JPS51114862A - Semiconductor wafer separation method - Google Patents
Semiconductor wafer separation methodInfo
- Publication number
- JPS51114862A JPS51114862A JP3908575A JP3908575A JPS51114862A JP S51114862 A JPS51114862 A JP S51114862A JP 3908575 A JP3908575 A JP 3908575A JP 3908575 A JP3908575 A JP 3908575A JP S51114862 A JPS51114862 A JP S51114862A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- separation method
- wafer separation
- semiconductor
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: Semiconductor wafers are split without semiconductor fragments, which generate when scribing wafers, flying over semiconductor wafers.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3908575A JPS51114862A (en) | 1975-04-02 | 1975-04-02 | Semiconductor wafer separation method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3908575A JPS51114862A (en) | 1975-04-02 | 1975-04-02 | Semiconductor wafer separation method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51114862A true JPS51114862A (en) | 1976-10-08 |
Family
ID=12543238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3908575A Pending JPS51114862A (en) | 1975-04-02 | 1975-04-02 | Semiconductor wafer separation method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51114862A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009173019A (en) * | 2007-12-26 | 2009-08-06 | Mitsubishi Materials Corp | Apparatus and method for manufacturing divided body |
-
1975
- 1975-04-02 JP JP3908575A patent/JPS51114862A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009173019A (en) * | 2007-12-26 | 2009-08-06 | Mitsubishi Materials Corp | Apparatus and method for manufacturing divided body |
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