JPH0119212B2 - - Google Patents
Info
- Publication number
- JPH0119212B2 JPH0119212B2 JP55141949A JP14194980A JPH0119212B2 JP H0119212 B2 JPH0119212 B2 JP H0119212B2 JP 55141949 A JP55141949 A JP 55141949A JP 14194980 A JP14194980 A JP 14194980A JP H0119212 B2 JPH0119212 B2 JP H0119212B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- reed switch
- reed
- metal
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000014676 Phragmites communis Nutrition 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000696 magnetic material Substances 0.000 claims description 6
- 239000010970 precious metal Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 239000011247 coating layer Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Contacts (AREA)
- Manufacture Of Switches (AREA)
Description
【発明の詳細な説明】
本発明はリードスイツチ用接触子の製造方法に
関し、特に外部磁界に応動して電路を開閉するリ
ード片の作動を確実なものとするリードスイツチ
用接触子の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a contact for a reed switch, and more particularly to a method of manufacturing a contact for a reed switch that ensures reliable operation of a reed piece that opens and closes an electric circuit in response to an external magnetic field. .
従来、この種のリードスイツチ用接触子の製造
方法は非磁性材よりなる封入容器に封入固着され
たリード片の封入接触面にそれぞれの対向遊端に
固定された接点には金、銀、ロジウム等の貴金属
をメツキしたものを用いて接触抵抗を小さくして
いたものであるが、接点間に発生するアークによ
つて接点面が損傷し接触不良を起していた。 Conventionally, the manufacturing method for this type of reed switch contact has been to use gold, silver, or rhodium on the contact surface of a reed piece that is sealed and fixed in an enclosure made of a non-magnetic material. The contact resistance was reduced by plating with precious metals such as, but the contact surface was damaged by the arc generated between the contacts, resulting in poor contact.
このため、リード片の接点表面にタングステン
あるいはモリブデン等の耐アーク性材を蒸着ある
いは接着させていたが、この耐アーク性材の厚さ
にバラツキが生ずるため接点間隔の設定管理が煩
雑となり、又耐アーク性材の被着力が弱く、リー
ド片の開閉動作中に剥落してしまい、開操作不能
を起したり、接触抵抗が大きくなつてしまう等の
欠点があつたところである。 For this reason, an arc-resistant material such as tungsten or molybdenum is vapor-deposited or adhered to the contact surface of the lead piece, but the thickness of this arc-resistant material varies, making it complicated to manage the contact spacing. The adhesion of the arc-resistant material is weak, and the reed piece peels off during the opening/closing operation, resulting in an inability to open the lead piece and an increase in contact resistance.
そこで、本発明は斯かる点に着目してなされた
もので、接触抵抗を小さくするとともに、耐アー
ク性に優れ、確実な作動を得ることができるよう
にしたリードスイツチ用接触子の製造方法を提供
するものである。 Therefore, the present invention has been made with attention to these points, and provides a method for manufacturing a contact for a reed switch that reduces contact resistance, has excellent arc resistance, and ensures reliable operation. This is what we provide.
次に、本発明の実施の一例を図面を参照して説
明する。 Next, an example of implementation of the present invention will be described with reference to the drawings.
図中１は本発明方法により製造されたリードス
イツチ用接触子を用いたリードスイツチ本体の封
入容器であり、この封入容器１は非磁性材により
形成され、この封入容器１の両側には磁性材によ
り形成されたリード片２，３が封着されている。 In the figure, reference numeral 1 denotes an enclosure for a reed switch body using a reed switch contact produced by the method of the present invention. The lead pieces 2 and 3 formed by the above are sealed.
このリード片２，３にはそれぞれ外方に外部端
子２ａ，３ａが突設されており、又封入部分２
ｂ，３ｂの遊端には接点４，５が設けられて夫々
リードスイツチ用接触子Ａ，Ａを構成している。 These lead pieces 2 and 3 have external terminals 2a and 3a protruding outward, respectively, and an enclosed portion 2
Contacts 4 and 5 are provided at the free ends of b and 3b to constitute reed switch contacts A and A, respectively.
