JPS51114862A - Semiconductor wafer separation method - Google Patents

Semiconductor wafer separation method

Info

Publication number
JPS51114862A
JPS51114862A JP3908575A JP3908575A JPS51114862A JP S51114862 A JPS51114862 A JP S51114862A JP 3908575 A JP3908575 A JP 3908575A JP 3908575 A JP3908575 A JP 3908575A JP S51114862 A JPS51114862 A JP S51114862A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
separation method
wafer separation
semiconductor
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3908575A
Other languages
Japanese (ja)
Inventor
Senji Shoji
Yukio Murayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3908575A priority Critical patent/JPS51114862A/en
Publication of JPS51114862A publication Critical patent/JPS51114862A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: Semiconductor wafers are split without semiconductor fragments, which generate when scribing wafers, flying over semiconductor wafers.
COPYRIGHT: (C)1976,JPO&Japio
JP3908575A 1975-04-02 1975-04-02 Semiconductor wafer separation method Pending JPS51114862A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3908575A JPS51114862A (en) 1975-04-02 1975-04-02 Semiconductor wafer separation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3908575A JPS51114862A (en) 1975-04-02 1975-04-02 Semiconductor wafer separation method

Publications (1)

Publication Number Publication Date
JPS51114862A true JPS51114862A (en) 1976-10-08

Family

ID=12543238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3908575A Pending JPS51114862A (en) 1975-04-02 1975-04-02 Semiconductor wafer separation method

Country Status (1)

Country Link
JP (1) JPS51114862A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009173019A (en) * 2007-12-26 2009-08-06 Mitsubishi Materials Corp Apparatus and method for manufacturing divided body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009173019A (en) * 2007-12-26 2009-08-06 Mitsubishi Materials Corp Apparatus and method for manufacturing divided body

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