JPS5857214A - Lead switch - Google Patents

Lead switch

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Publication number
JPS5857214A
JPS5857214A JP15463181A JP15463181A JPS5857214A JP S5857214 A JPS5857214 A JP S5857214A JP 15463181 A JP15463181 A JP 15463181A JP 15463181 A JP15463181 A JP 15463181A JP S5857214 A JPS5857214 A JP S5857214A
Authority
JP
Japan
Prior art keywords
reed switch
contact
lead
present
approximately
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15463181A
Other languages
Japanese (ja)
Inventor
章 田中
茂 斉藤
馬場 正典
近藤 恭英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15463181A priority Critical patent/JPS5857214A/en
Publication of JPS5857214A publication Critical patent/JPS5857214A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は接点位置がガラス管の中央からその長手方向へ
右側或は左側へ位置ずれしたオフセット型のリードスイ
ッチに関する。この種リードスイッチの一般的構造を第
1図に示す。図において、1はガラス管、2,3は磁性
材料例えば52アロイ(Ni :529be Fe:4
8%)からなる長片側および短片側リードであシ、該リ
ード2,3の先端部を互に一定間隔離(ギャップ)して
対向(オーバーラツプ)させた接点部4がガラス管1内
に封入されている。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an offset type reed switch in which the contact position is shifted from the center of the glass tube to the right or left side in the longitudinal direction thereof. The general structure of this type of reed switch is shown in FIG. In the figure, 1 is a glass tube, 2 and 3 are magnetic materials such as 52 alloy (Ni: 529be Fe: 4
A contact portion 4 is enclosed in a glass tube 1, with the tips of the leads 2 and 3 facing each other (overlapping) with a certain distance (gap) between them. has been done.

そして、図示の如く接点部4はガラス管1の中央部よシ
その長手方向に右側或は左側に位置ずれし片寄りて位置
しておシ、外部磁界の有無によ)接点部4でリード2,
3が磁気吸着或は離間し接点電流の開閉を行なう。
As shown in the figure, the contact part 4 is shifted from the center of the glass tube 1 to the right or left side in the longitudinal direction of the glass tube 1. 2,
3 is magnetically attracted or separated to open and close the contact current.

ところで、従来のオフセット型リードスイッチにおいて
は通常のリードスイッチと同様に、リード2,3の接点
を両方ともRh(*ジウム)、Rh(ルテニウム)等の
硬質貴金属とするが、或はAu(金)tA、(銀)等の
軟質貴金属としていた。ところが、前者においては長寿
命接点が得られる反■硬質であるため接点同士の接触面
積が小さくな夛接触抵抗が大きい欠点を持つ。1九後者
においては軟質のため接点同士の接触面積は大きくな)
接触抵抗の小さいものが得られる反面、開閉動作が増え
るに従りて接点の粘着を生じ長寿命なものが得られない
欠点がある。
By the way, in a conventional offset type reed switch, the contacts of leads 2 and 3 are both made of hard precious metals such as Rh (*dium) and Rh (ruthenium), or Au (gold), as in a normal reed switch. )tA, (silver) and other soft noble metals. However, the former has the disadvantage of providing a long-life contact, but because it is hard, the contact area between the contacts is small and the contact resistance is large. 19 In the latter case, the contact area between the contacts is large because it is soft.)
Although a product with low contact resistance can be obtained, it has the disadvantage that as the number of opening and closing operations increases, the contacts tend to stick, making it impossible to obtain a long-life product.

本発明はこのよう麦相反する問題を簡易に解決させるも
ので、以下本実施例を第2図と第3図によシ説明する。
The present invention is intended to easily solve these contradictory problems, and the present embodiment will be explained below with reference to FIGS. 2 and 3.

本発明に係るリードスイッチでは第2図の側断面図にそ
の接点部4を拡大して示す如く、短片側リード2の先端
表面に硬質貴金属であるRhめつき層5が、長片側リー
ド3の先端表面には軟質貴金属であるAuめつき層6が
形成されている0ま九、Rhめりき層5の下層には下地
とな−るAssめうき層7が形成されておシ、Auめり
き層6の下層には下地となり且つリード3自体のAuめ
りき層6への拡散を防ぐためのCu(銅)め91&層8
が形成されている0 次に本発明に係るリードスイッチと従来のものとの接点
性能試験結果を第3図により説明する。
In the reed switch according to the present invention, as shown in an enlarged view of the contact portion 4 in the side cross-sectional view of FIG. An Au plating layer 6 made of a soft precious metal is formed on the tip surface, and an Ass plating layer 7 as a base is formed below the Rh plating layer 5. Below the plated layer 6 is a Cu (copper) plated layer 91 and layer 8 which serves as a base and prevents the lead 3 itself from diffusing into the Au plated layer 6.
0 Next, the results of a contact performance test between the reed switch according to the present invention and a conventional one will be explained with reference to FIG.

