wire rod to obtain a silver-plated wire rod, and the above silver-plated wire rod A wire drawing process for obtaining a fine wire by wire drawing,
A method of manufacturing a lead is provided, which includes a molding and cutting step of molding and cutting the thin wire to obtain a lead wire, and a heat treatment step of heat-treating the lead wire to obtain a lead.

【0005】[0005]

【作用】細線を成形裁断加工してから、ばね扁平部及び
接点扁平部に鍍金を施す従来の製造方法に比べ、本発明
によるリードの製造方法は、先ず線材に銀鍍金し、次い
で伸線加工し、その後、成形裁断加工し、最後に、熱処
理をするので、鍍金材料が安くつき、しかも鍍金加工の
費用が従来よりも著しく安価となる。
In comparison with the conventional manufacturing method in which the thin wire is formed by cutting and then the flat spring portion and the flat contact portion are plated, the lead manufacturing method according to the present invention is such that the wire is first silver-plated and then wire-drawn. After that, the molding cutting process is performed, and finally the heat treatment is performed, so that the plating material is inexpensive, and the cost of the plating process is significantly lower than the conventional case.

【0006】[0006]

【実施例】図1は本発明の一実施例により得られたリー
ドを用いたリードスイッチの正面図、図2は同実施例に
より得られたリードの切断面図を示す。図面に示すよう
に、リードスイッチの左右のリード1,1′は、その先
端で相対し接点となる接点扁平部13,13′と、接点
扁平部13,13′を支持するばね扁平部12,12′
と、ガラス管5の封着部51で封着されて外部に導き出
される素細線部11,11′とを有する。ばね扁平部1
2は、もう一方のばね扁平部12′よりも若干薄く形成
されており、リードスイッチに電圧が印加された場合、
一方のリード1のばね扁平部12が屈曲して接点扁平部
13がもう一方のリード1′の接点扁平部13′に接触
するように成っている。また、これらリード1,1′の
縦断面は図2に示すように、ガラスの外部に出ている素
細線部11,11′は(a)のような円形、ばね扁平部
12,12′は(b)のような長楕円形、接点扁平部1
3,13′は(c)のような短楕円形である。Ni52
%を含有するニッケル鉄合金の線材2は、その外周を銀
鍍金層4で覆われている。このリード1,1′の接点扁
平部13,13′の銀鍍金層4の厚さを所定の値とする
ことによってリードスイッチの接点の接触抵抗が動作に
よって増大することが防止される。本実施例のリードの
製造方法を図3に示す工程図に基づいて説明する。先
ず、線径6mm程度のニッケル鉄合金の線材2に、所定
の厚さに銀鍍金を施す銀鍍金加工6を行い、銀鍍金線材
を得る。次ぎに、この銀鍍金線材を伸線加工7によって
線径0.6mm程度まで伸ばして素細線を得る。次ぎ
に、この素細線にプレス成形裁断加工8を施して、接点
扁平部13、ばね扁平部12を形成し、それぞれ断面楕
円形とするとともに所定の長さに切断してリード素線を
得る。更にリード素線の拡散のため熱処理9を行なって
リードが得られる。
1 is a front view of a reed switch using a lead obtained according to an embodiment of the present invention, and FIG. 2 is a sectional view of the lead obtained by the same embodiment. As shown in the drawings, the left and right reeds 1, 1'of the reed switch are composed of contact flat portions 13, 13 'which face each other at their tips and which serve as contacts, and spring flat portions 12, which support the contact flat portions 13, 13'. 12 '
And the fine wire portions 11 and 11 'that are sealed by the sealing portion 51 of the glass tube 5 and are guided to the outside. Spring flat part 1
2 is formed slightly thinner than the other spring flat portion 12 ', and when a voltage is applied to the reed switch,
The flat spring portion 12 of one lead 1 is bent so that the flat contact portion 13 contacts the flat contact portion 13 'of the other lead 1'. Further, as shown in FIG. 2, the longitudinal cross-sections of the leads 1, 1'are such that the fine wire portions 11, 11 'exposed outside the glass are circular as shown in (a), and the flat spring portions 12, 12' are Oblong shape as in (b), flat contact point 1
3, 13 'are short ellipses as shown in (c). Ni52
%, The nickel-iron alloy wire rod 2 is covered with a silver plating layer 4 on the outer periphery thereof. By setting the thickness of the silver-plated layer 4 of the contact flat portions 13, 13 'of the leads 1, 1'to a predetermined value, it is possible to prevent the contact resistance of the contact of the reed switch from increasing due to the operation. A method of manufacturing the leads of this embodiment will be described with reference to the process diagram shown in FIG. First, a nickel-iron alloy wire rod 2 having a wire diameter of about 6 mm is subjected to a silver plating process 6 of applying silver plating to a predetermined thickness to obtain a silver-plated wire rod. Next, this silver-plated wire rod is drawn by wire drawing 7 to a wire diameter of about 0.6 mm to obtain a fine wire. Next, press-cutting processing 8 is applied to this thin wire to form a contact flat portion 13 and a spring flat portion 12, each of which has an elliptical cross section and is cut into a predetermined length to obtain a lead wire. Further, heat treatment 9 is performed for diffusion of the lead wires to obtain leads.

