JPS6326908A - Lead switch - Google Patents
Lead switchInfo
- Publication number
- JPS6326908A JPS6326908A JP17051686A JP17051686A JPS6326908A JP S6326908 A JPS6326908 A JP S6326908A JP 17051686 A JP17051686 A JP 17051686A JP 17051686 A JP17051686 A JP 17051686A JP S6326908 A JPS6326908 A JP S6326908A
- Authority
- JP
- Japan
- Prior art keywords
- reed switch
- contact
- present
- plating
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000014676 Phragmites communis Nutrition 0.000 claims description 24
- 238000007772 electroless plating Methods 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 239000000696 magnetic material Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 claims 1
- 239000010948 rhodium Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 230000001186 cumulative effect Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 229910000521 B alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Contacts (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はリードスイッチに関し、特に通信機用。[Detailed description of the invention] [Industrial application field] The present invention relates to a reed switch, particularly for communication devices.
家庭電器用リレーや磁気近接スイッチとして使用され、
接点により電流の開閉を行うリードスイッチに関する。Used as home appliance relays and magnetic proximity switches,
This invention relates to reed switches that open and close current through contacts.
従来、この種のリードスイッチは、接点として金（Ａｕ
）、銀（Ａｇ＞、ルテニウム（Ｒｕ）。Conventionally, this type of reed switch uses gold (Au) as the contact point.
), silver (Ag>, ruthenium (Ru).
ロジウム（Ｒｈ）などの貴金属を電解めっきによりリー
ド片上の接点部に形成し、単体または加熱処理によりリ
ード片材料と拡散させて使用していた。Noble metals such as rhodium (Rh) have been formed on the contact portions on the lead pieces by electrolytic plating, and used alone or by being diffused with the lead piece material by heat treatment.
上述した従来のリードスイッチは、接点として貴金属を
使用しているため高価となる。また、硬さの点ではＡｕ
、Ａｇ、Ｒｈがビッカース硬度でそれぞれ２０〜６０．
２６〜７０．１００、Ｒｕのそれは２４０となっており
、リードスイ・ソチを高速で多数回動作させると、接点
の衝突エネルギーにより接点金属が移動して表面の平滑
性が失われ、開離不能となるという欠点がある。The conventional reed switch described above is expensive because it uses precious metals as contacts. In addition, in terms of hardness, Au
, Ag, and Rh each have a Vickers hardness of 20 to 60.
26 to 70.100, and that of Ru is 240. When the Reed Sui Sochi is operated at high speed many times, the contact metal moves due to the collision energy of the contact, and the surface smoothness is lost, making it impossible to open. It has the disadvantage of becoming.
本発明のリードスイッチは、リードスイッチの接点部分
に無電解めっきにより形成したニッケル（Ｎ ｉ ）−
タングステン’（Ｗ）（５〜４０％）−ホウ素（Ｂ）（
１〜５ ％ ）の組成の合金層を０゜５ノ１〜７μの厚
さで有している。The reed switch of the present invention has nickel (N i ) formed on the contact portion of the reed switch by electroless plating.
Tungsten' (W) (5-40%) - Boron (B) (
The alloy layer has a composition of 1 to 5%) and has a thickness of 0.5 to 1 to 7 microns.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示すリードスイッチ接点部
の拡大断面図、第２図は本発明の一適用例を示すリード
スイッチの側面図、第３図はＮ１−Ｗ−Ｂ無電解めっき
に際しＷの成分比を展開したときのビッカース硬度の変
化を示す図、第４図はＮ１−Ｗ−Ｂ無電解めっきに際し
Ｂの成分比を展開したときの１μ当たりのめっき時間の
関係を示す図、第５図は本発明のリードスイッチの接点
と、従来のリードスイッチのＲｈ接点との動作回数と累
積開離障害発生率を比較して示す特性図、第６図は本発
明により接点を用いたリードスイッチの動作回数と接触
抵抗の変化を示す特性図である。Fig. 1 is an enlarged sectional view of a reed switch contact portion showing an embodiment of the present invention, Fig. 2 is a side view of a reed switch showing an application example of the present invention, and Fig. 3 is an N1-W-B electroless Figure 4 shows the change in Vickers hardness when the component ratio of W is expanded during plating. Figure 4 shows the relationship between plating time per 1μ when the component ratio of B is expanded during N1-W-B electroless plating. Fig. 5 is a characteristic diagram comparing the number of operations and cumulative opening failure occurrence rate of the contact of the reed switch of the present invention and the Rh contact of a conventional reed switch, and Fig. 6 is a characteristic diagram showing the number of operations and cumulative opening failure occurrence rate of the contact of the reed switch of the present invention and the Rh contact of the conventional reed switch. It is a characteristic diagram showing the number of operations of the reed switch used and the change in contact resistance.