第3図において、縦軸(対数目盛)は接触抵抗不良率、
横軸はスクリーニング回数(試験回数)であシ、この試
験によって製造されたリードスイッチの抵抗不良の割合
および何回スクリーニングを行なえば不良リードスイッ
、チが排除できるかがわかる。
In Figure 3, the vertical axis (logarithmic scale) is the contact resistance defective rate,
The horizontal axis is the number of screenings (number of tests), and this test shows the proportion of resistance defects in manufactured reed switches and how many times screening must be performed to eliminate defective reed switches.

図中、破線Aは本発明に係るリードスイッチの特性で、
これは短片側リード2がその先端表面に先ず約0.5−
禦程度の厚さで下地のAuめりき層7を形成し、この上
に接点表面となるRhめっき層5を約2μ郷程度の厚さ
で形成したものからなる。
In the figure, the broken line A is the characteristic of the reed switch according to the present invention,
This means that the short lead 2 is first attached to its tip surface by approximately 0.5-
A base Au plating layer 7 is formed to a thickness of approximately 2 μm thick, and a Rh plating layer 5 serving as a contact surface is formed thereon to a thickness of approximately 2 μm.

また長片側リード3はその先端表面に先ず約0.5声m
程度の厚さで下地のCuめつき層8を形成し、この上に
接点表面となるAuめりき層6を約2.5声簿厚さで形
成し、しかる後これを水素雰囲気中で熱拡散処理(60
0℃〜900℃好ましくは700℃〜800℃で15分
間程度)してAu−Cu合金にして製作したものでらる
。二点鎖線Bも本発明に係るリードスイッチの特性で、
これ社破線Aの場合と長片側リード3に直接Auめつき
層6を形成1.Cuめりき層8を除去した場合である。
In addition, the long side lead 3 has a tip surface of approximately 0.5 m.
A base Cu plating layer 8 is formed to a thickness of approximately 2.5 mm, and then an Au plating layer 6, which will become the contact surface, is formed to a thickness of approximately 2.5 mm, and then this is heated in a hydrogen atmosphere. Diffusion treatment (60
The Au--Cu alloy is manufactured by heating at 0° C. to 900° C., preferably at 700° C. to 800° C. for about 15 minutes. The two-dot chain line B is also a characteristic of the reed switch according to the present invention,
In the case of dashed line A, the Au plating layer 6 is formed directly on the long lead 3.1. This is a case where the Cu plated layer 8 is removed.

一点鎖線Cは従来リードスイッチの特性で、これは破#
人の場合と逆すなわち短片側リード2KCmめクキ層8
(0,5,am厚)−Atsめりき層6(25μ亀厚)
を形成して熱拡散し、長片側リード3にはAuめりき層
7(0,5jIIK厚)−Rhめりき層5(2sIII
厚)を形成したものである0実線りも従来リードスイッ
チの場性で、これは短片側リード2と長片側リード3の
先端表面を共にAuめつき層7(0,5j講厚)−Rh
めっき層5(2μ解厚)に形成したものである。
The dashed line C is the characteristic of the conventional reed switch, which is broken #
Contrary to the case of humans, that is, short one-side lead 2KCm, Kiki layer 8
(0,5, am thickness) - Ats plated layer 6 (25μ thickness)
The long side lead 3 has an Au plated layer 7 (0,5jIIK thickness) and a Rh plated layer 5 (2sIIIK thickness).
The 0 solid line (thickness) is also a characteristic of conventional reed switches, and this is because both the end surfaces of the short lead 2 and the long lead 3 are coated with an Au plating layer 7 (0,5j thickness) - Rh.
It is formed on the plating layer 5 (2μ thick).

また、上述したリード2,3により第1図の如きオフセ
ット型リードスイッチを同一形状で4s類各々1000
個ずつ製作した。
In addition, by using the above-mentioned leads 2 and 3, an offset type reed switch as shown in Fig. 1 can be made with the same shape and 4s class 1000 each.
Manufactured one by one.