【0007】[0007]

【発明の効果】本発明により得られるリードは、鍍金材
料が貴金属の銀であり、鍍金が施される面積が大きいに
もかかわらず、従来のように金鍍金またはロジウム鍍金
をした場合より安く、鍍金材料の価格は低減され、加工
費の低減と相まって極めて安価なリードが得られる。
INDUSTRIAL APPLICABILITY In the lead obtained according to the present invention, the plating material is silver, which is a noble metal, and despite the large area to be plated, it is cheaper than the conventional gold plating or rhodium plating, The cost of the plating material is reduced, and in combination with the reduction of processing cost, an extremely inexpensive lead can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1は本発明の一実施例により得られたリード
を用いたリードスイッチの正面図である。
FIG. 1 is a front view of a reed switch using a lead obtained according to an embodiment of the present invention.

【図2】図2は図1に示すリードの断面図で、(a)は
図1のA−A線での断面図、(b)は図1のB−B線で
の断面図、(c)は図1のC−C線での断面図である。
2 is a sectional view of the lead shown in FIG. 1, (a) is a sectional view taken along the line AA of FIG. 1, (b) is a sectional view taken along the line BB of FIG. c) is a sectional view taken along the line CC of FIG. 1.

【図3】図1に示すリードの製造工程図である。FIG. 3 is a manufacturing process diagram of the lead shown in FIG. 1;

【符号の説明】 1,1′ リード 2 ニッケル鉄合金線材 4 銀鍍金層 6 銀鍍金加工 7 伸線加工 8 成形裁断加工 9 熱処理 11 素細線部 12 ばね扁平部 13 接点扁平部[Explanation of reference signs] 1,1 'Lead 2 Nickel iron alloy wire rod 4 Silver plating layer 6 Silver plating 7 Wire drawing 8 Form cutting 9 Heat treatment 11 Fine wire 12 Spring flat part 13 Contact flat part

【手続補正2】[Procedure Amendment 2]

【補正対象書類名】図面[Document name to be corrected] Drawing

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図1】 [Figure 1]

【図2】 [Fig. 2]

【図3】 [Figure 3]

Claims (1)

【特許請求の範囲】 【請求項1】 強磁性体よりなる少くとも一方がばね偏
平部であるリード線1,1′とその先端を対向させて接
点とする接点偏平部13,13′とをガラス管5内に封
入し前記リード線1,1′の接点とは反対側の端部を夫
々ガラス管外に引き出して端子線11,11′としたリ
ードスイッチにおいて、前記ガラス管内に封入されたリ
ード線1,1′並びに接点部13,13′の外周を銀鍍
金してなるリードスイッチ。
Claim: What is claimed is: 1. A lead wire 1,1 'made of a ferromagnetic material, at least one of which is a spring flat portion, and contact flat portions 13, 13' having their tips opposed to each other to form a contact. In a reed switch which is enclosed in the glass tube 5 and whose ends opposite to the contact points of the lead wires 1 and 1'are drawn out to the outside of the glass tube to form the terminal wires 11 and 11 ', they are enclosed in the glass tube. A reed switch in which the outer circumferences of the lead wires 1 and 1'and the contact portions 13 and 13 'are plated with silver.
JP7443791A 1991-03-15 1991-03-15 Reed switch Pending JPH0512946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7443791A JPH0512946A (en) 1991-03-15 1991-03-15 Reed switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7443791A JPH0512946A (en) 1991-03-15 1991-03-15 Reed switch

Publications (1)

Publication Number Publication Date
JPH0512946A true JPH0512946A (en) 1993-01-22

Family

ID=13547203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7443791A Pending JPH0512946A (en) 1991-03-15 1991-03-15 Reed switch

Country Status (1)

Country Link
JP (1) JPH0512946A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5439576A (en) * 1977-09-02 1979-03-27 Nec Corp Inspection method for semiconductor device
JPS5753530B2 (en) * 1975-07-09 1982-11-13

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753530B2 (en) * 1975-07-09 1982-11-13
JPS5439576A (en) * 1977-09-02 1979-03-27 Nec Corp Inspection method for semiconductor device

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