このように構成されるリードスイツチ用接触子
Ａの製造は、第２図乃至第４図に示されているよ
うに、まずモリブデン、タングステン等の耐アー
ク性に富む焼結金属よりなる線材１０の外周に金
メツキを施して良導電性の被覆層１１を形成し、
次いでこの被覆層１１の形成された線材１０を
1000℃前後の熱処理装置内で処理して被覆層１１
の金属の一部を線材１０のモリブデン、タングス
テン等の耐アーク性の焼結金属の粒子間に浸透さ
せ焼結金属線材１０における金属粒子間の結合力
を強化助長すると同時に焼結金属線材に展性を付
与する。 To manufacture the reed switch contact A constructed in this manner, as shown in FIGS. 2 to 4, first, a wire 10 made of a sintered metal with high arc resistance such as molybdenum or tungsten is manufactured. The outer periphery is plated with gold to form a highly conductive coating layer 11,
Next, the wire rod 10 with the coating layer 11 formed thereon is
The coating layer 11 is processed in a heat treatment equipment at around 1000℃.
A part of the metal is infiltrated between the particles of arc-resistant sintered metal such as molybdenum and tungsten in the wire 10 to help strengthen the bonding force between the metal particles in the sintered metal wire 10, and at the same time spread into the sintered metal wire. give gender.
このように熱処理した線材を圧延処理して接点
形成用の帯状材１２の形態になすと共に、その裏
面に複数の突起１３，１３…を形成する。この圧
延処理によつて前記焼結金属の粒子間に浸透した
金属が該粒子間に固定された浸透形の被覆層構造
となる。また前記帯状材１２の裏面に形成される
多数の突起１３，１３…は、次工程の圧着接合を
確実なものとするものである。 The thus heat-treated wire is rolled to form a strip 12 for forming contacts, and a plurality of protrusions 13, 13, . . . are formed on the back surface thereof. Through this rolling process, the metal that has permeated between the particles of the sintered metal is fixed between the particles, forming a permeable coating layer structure. Moreover, the large number of protrusions 13, 13, . . . formed on the back surface of the strip material 12 ensure the crimp bonding in the next step.
このように形成した帯状材１２を、例えば鉄−
ニツケル合金や鉄−コバルト−ニツケル合金等の
磁性材よりなる帯状のリード片形成用母材（図示
せず）の端部上面に圧着接合し、しかる後に所要
幅に切断して切断片（図示せず）を成形し、この
切断された切断面を成形して、第４図に示す如く
リードスイツチ用接触子Ａが形成される（上記の
帯状材１２が上記の切断により接点４となる）。 The thus formed strip material 12 is made of iron, for example.
It is crimped onto the upper surface of the end of a strip-shaped lead piece forming base material (not shown) made of a magnetic material such as nickel alloy or iron-cobalt-nickel alloy, and then cut to the required width to form a cut piece (not shown). The cut surface is then molded to form a reed switch contact A as shown in FIG. 4 (the strip material 12 becomes the contact 4 by cutting as described above).
本実施例にあつては線材１０の外周に金メツキ
による被覆層を設けることとしたが、これに限る
ことなく、銀等の貴金属による被覆層をメツキに
より設けても差支えない。 In this embodiment, a coating layer made of gold plating is provided on the outer periphery of the wire 10, but the present invention is not limited to this, and a coating layer made of a noble metal such as silver may be provided by plating.
本発明方法は、上述のように、非磁性材よりな
る封入容器の両側に封着したリード片のそれぞれ
の対向する遊端部分に接点を設けたリードスイツ
チ用接触子の製造方法において、耐アーク性に富
む焼結金属よりなる線材の外周に、貴金属メツキ
を施して熱処理を行い、しかる後圧延して接点形
成用の帯状材を成形し、その帯状材を磁性材より
なるリード片形成用母材の端部上面に圧着接合し
た後に所要の幅に切断し、このようにして形成さ
れた切断片を成形してリードスイツチ用接触子と
したので、接点の厚みが一定となり、しかも焼結
金属の外周に貴金属メツキにより被覆される貴金
属層が熱処理及び圧延処理により焼結金属の粒子
間に浸透した被覆層構造となるので、貴金属部分
の剥落は防止され、接点の電気抵抗、接触抵抗は
小さくなり、かつ接点のベース金属がモリブデ
ン、タングステン等の焼結金属からなるもので耐
アーク性にすぐれたリードスイツチ用接触子を極
めて容易に製造することができる効果を有するこ
ととなつた。 As described above, the method of the present invention is a method for manufacturing a contact for a reed switch in which contacts are provided at opposing free ends of reed pieces sealed on both sides of an enclosure made of a non-magnetic material. The outer periphery of the wire made of sintered metal with high properties is plated with precious metal, heat treated, and then rolled to form a strip material for forming contacts.The strip material is then used as a matrix for forming lead pieces made of magnetic material. After crimping and joining the upper surface of the end of the material, it was cut to the required width, and the cut piece thus formed was molded into a contact for a reed switch, so the thickness of the contact was constant, and it was made of sintered metal. The noble metal layer coated on the outer periphery by precious metal plating penetrates between the particles of the sintered metal through heat treatment and rolling treatment, resulting in a coating layer structure that prevents the precious metal portion from peeling off and reduces the electrical resistance and contact resistance of the contacts. Moreover, the base metal of the contact is made of a sintered metal such as molybdenum or tungsten, and it has the effect that a reed switch contact with excellent arc resistance can be manufactured extremely easily.
