JPS5810338A - Method of producing lead piece for lead switch - Google Patents
Method of producing lead piece for lead switchInfo
- Publication number
- JPS5810338A JPS5810338A JP10777981A JP10777981A JPS5810338A JP S5810338 A JPS5810338 A JP S5810338A JP 10777981 A JP10777981 A JP 10777981A JP 10777981 A JP10777981 A JP 10777981A JP S5810338 A JPS5810338 A JP S5810338A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead piece
- piece
- magnetic wire
- switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacture Of Switches (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は低価格リードスイッチを得るためのリード片の
製造方法に関するものである。通常リードスイッチはＦ
ｅ−Ｎｉ合金特に５２アロイ（Ｎｉ：５２％、Ｆｅ：４
８％）線を成形切断して片側部が潰し加工されたリード
片を成形すると共に、該リード片の端部にＡｕ 、 Ｒ
ｈ等の貴金属接点をめりき処理またはスパッタ等により
被着し、しかる後該リード片を一対還元性雰囲気でガラ
ス管に封入して製造されている。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a reed piece for obtaining a low-cost reed switch. Usually the reed switch is F
e-Ni alloy, especially 52 alloy (Ni: 52%, Fe: 4
8%) The wire is molded and cut to form a lead piece with one side crushed, and the end of the lead piece is coated with Au, R.
The lead piece is manufactured by depositing a noble metal contact such as H by plating or sputtering, and then enclosing a pair of lead pieces in a glass tube in a reducing atmosphere.
を使用し且つ別工程にて接点を被着形成するため高価な
ものになりしかも製造工程が多い欠点をもつ。またリー
ド片を還元雰囲気でガラス管に封止しているため密着性
が弱い欠点をもつ。Since the contact is formed in a separate process, it is expensive and has the disadvantage of requiring many manufacturing steps. Furthermore, since the lead piece is sealed in the glass tube in a reducing atmosphere, it has the disadvantage of weak adhesion.
本発明はこのような従来欠点を解決するもので、この目
的はＣｕめっき被覆が施されだＰｃ−Ｎｉ 合金からな
る磁性線を熱拡散処理した後、該磁性線に潰し加工を加
えると共に所定寸法で切断して形成したリードスイッチ
用リード片の製造方法によシ達成できる。The present invention is intended to solve such conventional drawbacks, and its purpose is to heat-diffuse a magnetic wire made of a Pc-Ni alloy coated with Cu plating, and then crush the magnetic wire to a predetermined size. This can be achieved by a method of manufacturing a reed switch lead piece that is cut and formed by cutting.
以下、本発明の一実施例を添付図面により詳述する。Hereinafter, one embodiment of the present invention will be described in detail with reference to the accompanying drawings.
第１図は本発明に係るリード片を得る磁性線１を示すも
ので、これは５２アロイ線２の表面に約２μｍのＣｕＪ
ｊ＠３をめっき被覆して形成されている。尚、このより
なＣｕめっき被覆磁性線は市販されている。FIG. 1 shows a magnetic wire 1 from which a lead piece according to the present invention is obtained.
It is formed by plating coating J@3. Incidentally, this strong Cu-plated magnetic wire is commercially available.
本発明では接点処理不要なリード片を得るため、この磁
性線１を７００°Ｃ〜ＳＯＯ℃の加熱水素炉中この磁性
線１に潰し加工を施して第２図の如く、潰し部分４と端
部５を交互に形成し、その後破線位置で切断することに
より第３図に示す本リード片６が製作される。このリー
ド片６はその表面が上記熱拡散処理によりＣｕを主成分
とするＣｕ−ＮｉＦｅ合金層になり、これが接点として
作用し、貴金属接点の被着は不要でちる。In the present invention, in order to obtain a lead piece that does not require contact processing, the magnetic wire 1 is crushed in a heated hydrogen furnace at 700°C to SOO°C, and the crushed portion 4 and the end are formed as shown in Fig. 2. The main lead piece 6 shown in FIG. 3 is manufactured by forming the portions 5 alternately and then cutting at the dotted line positions. The surface of this lead piece 6 becomes a Cu--NiFe alloy layer containing Cu as a main component by the above-mentioned thermal diffusion treatment, and this acts as a contact point, so that there is no need to attach a noble metal contact point.