このリードスイッチの形状は、長片側および短片側リー
ド2,3が長さ約29町直径約0.56−の527四イ
線材を潰し加工したもので、ガラス管1は長さ約15■
、直径2.7−であ夛、長片側リード3のガラス管1内
での長さは約11町短片側リード2は約4■であるO また接点g4のギャップ量は0.04m++、オーパー
ラVプ量は0.31であった0 そしてこのようなリードスイッチを接点負荷5V−10
mAの条件下で所定数開閉させた後に第1回目の接触抵
抗測定を行ない、この際150saΩ以上のリードスイ
ッチを不良品と判定して除去し第1回スクリーニングを
完了させ、次に残うた良品リードスイッチを再度所定数
開閉動作させて不要品を除去しく第2回スクリーニング
)、その後更に!!lりた良品リードスイッチを再々度
第3回目のスクリーニングを行なった結果が第3図の特
性であるO 以上の実験結果より明らかな如く、本発明に係るリード
スイッチ(Al  n)は従来(ct D)に比べ抵触
抵抗不良率が小さく良品リードスイッチを歩留シ良く製
作できるofた、本発明に係るリードスイッチ(At 
 n)は接点寿命も接点開閉数が10f回1度と従来の
Rh−Rh接点(Dのリードスイッチ)とほぼ同S度の
接点寿命をもりていたO  ・更に1従来例としてAu
−An接点のリードスイッチについては第3図に図示さ
れていないが、これは本発明リードスイッチよシ若干抵
触抵抗不良率は小さいが、その反面接点寿命は1710
0以下である。
The shape of this reed switch is that the long and short leads 2 and 3 are made by crushing 527 mm wire with a length of approximately 29 mm and a diameter of approximately 0.56 mm, and the glass tube 1 is approximately 15 mm in length.
The length of the long lead 3 in the glass tube 1 is approximately 11 mm, and the short lead 2 is approximately 4 cm in diameter. The amount of V pull was 0.310.
After opening and closing a predetermined number of times under mA conditions, the first contact resistance measurement is performed, and at this time, reed switches with a value of 150 saΩ or more are determined to be defective and removed, completing the first screening, and the remaining non-defective products are removed. Open and close the reed switch again for a predetermined number of times to remove unnecessary items (2nd screening), and then further! ! The results of a third screening of the good quality reed switches were shown in Figure 3.As is clear from the above experimental results, the reed switch (Al The reed switch according to the present invention (At
n) had a contact life of 10f times, which is almost the same as the conventional Rh-Rh contact (D reed switch). ・One more conventional example is Au.
- Although the reed switch with an An contact is not shown in FIG. 3, it has a slightly lower failure rate due to contact resistance than the reed switch of the present invention, but its reverse contact life is 1710.
It is less than or equal to 0.

以上本発明によるリードスイッチでは接触抵抗不良率が
小さく且つ長寿命なものが得られ、その夾用上の効果は
著しいものである〇 尚、上記実施例ではAu−Rh(1)組合せについて示
したが、本発明はこねに限犀されるものではなく、短片
側リードをRu等の硬質貴金属とし長片側リードをA 
t s  Cu等の軟質金轡で形成しても良い。
As described above, the reed switch according to the present invention has a low contact resistance failure rate and a long service life, and the effect on its use is remarkable.In addition, in the above example, the Au-Rh (1) combination was shown. However, the present invention is not limited to kneading, and the short lead is made of a hard precious metal such as Ru, and the long lead is made of A.
It may also be formed of soft metal such as tsCu.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明で対象とするオフセット型リードスイッ
チの一般的構造を示す側面図、第2図は本発明に係るリ
ードスイッチ接点部の拡大11断面図、第3図は本発明
リードスイッチと従来の接触抵抗不良の測定結宋を示す
0性図である。 〔符号の説明〕 2・・・・・・・・・短片側リード、3・・・・・・・
・・長片側リード4・・・・・・・・・接点部、5・・
・・・・・・・Rh層、6・・・・・・・・・Au層第
 1 図 今 第2図
Fig. 1 is a side view showing the general structure of the offset type reed switch to which the present invention applies, Fig. 2 is an enlarged 11 cross-sectional view of the reed switch contact portion according to the present invention, and Fig. 3 is a cross-sectional view showing the reed switch of the present invention. FIG. 2 is a graph showing a conventional measurement result of poor contact resistance; [Explanation of symbols] 2・・・・・・・Short one side lead, 3・・・・・・・・・
...Long side lead 4...Contact part, 5...
・・・・・・Rh layer, 6・・・・・・Au layer 1st figure now 2nd figure

Claims (3)

【特許請求の範囲】[Claims] (1)長片側リードの接点をAu、Af、Cu等の軟質
金属とし、短片側リードの接点をRh、Ru等の硬質貴
金属としたことを特徴とするオフセット型のリードスイ
ッチ。
(1) An offset type reed switch characterized in that the contact point of the long side lead is made of a soft metal such as Au, Af, or Cu, and the contact point of the short side lead is made of a hard precious metal such as Rh or Ru.
(2)前記軟質金属をAuとし、前記硬質貴金属を仇と
したことを特徴とする特許請求の範囲第(1)項記載の
リードスイッチ。
(2) The reed switch according to claim (1), wherein the soft metal is Au and the hard noble metal is the enemy.
(3)前記Auの下地層をCuめりきとし、 これを熱
拡散処理してなることを特徴とする特許請求の範囲第Q
)項記載のリードスイッチ。
(3) Claim Q, characterized in that the Au base layer is Cu-plated and subjected to thermal diffusion treatment.
) Reed switch listed in section.
JP15463181A 1981-09-29 1981-09-29 Lead switch Pending JPS5857214A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15463181A JPS5857214A (en) 1981-09-29 1981-09-29 Lead switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15463181A JPS5857214A (en) 1981-09-29 1981-09-29 Lead switch

Publications (1)

Publication Number Publication Date
JPS5857214A true JPS5857214A (en) 1983-04-05

Family

ID=15588411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15463181A Pending JPS5857214A (en) 1981-09-29 1981-09-29 Lead switch

Country Status (1)

Country Link
JP (1) JPS5857214A (en)

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