第２図に示すようにリードスイッチは磁性体、通常鉄（
Ｆｅ）−Ｎｉ合金から成る２本のリード片２を不活性ガ
ス４と共にガラス容器１内に封じて構成され、外部から
磁界を加えることにより接点部３で接点の開閉が行われ
る。As shown in Figure 2, reed switches are made of magnetic material, usually iron (
It is constructed by sealing two lead pieces 2 made of Fe)--Ni alloy in a glass container 1 together with an inert gas 4, and the contacts are opened and closed at the contact portion 3 by applying a magnetic field from the outside.
第１図に拡大して示したように、２本のリード片２の各
先端部にはＮ１−Ｗ−Ｂ合金めつき層５が無電解めっき
により形成されて接点部３を成している。As shown in an enlarged view in FIG. 1, a N1-W-B alloy plating layer 5 is formed on each tip of the two lead pieces 2 by electroless plating to form a contact portion 3. .
続いて本実施例および適用例の測定結果について第３図
〜第６図を参照して説明する。Next, the measurement results of this example and application examples will be explained with reference to FIGS. 3 to 6.
まず、本実施例においてＮ１−Ｗ（２７重量％）−Ｂ
（３，４重量％〉の無電解めっき膜を２μ形成されたと
きのビ・ソカース硬度は第３図に示すように４００〜５
００である。この無電解めっき膜のＷの成分比を５％未
満とするとビッカース硬度は２００となり、Ｒｕ単体を
下回る。また、Ｗが４０％を上回ると無電解めっき膜に
割れが生じる。First, in this example, N1-W (27% by weight)-B
When 2 μm of electroless plating film (3.4% by weight) is formed, the Bi-Socas hardness is 400-5 as shown in Figure 3.
It is 00. If the component ratio of W in this electroless plated film is less than 5%, the Vickers hardness will be 200, which is lower than Ru alone. Moreover, when W exceeds 40%, cracks occur in the electroless plated film.
一方第４図に示すようにＢは成分比が１〜５重量％の範
囲ではめつきに要する時間は１μ当たり３〜１０分であ
るが、１％未満または５％を超えるとめっき時間が大き
くなり実用的でない。On the other hand, as shown in Figure 4, when the component ratio of B is in the range of 1 to 5% by weight, the time required for plating is 3 to 10 minutes per 1μ, but when it is less than 1% or more than 5%, the plating time is longer. It's not practical.
次に本発明を用いたリードスイッチの特性について説明
する。第５図は無負荷において動作させた場合の接点の
累積開離障害発生率を示しており、本発明のＮ１−Ｗ−
Ｂ接点の障害発生率は従来のＲｈ接点のそれの約１／１
０であることが分かる。Next, the characteristics of the reed switch using the present invention will be explained. FIG. 5 shows the cumulative occurrence rate of opening failures of the contacts when operated under no load, and shows the cumulative occurrence rate of opening failures of the contacts when operated under no load.
The failure rate of B contacts is approximately 1/1 of that of conventional Rh contacts.
It turns out that it is 0.