実験結果によれば、リード片６を用いて本発明に係るリ
ードスイッチを製造し、これに低レベル条件である接点
負荷がＤＣ１２Ｖ−５ｍＡの接点電流を印加して開閉動
作させた際、接点寿命は接点開閉回数が約４Ｘ１０７回
であった。これに対しロジウム接点を被着したリード片
を有する従来リードスイッチに同条件下で試験した結果
では約２×１０７の接点寿命であシ、本発明の方が約２
倍の接点寿命であった。又、本リード片６は全表面にＣ
ｕが被覆されているためガラスの種類を問わず密着性が
すぐれている。According to the experimental results, when a reed switch according to the present invention was manufactured using the reed piece 6 and a contact current of 12 VDC-5 mA, which is a low level condition, was applied to the reed switch to perform opening/closing operation, the life of the contact decreased. The number of times the contacts were opened and closed was approximately 4×107 times. On the other hand, when a conventional reed switch with a reed piece coated with rhodium contacts was tested under the same conditions, the contact life was about 2 x 107, and the present invention was about 2 times longer.
The contact life was doubled. Also, this lead piece 6 has C on the entire surface.
Because u is coated, it has excellent adhesion regardless of the type of glass.
以上の本発明によれば、貴金属接点を使用せず且つその
接点形成処理も不要のため極めて安価なリードスイッチ
を得ることができ、且つ接点寿命もガラス密着性も良好
な高性能なリードスイッチが得られ、その実用上の効果
は著しいものである。According to the present invention described above, an extremely inexpensive reed switch can be obtained since no precious metal contacts are used and no contact forming process is required, and a high-performance reed switch with good contact life and glass adhesion can be obtained. obtained, and its practical effects are remarkable.
第１図は本発明に係るリード片の素材となる磁性線を示
す図、第２図は第１図の磁性線に潰し加工を施した状態
を示す図、第３図は第２図の磁性線から切断された本発
明に係るリード片の斜視図である。
〔符号の説明〕
１・・・磁性線
２・・・５２アロイ線
３・・・Ｃｕ膜
４・・・潰し部分
５・・・端子部分
６・・・リード片
代理人 弁理士 松 岡 宏四部Figure 1 is a diagram showing the magnetic wire that is the material of the lead piece according to the present invention, Figure 2 is a diagram showing the magnetic wire in Figure 1 crushed, and Figure 3 is the magnetic wire in Figure 2. FIG. 3 is a perspective view of a lead piece according to the present invention cut from a line. [Explanation of symbols] 1... Magnetic wire 2... 52 alloy wire 3... Cu film 4... Crushed part 5... Terminal part 6... Lead piece agent Patent attorney Hiroshi Matsuoka Department
Claims (1)
線を熱拡散処理した後、該磁性線に潰し加工を加えると
共に所定寸法で切断して形成したことを特徴とするリー
ドスイッチ用リード片の製造方法。A lead piece for a reed switch, characterized in that it is formed by thermally diffusing a magnetic wire made of a Fe-Ni alloy coated with Cu plating, then crushing the magnetic wire and cutting it into predetermined dimensions. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10777981A JPS5810338A (en) | 1981-07-10 | 1981-07-10 | Method of producing lead piece for lead switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10777981A JPS5810338A (en) | 1981-07-10 | 1981-07-10 | Method of producing lead piece for lead switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5810338A true JPS5810338A (en) | 1983-01-20 |
Family
ID=14467799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10777981A Pending JPS5810338A (en) | 1981-07-10 | 1981-07-10 | Method of producing lead piece for lead switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5810338A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6212540A (en) * | 1985-07-10 | 1987-01-21 | Bunshiyoudou:Kk | Method and equipment for transferring stacked blanks to printing blank supply section |
-
1981
- 1981-07-10 JP JP10777981A patent/JPS5810338A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6212540A (en) * | 1985-07-10 | 1987-01-21 | Bunshiyoudou:Kk | Method and equipment for transferring stacked blanks to printing blank supply section |
| JPH0241502B2 (en) * | 1985-07-10 | 1990-09-18 |
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