JPS52129372A - Pelletizing method for semiconductor wafers - Google Patents

Pelletizing method for semiconductor wafers

Info

Publication number
JPS52129372A
JPS52129372A JP4702776A JP4702776A JPS52129372A JP S52129372 A JPS52129372 A JP S52129372A JP 4702776 A JP4702776 A JP 4702776A JP 4702776 A JP4702776 A JP 4702776A JP S52129372 A JPS52129372 A JP S52129372A
Authority
JP
Japan
Prior art keywords
semiconductor wafers
pelletizing method
wafer
pelletizing
scribing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4702776A
Other languages
Japanese (ja)
Inventor
Koichi Oguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP4702776A priority Critical patent/JPS52129372A/en
Publication of JPS52129372A publication Critical patent/JPS52129372A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To divide a wafer to pellets of a rectangular parallelepiped through the use of a dicing saw by using a wafer support which permits scribing down to the rear of the semiconductor wafer.
COPYRIGHT: (C)1977,JPO&Japio
JP4702776A 1976-04-23 1976-04-23 Pelletizing method for semiconductor wafers Pending JPS52129372A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4702776A JPS52129372A (en) 1976-04-23 1976-04-23 Pelletizing method for semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4702776A JPS52129372A (en) 1976-04-23 1976-04-23 Pelletizing method for semiconductor wafers

Publications (1)

Publication Number Publication Date
JPS52129372A true JPS52129372A (en) 1977-10-29

Family

ID=12763683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4702776A Pending JPS52129372A (en) 1976-04-23 1976-04-23 Pelletizing method for semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS52129372A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543829A (en) * 1978-09-21 1980-03-27 Fujitsu Ltd Method of treatment of semiconductor substrate
JPS58169936A (en) * 1982-03-30 1983-10-06 Nec Home Electronics Ltd Dicing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543829A (en) * 1978-09-21 1980-03-27 Fujitsu Ltd Method of treatment of semiconductor substrate
JPS58169936A (en) * 1982-03-30 1983-10-06 Nec Home Electronics Ltd Dicing method

Similar Documents

Publication Publication Date Title
JPS5395571A (en) Semiconductor device
JPS52129372A (en) Pelletizing method for semiconductor wafers
JPS5424571A (en) Manufacture for semiconductor wafer
JPS5230167A (en) Method for production of semiconductor device
JPS5441665A (en) Manufacture for semiconductor device
JPS54984A (en) Containing tool for semiconductor wafer
JPS524175A (en) Groups iii-v compounds semiconductor device
JPS5242365A (en) Tool for semiconductors
JPS5215269A (en) Method of manufacturing semiconductor pellets
JPS52138873A (en) Automatic positioning method of semiconductor pellets
JPS5519847A (en) Deviding method of semiconductor wafer
JPS52146558A (en) Production of beam lead type semiconductor device
JPS5355960A (en) Breaking method for semiconductor wafer
JPS5276872A (en) Cutting method of semiconductor wafer
JPS52140275A (en) Processing method for semiconductor wafer
JPS52134387A (en) Semiconductor laser device
JPS5314553A (en) Isolating method of rigid fragile plate
JPS5372567A (en) Semiconductor device
JPS53102669A (en) Manufacture for semiconductor device
JPS5270753A (en) Wafer for semiconductor device
JPS5211761A (en) Method of cutting semiconductor wafers
JPS532072A (en) Manufacture of semiconductor
JPS5422157A (en) Formation method of selective impurity diffusion region into iii-v group compound semiconductor
JPS52117058A (en) Cutting method of semiconductor wafer
JPS5286775A (en) Bebeling method for semiconductor substrate