JPS52146558A - Production of beam lead type semiconductor device - Google Patents
Production of beam lead type semiconductor deviceInfo
- Publication number
- JPS52146558A JPS52146558A JP6320076A JP6320076A JPS52146558A JP S52146558 A JPS52146558 A JP S52146558A JP 6320076 A JP6320076 A JP 6320076A JP 6320076 A JP6320076 A JP 6320076A JP S52146558 A JPS52146558 A JP S52146558A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- type semiconductor
- beam lead
- lead type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To perform high-precision processing of beam lead semiconductor devices without undergoing slicing of semiconductor wafers and pelletizing and separating works from the rear of the wafers.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6320076A JPS52146558A (en) | 1976-05-31 | 1976-05-31 | Production of beam lead type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6320076A JPS52146558A (en) | 1976-05-31 | 1976-05-31 | Production of beam lead type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52146558A true JPS52146558A (en) | 1977-12-06 |
Family
ID=13222325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6320076A Pending JPS52146558A (en) | 1976-05-31 | 1976-05-31 | Production of beam lead type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52146558A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06339403A (en) * | 1992-12-02 | 1994-12-13 | Yoshio Suginohara | Necktie lock pin |
US7550317B2 (en) | 2002-02-13 | 2009-06-23 | Samsung Electronics Co., Ltd. | Method for manufacture of wafer level package with air pads |
-
1976
- 1976-05-31 JP JP6320076A patent/JPS52146558A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06339403A (en) * | 1992-12-02 | 1994-12-13 | Yoshio Suginohara | Necktie lock pin |
US7550317B2 (en) | 2002-02-13 | 2009-06-23 | Samsung Electronics Co., Ltd. | Method for manufacture of wafer level package with air pads |
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