また、第６図から分かるように、本発明のリードスイッ
チの接点接触抵抗は２×ｌＯｑ回動作後においても極め
て安定であった。Furthermore, as can be seen from FIG. 6, the contact resistance of the reed switch of the present invention was extremely stable even after 2×1Oq operations.
以上説明したように本発明は、接点部にＮ１−Ｗ（５〜
４０％）−Ｂ（１〜５％）の組成の合金層を無電解めっ
きによりＯ９５〜７μの厚さで形成することにより、従
来の貴金属接点より安価に、且つより長寿命のリードス
イッチを実現できる効果がある。As explained above, the present invention has N1-W (5 to 5) in the contact portion.
By forming an alloy layer with a composition of 40%)-B (1 to 5%) to a thickness of O95 to 7μ by electroless plating, we have realized a reed switch that is cheaper and has a longer life than conventional noble metal contacts. There is an effect that can be done.
第１図は本発明の一実施例を示すリードスイッチ接点部
の拡大断面図、第２図は本発明の一適用例を示すリード
スイッチの側面図、第３図はＮｉ−ｗ−ｙｓｇ電解めっ
きに際しＷの成分比を展開したときのビッカース硬度の
変化を示す図、第４図はＮ１−Ｗ−Ｂ無電解めっきに際
しＢの成分比を展開したときの１μ当たりのめっき時間
の関係を示す図、第５図は本発明のリードスイッチの接
点と、従来のリードスイッチのＲｈ接点との動作回数と
累積開離障害率を比較して示す特性図、第６図は本発明
による接点を用いたり一ドスイ・ソチの動作回数と接触
抵抗の変化を示す特性図である。
１・・・ガラス容器、２・・・リード片、３・・・接点
部、４・・・不活性ガス、５・・・Ｎ１−Ｗ−Ｂ合金め
っき層。Fig. 1 is an enlarged sectional view of a reed switch contact portion showing an embodiment of the present invention, Fig. 2 is a side view of a reed switch showing an application example of the present invention, and Fig. 3 is a Ni-w-ysg electrolytic plating. Fig. 4 is a diagram showing the change in Vickers hardness when the component ratio of W is developed during N1-W-B electroless plating, and Figure 4 is a diagram showing the relationship between plating time per 1 μ when the component ratio of B is developed during N1-W-B electroless plating. , FIG. 5 is a characteristic diagram comparing the number of operations and cumulative failure rate of the Rh contact of the reed switch of the present invention and the Rh contact of a conventional reed switch, and FIG. It is a characteristic diagram showing the number of times of one-do-sui-sochi operation and the change in contact resistance. DESCRIPTION OF SYMBOLS 1... Glass container, 2... Lead piece, 3... Contact part, 4... Inert gas, 5... N1-W-B alloy plating layer.
Claims (1)
容器内に封じ外部から与えられた磁界により接点を開閉
する機能を有するリードスイッチにおいて、前記接点部
分にニッケル−タングステン（５〜４０％）−ホウ素（
１〜５％）の組成の合金層を０．５μ〜７μの厚さで無
電解めっきにより形成されたことを特徴とするリードス
イッチ。In a reed switch that has the function of sealing two or more reed pieces made of a magnetic material in a container together with an inert gas and opening and closing the contacts by a magnetic field applied from the outside, the contact portion is made of nickel-tungsten (5 to 40%). −Boron (
1. A reed switch characterized in that an alloy layer having a composition of 1% to 5%) is formed by electroless plating to a thickness of 0.5μ to 7μ.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17051686A JPS6326908A (en) | 1986-07-18 | 1986-07-18 | Lead switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17051686A JPS6326908A (en) | 1986-07-18 | 1986-07-18 | Lead switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6326908A true JPS6326908A (en) | 1988-02-04 |
Family
ID=15906390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17051686A Pending JPS6326908A (en) | 1986-07-18 | 1986-07-18 | Lead switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6326908A (en) |
-
1986
- 1986-07-18 JP JP17051686A patent/JPS6326908A/en active Pending
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