図面は本発明方法の実施の一例を示すものであ
り、第１図は本発明方法により製造されたリード
スイツチ用接触子を用いたリードスイツチの側面
図であつて、封入容器部分を断面にて示した図
面、第２図は、焼結金属からなる線材の外周に貴
金属メツキを施こした状態の部分斜視図、第３図
は、接点形成用の帯状材の部分斜視図、第４図
は、本発明方法により製造されたリードスイツチ
用接触子の斜視図である。
１……封入容器、２，３……リード片、４，５
……接点、１０……線材、１１……被覆層、１２
……帯状材、Ａ……リードスイツチ用接触子。
The drawings show an example of the implementation of the method of the present invention, and FIG. 1 is a side view of a reed switch using a reed switch contact manufactured by the method of the present invention, showing a section of the enclosure portion. The drawings shown, FIG. 2 is a partial perspective view of a wire rod made of sintered metal with precious metal plating applied to the outer periphery, FIG. 3 is a partial perspective view of a strip material for contact formation, and FIG. FIG. 2 is a perspective view of a reed switch contact manufactured by the method of the present invention. 1... Enclosure container, 2, 3... Lead piece, 4, 5
... Contact, 10 ... Wire, 11 ... Covering layer, 12
... Strip material, A ... Contact for reed switch.
Claims (1)
リード片のそれぞれの対向する遊端部分に接点を
設けたリードスイツチ用接触子の製造方法におい
て、耐アーク性に富む焼結金属よりなる線材の外
周に、貴金属メツキを施して熱処理を行い、しか
る後圧延して接点形成用の帯状材を成形し、その
帯状材を磁性材よりなるリード片形成用母材の端
部上面に圧着接合した後に所要の幅に切断し、こ
のようにして形成された切断片を成形してリード
スイツチ用接触子となすことを特徴とするリード
スイツチ用接触子の製造方法。1. In a method for manufacturing a contact for a reed switch in which contacts are provided at the opposing free ends of reed pieces sealed on both sides of an enclosure made of a non-magnetic material, a wire made of a sintered metal with high arc resistance is used. The outer periphery of the lead piece was plated with a precious metal and heat treated, and then rolled to form a strip material for forming a contact, and the strip material was crimped and bonded to the upper surface of the end of a base material for forming a lead piece made of a magnetic material. 1. A method for manufacturing a reed switch contact, which comprises the steps of: cutting the reed switch contact later to a required width, and molding the cut piece thus formed into a reed switch contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14194980A JPS5767225A (en) | 1980-10-13 | 1980-10-13 | Reed switch and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14194980A JPS5767225A (en) | 1980-10-13 | 1980-10-13 | Reed switch and method of producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5767225A JPS5767225A (en) | 1982-04-23 |
| JPH0119212B2 true JPH0119212B2 (en) | 1989-04-11 |
Family
ID=15303872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14194980A Granted JPS5767225A (en) | 1980-10-13 | 1980-10-13 | Reed switch and method of producing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5767225A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH056739U (en) * | 1991-07-01 | 1993-01-29 | 群馬日本電気株式会社 | connector |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51145849A (en) * | 1975-06-11 | 1976-12-15 | Oki Electric Ind Co Ltd | Reed switch |
-
1980
- 1980-10-13 JP JP14194980A patent/JPS5767225A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51145849A (en) * | 1975-06-11 | 1976-12-15 | Oki Electric Ind Co Ltd | Reed switch |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5767225A (en) | 1982-04-23 |
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